Taiwan Semiconductor Corporation MBRS3045CT
- Part No.:
- MBRS3045CT
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Diode Arrays
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
MBRS3045CT.pdf
- Description:
- DIODE ARR SCHOTT 45V 30A TO263AB
- Quantity:
- Payment:

- Shipping:

Inventory:7,129
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MBRS3045CT from Taiwan Semiconductor is a dual-die Schottky barrier rectifier in TO-263AB (D2PAK) package, rated for 30A average forward current, 45V repetitive peak reverse voltage, and 220A non-repetitive surge current; it delivers low forward voltage (0.70 V typ. @ 15 A, 25°C) and operates up to 150°C junction temperature, enabling high-efficiency power conversion in compact SMPS designs.
For engineers reviewing the MBRS3045CT datasheet, MBRS3045CT pinout, MBRS3045CT application, or MBRS3045CT equivalent, key selection criteria include thermal resistance (RθJC = 1.5°C/W), moisture sensitivity level (MSL 1), RoHS/halogen-free compliance, and dual-die configuration supporting common-cathode parallel operation in DC-DC converters and AC adapters.
Technical Context
The MBRS3045CT integrates two independent Schottky diodes in a single TO-263AB thermally optimized package with matte tin-plated leads and UL 94V-0 molding compound. Its guard ring structure enhances overvoltage ruggedness while maintaining fast switching and low conduction loss.
Designed for high-current, high-frequency rectification, it supports pulse widths down to 300 µs (1% duty cycle) and exhibits low reverse recovery charge (implied by Schottky architecture), with reverse leakage limited to 200 µA at 25°C and 15 mA at 125°C under rated VR.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| IF (Avg) | 30 A - Sustains continuous output current in high-power SMPS secondary-side rectification |
| VRRM | 45 V - Withstands peak reverse voltage in 36 V nominal bus applications with safety margin |
| IFSM (8.3 ms) | 220 A - Handles inrush and transient surges without failure in adapter and converter inputs |
| VF @ 30A, 25°C | 0.90 V max - Minimizes conduction loss and heat generation at full load |
| RθJC | 1.5 °C/W - Enables efficient heat transfer to heatsink or PCB copper in surface-mount layout |
| TJ max | +150 °C - Supports operation in thermally constrained industrial and enclosed power supplies |
| MSL Level | Level 1 - Allows unlimited floor life and standard reflow without baking preconditioning |
Pinout & Package
Package: TO-263AB (D2PAK), 3-terminal surface-mount case with exposed anode/cathode tab for thermal and electrical performance. Cathode marked with band on top surface; polarity follows standard dual common-cathode configuration.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Anode A) | Anode of Diode A | Connects to input/switch node; electrically isolated from Pin 2 and Pin 3 |
| Pin 2 (Cathode) | Common cathode | Shared output node for both diodes; primary thermal path to PCB copper pour |
| Pin 3 (Anode B) | Anode of Diode B | Enables dual-channel or interleaved rectification; independent from Pin 1 |
Key Features
| Feature | Design Value |
|---|---|
| Guard ring protection | Improves dv/dt capability (10,000 V/µs) and prevents premature breakdown under voltage transients |
| Low RθJC | 1.5 °C/W enables >20 W dissipation with modest heatsinking in space-constrained layouts |
| Dual-die configuration | Supports redundant rectification or interleaved phase operation without external paralleling |
| Halogen-free & RoHS | Complies with IEC 61249-2-21 and EU Directive 2011/65/EU for environmentally regulated end equipment |
| Matte tin plating | Ensures reliable solder wetting per J-STD-002 and eliminates whisker risk per JESD201 Class 2 |
Applications
| Server Power Supply | Laptop Adapter |
|---|---|
Use Scenario: High-density 48 V–12 V intermediate bus conversion in rack-mounted servers. IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier replacement, operating at 200–500 kHz switching frequency. Use Value: Reduces conduction loss vs. silicon diodes, lowering thermal load on VRM PCB and improving system efficiency by ~1.2% at full load. | Use Scenario: Compact 65 W universal-input AC-DC adapter with foldback overcurrent protection. IC Role / Device Role / Timing Role: Output rectifier in flyback topology, handling 3.25 A continuous output at 20 V. Use Value: Enables smaller heatsink and higher power density due to 0.75 V VF max @ 30 A, 125°C. |
| Industrial DC-DC Converter | Telecom Power Module |
Use Scenario: 24 V input, 5 V/15 A isolated DC-DC module for PLC I/O modules. IC Role / Device Role / Timing Role: Primary output rectifier in forward converter, operating continuously at 65°C ambient. Use Value: Maintains <1.5 V total drop across dual diodes, minimizing voltage regulation error and thermal derating. | Use Scenario: Hot-swappable -48 V telecom rectifier board with redundancy support. IC Role / Device Role / Timing Role: OR-ing diode and output rectifier in N+1 redundant power architecture. Use Value: Dual-die structure allows independent channel control and fault isolation without discrete component duplication. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schottky rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-30CPH045 | Same 45 V VRRM, 30 A IF, but TO-247AC package; RθJC = 1.2°C/W, VF = 0.72 V max @ 30 A | Requires through-hole mounting and larger heatsink footprint; better thermal performance but lower automation compatibility | Prefer when board-level thermal management prioritizes RθJC over SMT assembly speed |
| ON Semiconductor MBR3045CT | Identical ratings and TO-263AB package; minor differences in IR (10 mA max @ 125°C vs. 15 mA) and marking format | No functional or layout impact; validated in same reference designs for adapter and SMPS use | Drop-in alternative with identical footprint, thermal profile, and qualification status for second-source assurance |
Compared with VS-30CPH045 and MBR3045CT, the MBRS3045CT offers optimal balance of SMT manufacturability (MSL 1, tape-and-reel), thermal performance (RθJC = 1.5°C/W), and reliability (guard ring, halogen-free), making it preferred for high-volume automated production of compact power supplies.
Availability
MBRS3045CT is available at Aetrix Electronics and suitable for switching mode power supplies, laptop adapters, and industrial DC-DC converters requiring stable component supply, long-term lifecycle support, and RoHS-compliant sourcing.
Supply support for MBRS3045CT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and power discrete manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.
The MBRS3045CT belongs to TSC's high-current Schottky rectifier product line, engineered specifically for high-efficiency, high-reliability secondary-side rectification in compact, thermally demanding power conversion systems.
FAQ
What is the maximum junction temperature rating for MBRS3045CT?
The MBRS3045CT has a maximum junction temperature (TJ) of +150°C, verified per absolute maximum ratings table. This allows sustained operation in high-ambient environments such as enclosed server PSUs or industrial enclosures. Derating curves confirm usable current capacity down to 15 A at 125°C case temperature. Thermal design must maintain TJ ≤ 150°C using the specified RθJC = 1.5°C/W and appropriate PCB copper area.
Does MBRS3045CT support automated SMT placement?
Yes, MBRS3045CT supports automated surface-mount placement per its TO-263AB (D2PAK) package and MSL Level 1 rating-meaning unlimited floor life and compatibility with standard lead-free reflow profiles without pre-baking. Matte tin-plated terminals ensure consistent solderability per J-STD-002, and the device is supplied in 800-unit tape-and-reel packaging optimized for pick-and-place machines.
What is the reverse leakage current specification for MBRS3045CT at elevated temperature?
At 125°C junction temperature and rated reverse voltage (45 V), the MBRS3045CT exhibits a maximum reverse leakage current (IR) of 15 mA per diode, as specified in the electrical characteristics table. At 25°C, leakage is limited to 200 µA. These values are measured under 30 ms pulse conditions and reflect typical Schottky behavior where leakage increases exponentially with temperature.
Is MBRS3045CT halogen-free and RoHS compliant?
Yes, MBRS3045CT is certified halogen-free per IEC 61249-2-21 and RoHS compliant per EU Directive 2011/65/EU. The molding compound contains no brominated flame retardants or chlorine-based additives, and all homogeneous materials meet the 0.1 wt% threshold for restricted substances. Full compliance documentation is available upon request from Taiwan Semiconductor.
How is the dual-die configuration of MBRS3045CT implemented electrically?
The MBRS3045CT contains two independent Schottky diodes sharing a common cathode terminal (Pin 2), with separate anodes (Pins 1 and 3). This common-cathode configuration enables parallel rectification, interleaved operation, or OR-ing functionality without external wiring. Each die is rated for 30 A average current and shares the same thermal path via the exposed cathode tab.
MBRS3045CT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Diode Configuration:
- 1 Pair Common Cathode
- Technology:
- Schottky
- Voltage - DC Reverse (Vr) (Max):
- 45 V
- Current - Average Rectified (Io) (per Diode):
- 30A
- Voltage - Forward (Vf) (Max) @ If:
- 900 mV @ 30 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 200 µA @ 45 V
- Operating Temperature - Junction:
- -55°C ~ 150°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263AB (D2PAK)
MBRS3045CT FAQ
1.How can I place an order for MBRS3045CT through Aetrix?
Please submit a Request for Quotation (RFQ) for MBRS3045CT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MBRS3045CT reliable?
The price and inventory of MBRS3045CT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MBRS3045CT is usually 5 days.
3.What payment methods are accepted for MBRS3045CT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MBRS3045CT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MBRS3045CT?
MBRS3045CT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MBRS3045CT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MBRS3045CT?
For technical support, including MBRS3045CT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MBRS3045CT requirements.
6.How does Aetrix verify that MBRS3045CT is sourced from the original manufacturer or authorized distributors?
All MBRS3045CT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MBRS3045CT meets industry standards.
7.What is the process for return or replacement of MBRS3045CT?
All MBRS3045CT units undergo pre-shipment inspection (PSI). If there is an issue with MBRS3045CT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MBRS3045CT part is unused and in its original packaging.
Return procedure for MBRS3045CT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MBRS3045CT Tags

-
BAV99-7-F
Diodes Incorporated

-
BAT54C-7-F
Diodes Incorporated

-
BAV99,215
Nexperia USA Inc.

-
BAT54SLT1G
onsemi

-
BAV70LT1G
onsemi

-
BAT54CLT1G
onsemi

-
BAT54S-7-F
Diodes Incorporated

-
BAV99LT1G
onsemi

-
BAT54S,215
Nexperia USA Inc.

-
BAS40-04LT1G
onsemi

-
MMBD1503-TP
Micro Commercial Co

-
BAV99WT1G
onsemi
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

