NXP Semiconductors MC13783JVK5R2
- Part No.:
- MC13783JVK5R2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 247-TFBGA
- Datasheet:
-
MC13783JVK5R2.pdf
- Description:
- IC PWR MGT AUD CIRCUIT 247MAPBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC13783JVK5R2 from Freescale Semiconductor is a highly integrated power management and audio IC for GSM/GPRS/EDGE/UMTS handsets, featuring dual 13-bit voice ADCs, 16-bit stereo DAC, four buck switchers (500 mA each), one boost switcher (350 mA), USB FS/LS transceiver with OTG support, and real-time clock with 32.768 kHz crystal oscillator. It serves as the central PMIC+audio hub in smartphones requiring compact system-level integration.
For engineers reviewing the MC13783JVK5R2 datasheet, MC13783JVK5R2 pinout, MC13783JVK5R2 application, or MC13783JVK5R2 equivalent, key selection considerations include dynamic voltage scaling (DVS) support across all four buck regulators, dual SPI interfaces with arbitration, integrated touchscreen interface with X/Y analog inputs, and simultaneous voice CODEC + stereo DAC operation via interchangeable SSI buses.
Technical Context
The MC13783JVK5R2 implements a multi-domain architecture with independent power domains for digital core (VDIG), audio (VAUDIO), RF (VRFDIG/VRFREF), SIM/eSIM (VSIM/VESIM), camera (VCAM), and multimedia cards (VMMC1/VMMC2), each controlled by dedicated LDOs or switchers. Its dual SPI interface supports primary/secondary processor access with hardware arbitration to prevent register conflicts during concurrent audio and power control operations.
Audio functionality centers on a 13-bit voice CODEC with dual-path narrow/wideband ADC for noise cancellation or stereo mic capture, paired with a 16-bit stereo DAC supporting multiple sample rates and PLL-synchronized clocking. The SSI audio buses operate in master/slave or network mode, enabling connection to baseband processors, FM radios, and car kits while maintaining independent timing domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Buck Switchers | Four 500 mA DC-DC converters with DVS control per channel for processor core and IO supply optimization |
| Boost Switcher | 350 mA boost converter for white LED backlight and USB transceiver supply with headroom tracking |
| Voice CODEC | 13-bit dual-channel ADC supporting simultaneous narrowband/wideband sampling per GSM/UMTS requirements |
| Stereo DAC | 16-bit resolution with multi-clock mode support and PLL-based clock generation for jitter-sensitive playback |
| USB Interface | Full-speed/low-speed transceiver with OTG and CEA-936-A carkit compliance including audio routing and ID detection |
| ADC Channels | 10-bit general-purpose ADC with 11 input channels plus dedicated touchscreen X/Y inputs (TSX1/TSX2/TSY1/TSY2) |
| Package | MAPBGA-247, 10 × 10 mm body, 0.65 mm pitch, 247-ball array with thermal pad |
Pinout & Package
MC13783JVK5R2 uses a MAPBGA-247 package (10 × 10 mm, 0.65 mm pitch) with exposed thermal pad for enhanced power dissipation in handheld applications. Pin functions are organized into functional blocks including charger interface, LED drivers, switchers, regulators, USB/RS232, control logic, RTC, SPI, ADC, and audio buses.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1AOUT / SW1BOUT / SW2AOUT / SW2BOUT | Buck switcher outputs | Four regulated 500 mA outputs for processor cores, IO, memory, and peripherals with DVS voltage adjustment |
| SW3OUT | Boost switcher output | 350 mA high-voltage output for backlight LEDs and USB transceiver supply |
| VAUDIO / VIOLO / VIOHI / VDIG / VRFDIG / VCAM / VMMC1 / VMMC2 | LDO outputs | Low-noise, programmable voltage regulators for audio, IO, RF, camera, and memory subsystems |
| MC1RIN / MC1LIN / MC2IN | Mic amplifier inputs | Dedicated differential inputs for handset left/right and headset microphones with integrated bias supplies (MC1RB/MC1LB/MC2B) |
| SPP / SPM / LSPP / LSPM / HSL / HSR | Audio outputs | Bridged earpiece (SPP/SPM), loudspeaker (LSPP/LSPM), and stereo headset (HSL/HSR) drive capability with thermal protection |
| BCL1 / FS1 / RX1 / TX1 / BCL2 / FS2 / RX2 / TX2 | SSI audio bus pins | Dual independent serial audio interfaces supporting I²S, network mode, and master/slave configuration for multi-device connectivity |
Key Features
| Feature | Design Value |
|---|---|
| Dual SPI with arbitration | Enables concurrent access from call and application processors without register conflict, critical for dual-core handset architectures |
| Integrated touchscreen interface | Four-pin resistive touch support (TSX1/TSX2/TSY1/TSY2) with pen-touch wake-up and precise ADC-based coordinate calculation |
| USB OTG + CEA-936-A carkit | Single-chip solution for automotive accessory detection, audio routing, and bidirectional USB data/power negotiation |
| Dynamic voltage scaling (DVS) | Real-time voltage adjustment of all four buck regulators under processor control to minimize active-mode current draw |
| Tri-color LED drivers | Three independent RGB LED channels (LEDRx/LEDGx/LEDBx) with programmable patterns for status indication and audio modulation |
| RTC with 32.768 kHz oscillator | On-die low-power oscillator with crystal interface (XTAL1/XTAL2) and calendar/alarm functionality for deep-sleep timekeeping |
Applications
| Smartphone Power & Audio Hub | GSM/UMTS Handset Baseband Integration |
|---|---|
Use Scenario: High-end smartphone requiring single-chip power sequencing, battery charging, audio codec, and USB OTG functionality in minimal PCB area. IC Role / Device Role / Timing Role: Central PMIC+audio SoC managing all voltage domains, microphone/speaker signal paths, and real-time clock synchronization. Use Value: Reduces BOM count by consolidating 4 buck regulators, 1 boost regulator, 13-bit dual ADC, 16-bit stereo DAC, USB transceiver, and RTC into one MAPBGA-247 package. |
Use Scenario: Dual-processor UMTS handset where call processor and application processor share power/audio resources without contention. IC Role / Device Role / Timing Role: Dual-SPI arbitrated interface enables simultaneous register access from both processors for coordinated power state transitions and audio path routing. Use Value: Eliminates need for external arbitration logic or duplicated power/audio ICs, cutting layout complexity and interconnect parasitics. |
| Mobile FM Radio + Stereo Recording System | Automotive Carkit with USB Audio Routing |
Use Scenario: Smartphone integrating FM radio receiver with stereo line-in recording capability alongside built-in voice calls. IC Role / Device Role / Timing Role: Voice CODEC and stereo DAC operate concurrently via separate SSI buses-one for narrowband telephony, one for wideband FM playback/recording. Use Value: Enables true full-duplex audio: simultaneous voice call (13-bit CODEC) and stereo FM recording (16-bit DAC + ADC) without sample rate conversion artifacts. |
Use Scenario: USB-connected automotive hands-free kit requiring headset detection, microphone bias, speaker drive, and CEA-936-A compliant signaling. IC Role / Device Role / Timing Role: Integrated USB transceiver with UID/UDATVP/USE0VM pins handles carkit ID detection, while HSL/HSR and TXOUT provide headset audio I/O. Use Value: Replaces discrete USB PHY, audio switches, and detection comparators-reducing component count and ensuring protocol-compliant timing alignment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management and audio applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX14783EETL+ | Lower integration: no embedded RTC, no touchscreen interface, no tri-color LED drivers, only single SPI interface | Targeted at simpler feature phones or IoT devices lacking FM radio, carkit, or advanced UI lighting | Choose when design requires only basic PMIC+audio with reduced software complexity and smaller footprint |
| TPS65910A3RSLR | Higher buck current (1 A per channel), integrated HDMI PHY, no voice CODEC or stereo DAC, no USB transceiver | Optimized for tablet-class applications needing higher power delivery but no telephony audio functions | Prefer for designs prioritizing processor core supply robustness over cellular audio features |
Compared with MAX14783EETL+ and TPS65910A3RSLR, MC13783JVK5R2 uniquely combines telephony-grade voice CODEC, dual-SPI arbitration, USB OTG/carkit, and touchscreen interface in a single MAPBGA package-making it irreplaceable for legacy GSM/UMTS handset platforms requiring full feature parity.
Availability
MC13783JVK5R2 is available at Aetrix Electronics and suitable for smartphone power management, UMTS handset audio subsystems, and automotive carkit interface designs requiring stable component supply and long-term lifecycle support.
Supply support for MC13783JVK5R2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and mixed-signal solutions for automotive, industrial, and mobile markets.
The MC13783 product line was designed specifically for 2.5G/3G mobile handsets, integrating power management, audio, USB, RTC, and touchscreen functions into a single die to replace multiple discrete ICs in space-constrained portable designs.
FAQ
What is the operating temperature range for MC13783JVK5R2?
The MC13783JVK5R2 is specified for operation from –30°C to +85°C, matching the extended environmental requirements of consumer handheld devices deployed globally. This range covers typical smartphone internal temperatures during sustained use, including peak thermal conditions near battery and processor zones. The device includes on-die thermal warning detection and automatic shutdown to protect against overheating.
Does MC13783JVK5R2 support USB On-The-Go functionality?
Yes, MC13783JVK5R2 integrates a full-speed/low-speed USB transceiver with native OTG support, including VBUS sensing (VBUS), ID pin detection (UID), and dual-role data lines (UDP/UDM). It also complies with CEA-936-A for automotive carkit applications, enabling automatic accessory identification and audio path reconfiguration without external components.
How many independent audio data paths does MC13783JVK5R2 support simultaneously?
MC13783JVK5R2 supports two fully independent audio data paths: one 13-bit voice CODEC path for telephony (narrow/wideband) and one 16-bit stereo DAC/ADC path for media playback/recording. These operate concurrently via separate SSI buses (BCL1/FS1/RX1/TX1 and BCL2/FS2/RX2/TX2), allowing simultaneous voice call and FM radio playback without shared clock or buffer contention.
What type of package does MC13783JVK5R2 use and what are its thermal characteristics?
MC13783JVK5R2 uses a MAPBGA-247 package measuring 10 × 10 mm with 0.65 mm ball pitch and an exposed thermal pad. The package supports efficient heat dissipation from high-current switchers and audio amplifiers, with thermal resistance (θJA) rated at 32°C/W under standard JEDEC conditions-enabling reliable operation in thermally constrained smartphone chassis without additional heatsinking.
Can MC13783JVK5R2 manage both single-path and serial-path battery charging?
Yes, MC13783JVK5R2 supports both single-path and serial-path charging topologies through configurable CHRGCTRL, BPFET, and BATTFET driver outputs. In serial-path mode, the device allows the system to operate directly from the charger while charging a deeply discharged or absent battery-a critical feature for field-replaceable battery designs in legacy handsets.
MC13783JVK5R2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 247-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Handheld/Mobile Devices
- Current - Supply:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 247-MAPBGA (10x10)
MC13783JVK5R2 FAQ
1.How can I place an order for MC13783JVK5R2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC13783JVK5R2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC13783JVK5R2 reliable?
The price and inventory of MC13783JVK5R2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC13783JVK5R2 is usually 5 days.
3.What payment methods are accepted for MC13783JVK5R2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC13783JVK5R2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC13783JVK5R2?
MC13783JVK5R2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC13783JVK5R2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC13783JVK5R2?
For technical support, including MC13783JVK5R2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC13783JVK5R2 requirements.
6.How does Aetrix verify that MC13783JVK5R2 is sourced from the original manufacturer or authorized distributors?
All MC13783JVK5R2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC13783JVK5R2 meets industry standards.
7.What is the process for return or replacement of MC13783JVK5R2?
All MC13783JVK5R2 units undergo pre-shipment inspection (PSI). If there is an issue with MC13783JVK5R2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC13783JVK5R2 part is unused and in its original packaging.
Return procedure for MC13783JVK5R2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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