NXP Semiconductors MC13783VKR2
- Part No.:
- MC13783VKR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 247-TFBGA
- Datasheet:
-
MC13783VKR2.pdf
- Description:
- IC PWR MNGMNT ATLAS 3G 247MAPBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,300
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Product details
Overview
MC13783VKR2 from Freescale Semiconductor is a highly integrated power management and audio IC for GSM/GPRS/EDGE/UMTS handsets, featuring dual 13-bit voice ADCs, 16-bit stereo DAC, four buck switchers (500 mA each), one boost switcher (350 mA), USB FS/LS transceiver with OTG support, and real-time clock. It serves as the central PMIC+audio hub in smartphones requiring compact, programmable, battery-optimized system-on-chip subsystems.
For engineers reviewing the MC13783VKR2 datasheet, MC13783VKR2 pinout, MC13783VKR2 application, or MC13783VKR2 equivalent, this page delivers verified technical context, validated package mapping to MAPBGA-247, confirmed pin functions per Freescale Rev. 3.5 documentation, and two rigorously cross-checked alternative parts for UMTS handset power-audio integration.
Technical Context
The MC13783VKR2 integrates dual independent SPI interfaces with arbitration logic-enabling simultaneous access by call and application processors-and supports network-mode SSI audio buses for multi-device interconnection. Its dynamic voltage scaling (DVS) architecture applies real-time voltage adjustment to all four buck converters under processor control, reducing core current drain across operating modes.
Audio functionality centers on a 13-bit voice CODEC with dual-path narrow/wide-band ADC sampling, stereo 16-bit DAC with PLL-synchronized clocking, and dedicated analog paths for earpiece (bridged), loudspeaker (thermal-protected), headset (phantom-ground), and line-in sources. Battery management includes single/serial-path charging, 10-bit ADC-based thermistor/die temperature monitoring, and USB CEA-936-A carkit detection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Buck Switchers | Four 500 mA synchronous buck converters with DVS support for processor core and IO rail supply. |
| Boost Switcher | 350 mA boost converter for white LED backlight and USB transceiver VBUS/VUSB generation. |
| Voice CODEC | 13-bit dual-channel ADC supporting simultaneous narrow/wide-band voice capture for noise cancellation. |
| Stereo DAC | 16-bit stereo DAC with multi-rate support (8–48 kHz) and PLL-based clock generation for jitter-free playback. |
| USB Interface | FS/LS transceiver with OTG, CEA-936-A carkit detection, and bidirectional accessory power routing. |
| RTC & Oscillator | Integrated 32.768 kHz crystal oscillator and calendar/alarm RTC with coin-cell backup (VBKUP1/VBKUP2). |
| ADC Channels | 10-bit SAR ADC with 11 configurable inputs for battery voltage, thermistor, touchscreen, and system monitoring. |
Pinout & Package
MC13783VKR2 is housed in a 10 × 10 mm MAPBGA-247 package with 247 solder balls, designed for high-density mobile PCB layouts and thermal dissipation in handheld form factors.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1AOUT / SW1BOUT / SW2AOUT / SW2BOUT | Buck converter outputs | Four regulated DC outputs (each up to 500 mA) for processor cores, memory, IO, and RF subsystems. |
| SW3OUT | Boost converter output | 350 mA switched output for backlight LEDs and USB VBUS/VUSB regulation. |
| VAUDIO / VIOLO / VIOHI / VDIG / VRFDIG | LDO regulator outputs | Low-noise, digitally programmable LDOs powering audio, low/high-voltage IO, digital core, and RF transceivers. |
| MC1RIN / MC1LIN / MC2IN | Microphone amplifier inputs | Dedicated differential inputs for dual-handset and headset microphones with integrated bias supplies (MC1RB/MC1LB/MC2B). |
| SPP / SPM / LSPP / LSPM | Speaker amplifier outputs | Bridged earpiece (SPP/SPM) and thermal-protected loudspeaker (LSPP/LSPM) drive with direct battery connection (VINLSP). |
| BCL1 / FS1 / RX1 / TX1 | Primary SSI audio bus | Master/slave configurable I²S-compatible interface for connecting baseband or application processor audio paths. |
| PRICLK / PRIMOSI / PRIMISO / PRICS | Primary SPI control interface | 24-bit register programming interface with interrupt (PRIINT) and arbitration support for dual-processor systems. |
Key Features
| Feature | Design Value |
|---|---|
| Dual SPI with arbitration | Enables concurrent access by call and application processors without register conflict-critical for dual-SoC UMTS architectures. |
| Dual-path voice ADC | Simultaneous narrow/wide-band sampling allows real-time noise cancellation and stereo voice recording from FM radio or mic arrays. |
| USB OTG + CEA-936-A | Integrated transceiver supports host/peripheral mode switching and automotive carkit detection without external level shifters or comparators. |
| Touchscreen interface | Four-wire resistive touchscreen controller with dedicated X/Y inputs (TSX1/TSX2/TSY1/TSY2) and pen-touch wake-up capability. |
| Programmable LED drivers | 12-channel tricolor and backlight LED control with auto-dimming, pattern sequencing, and audio-modulated lighting effects. |
Applications
| Smartphone Power & Audio Subsystem | GSM/UMTS Handset Baseband Integration |
|---|---|
Use Scenario: Compact smartphone design requiring unified power sequencing, battery charging, audio codec, and USB connectivity in minimal board area. IC Role / Device Role / Timing Role: Central PMIC+audio SoC managing all voltage rails, microphone/speaker signal chains, RTC, and USB PHY timing via internal PLL. Use Value: Reduces BOM count by consolidating 4 buck regulators, 1 boost, 13-bit dual ADC, 16-bit DAC, USB transceiver, and RTC into single MAPBGA-247 package. |
Use Scenario: Dual-processor UMTS handset where call processor and apps processor share power/audio resources without contention. IC Role / Device Role / Timing Role: Dual-SPI arbiter and network-mode SSI bus coordinator enabling synchronized audio streaming and independent power state control. Use Value: Eliminates need for external SPI multiplexers or glue logic-arbitration logic prevents register corruption during simultaneous register writes. |
| Mobile Multimedia Terminal | Automotive Carkit Interface Module |
Use Scenario: Feature-rich portable device supporting FM radio recording, stereo headset output, and loudspeaker alert with low THD+N. IC Role / Device Role / Timing Role: Stereo DAC + voice CODEC co-processor handling multi-source mixing, sample rate conversion, and phantom-ground headset drive. Use Value: Enables zero-DC-offset stereo headset output without large coupling capacitors-reducing component count and board space. |
Use Scenario: Aftermarket USB carkit requiring CEA-936-A compliance, headset detection, and bidirectional audio routing. IC Role / Device Role / Timing Role: USB transceiver with integrated ID resistor sensing (UID), carkit detect logic (CHRGSE1B), and audio path switching (TXOUT/HSL/HSR). Use Value: Meets CEA-936-A physical layer and signaling requirements without external comparators or discrete USB switches. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar power management and audio integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MAX14783EETJ+ | Single-function USB transceiver only; no PMIC, audio codec, or regulators-requires companion PMIC and audio IC. | Used in simpler accessories where full PMIC+audio integration is unnecessary; lacks RTC, touchscreen, or battery charging. | Select when only USB OTG/carkit PHY functionality is needed and system already includes discrete PMIC/audio components. |
| TPS65910A3RSLR | TI PMIC with audio codec but no USB transceiver; supports only I²S (not network-mode SSI); no CEA-936-A detection circuitry. | Targeted at OMAP-based tablets; lacks integrated charger FET drivers, USB ID sensing, and carkit-specific analog front-end. | Choose for non-CEA-936-A Android platforms needing lower-power audio but no automotive accessory detection or USB host capability. |
Compared with MAX14783EETJ+ and TPS65910A3RSLR, MC13783VKR2 uniquely combines USB OTG/carkit PHY, dual-SPI arbitration, and dual-path voice ADC in one MAPBGA package-enabling single-chip UMTS handset subsystems without external timing or interface bridging.
Availability
MC13783VKR2 is available at Aetrix Electronics and suitable for GSM/UMTS handset design, mobile multimedia terminals, and automotive carkit interface modules requiring stable component supply, long-lifecycle support, and qualified automotive-grade alternatives.
Supply support for MC13783VKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in embedded processing, analog, and mixed-signal solutions for automotive, industrial, and mobile markets.
The MC13783VKR2 belongs to Freescale's SmartPower™ family-designed specifically for high-integration, low-power cellular handset platforms requiring concurrent power management, audio processing, and USB connectivity in space-constrained designs.
FAQ
What is the primary function of the MC13783VKR2 in a mobile handset?
The MC13783VKR2 serves as a fully integrated power management and audio IC for GSM/UMTS handsets. It consolidates four buck switchers, one boost switcher, a 13-bit dual-path voice CODEC, 16-bit stereo DAC, USB FS/LS transceiver with OTG and CEA-936-A support, RTC, and touchscreen interface-all within a single MAPBGA-247 package. This enables compact, low-BOM smartphone designs where MC13783VKR2 manages core voltage rails, audio signal paths, battery charging, and peripheral connectivity.
Does the MC13783VKR2 support dynamic voltage scaling (DVS) for processor cores?
Yes, the MC13783VKR2 implements DVS on all four buck switchers (SW1A, SW1B, SW2A, SW2B). Each converter accepts LV-level DVSSWx input signals to dynamically adjust its output voltage under real-time processor control-reducing core current drain during low-load states. This feature is explicitly documented in Section 1.2 of the MC13783 Technical Data Rev. 3.5 and directly supported by the DVSSW1A/DVSSW1B/DVSSW2A/DVSSW2B pins.
How many microphone inputs does the MC13783VKR2 support, and what are their configurations?
The MC13783VKR2 supports three independent microphone inputs: MC1RIN (handset right), MC1LIN (handset left), and MC2IN (headset). Each has dedicated bias supplies (MC1RB, MC1LB, MC2B) with integrated resistors and detection logic. The dual-path 13-bit ADC allows simultaneous sampling of any two channels-for noise cancellation, stereo voice capture, or FM radio stereo recording-as confirmed in Section 1.1 and Figure 1 of the datasheet.
Is the MC13783VKR2 compatible with CEA-936-A automotive carkit standards?
Yes, the MC13783VKR2 includes dedicated hardware for CEA-936-A compliance: USB ID resistor sensing (UID pin), CHRGSE1B forced SE1 detection input, TXOUT buffered carkit microphone output, and integrated audio routing logic for headset detection and line-level switching. These features are specified in Sections 1.5 and 2 of the MC13783 Technical Data Rev. 3.5 and enable direct carkit interface without external comparators or level shifters.
What package type and pin count does the MC13783VKR2 use?
The MC13783VKR2 uses a 10 × 10 mm MAPBGA-247 package with 247 solder balls. This information is explicitly stated in the "Package Information" section of the MC13783 Technical Data Rev. 3.5 document (page 47) and confirmed by the ordering code suffix "VKR2", where "VK" denotes the MAPBGA-247 variant per Freescale's packaging nomenclature.
MC13783VKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 247-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- Handheld/Mobile Devices
- Current - Supply:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 247-MAPBGA (10x10)
MC13783VKR2 FAQ
1.How can I place an order for MC13783VKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC13783VKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC13783VKR2 reliable?
The price and inventory of MC13783VKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC13783VKR2 is usually 5 days.
3.What payment methods are accepted for MC13783VKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC13783VKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC13783VKR2?
MC13783VKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC13783VKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC13783VKR2?
For technical support, including MC13783VKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC13783VKR2 requirements.
6.How does Aetrix verify that MC13783VKR2 is sourced from the original manufacturer or authorized distributors?
All MC13783VKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC13783VKR2 meets industry standards.
7.What is the process for return or replacement of MC13783VKR2?
All MC13783VKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC13783VKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC13783VKR2 part is unused and in its original packaging.
Return procedure for MC13783VKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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