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NXP Semiconductors MC32PF1510A1EPR2
- Part No.:
- MC32PF1510A1EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MC32PF1510A1EPR2.pdf
- Description:
- PF1510
- Quantity:
- Payment:
- Shipping:
Inventory:4,688
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Product details
Overview
MC32PF1510A1EPR2 from NXP Semiconductors is a power management IC (PMIC) engineered for low-power i.MX application processors, delivering three 1.0 A buck converters (SW1–SW3), three LDOs (LDO1–LDO3), DDR reference (VREFDDR), RTC supply (VSNVS), and integrated coin-cell charging. It supports i.MX 6UL/6ULL/7ULP processors in wearable and IoT edge devices requiring ultra-low quiescent current (1.0 µA in ULP mode) and dynamic voltage scaling.
For engineers reviewing the MC32PF1510A1EPR2 datasheet, MC32PF1510A1EPR2 pinout, MC32PF1510A1EPR2 application, or MC32PF1510A1EPR2 equivalent, key selection criteria include its preprogrammed OTP configuration for i.MX 6UL with DDR3L, 40-pin QFN package with exposed thermal pad, I²C programmability, and industrial-grade −40 °C to 105 °C operation.
Technical Context
The MC32PF1510A1EPR2 integrates a front-end LDO (1500 mA, up to 6.5 V input) feeding VSYS, which powers three synchronous buck regulators with internal MOSFETs and digital soft-start. SW1 and SW2 support dynamic voltage scaling (DVS) across 0.6–1.3875 V (12.5 mV steps) or 1.1–3.3 V (variable), while SW3 delivers fixed 1.8–3.3 V outputs without DVS.
Its analog core includes dedicated LDOs: LDO1/LDO3 (0.75–1.5 V or 1.8–3.3 V, 300 mA each, load-switch capable), LDO2 (1.8–3.3 V, 400 mA), USBPHY (4.9 V or 3.3 V, 60 mA), and always-on LDO2P7 (2.7 V, 5 mA). The device uses OTP memory to store startup/power-down sequences, regulator voltages, and timing-configured at factory for i.MX 6UL with DDR3L per A1 programming code.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4.1 V to 6.0 V on VIN; withstands DC/transient up to +22 V-enables robust USB/adapter input handling. |
| Buck Converters | SW1/SW2: 1.0 A, 0.6–1.3875 V (DVS) or 1.1–3.3 V; SW3: 1.0 A, 1.8–3.3 V-powers CPU cores, I/O, and peripherals independently. |
| LDO Outputs | LDO1/LDO3: 300 mA, dual-range (0.75–1.5 V / 1.8–3.3 V); LDO2: 400 mA, 1.8–3.3 V-supports memory, sensors, and interface rails with load-switch capability. |
| VREFDDR & VSNVS | VREFDDR: 0.5–0.9 V, 10 mA for DDR termination; VSNVS: 3.0 V, 2.0 mA RTC backup-ensures reliable memory interface and real-time clock retention. |
| Quiescent Current | 1.0 µA in ULP mode (light-load buck), <1.5 µA in Low-power mode (LDOs)-extends battery life in always-on wearable/IoT nodes. |
| Operating Temperature | −40 °C to 105 °C (industrial grade)-validated for deployment in harsh environments like smart home gateways and industrial sensors. |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) compatible-enables runtime voltage reconfiguration and status monitoring by host processor. |
Pinout & Package
MC32PF1510A1EPR2 is housed in a 40-pin QFN package (5.0 mm × 5.0 mm) with exposed thermal pad (EPAD), optimized for thermal dissipation in space-constrained portable designs. Pin count and layout match the PF1510 family specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Main IC supply input | Accepts 5.0 V adapter/USB source; bypassed with 2.2 µF capacitor-provides clean bias for internal logic and LDO2P7/USBPHY. |
| VSYS | Main PMIC input rail | Generated by front-end LDO; powers all bucks and LDOs-requires 47 µF bulk capacitance for stability under transient loads. |
| SW1FB–SW3FB | Buck feedback inputs | Connect near load to minimize trace impedance-enables precise output regulation despite PCB parasitics. |
| LDO1–LDO3, LDO2P7, USBPHY, VSNVS | Regulated output terminals | Each requires specific local bypass (e.g., 4.7 µF for LDO1, 2.2 µF for LDO2P7)-ensures low-noise supply for sensitive analog/digital blocks. |
| SCL/SDA | I²C communication interface | Pulled up to VDDIO (1.7–3.6 V); enables full OTP configuration read/write and real-time fault reporting. |
| INTB/RESETBMCU | Open-drain status signals | Asserted during overvoltage, thermal shutdown, or watchdog timeout-allows host processor to initiate safe recovery. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured startup sequence | User-programmable power-up/down timing and voltage ramp rates-eliminates external sequencing ICs in i.MX 6UL systems. |
| Dynamic voltage scaling (SW1/SW2) | Hardware-controlled DVS via I²C register writes-reduces CPU core power by >30% during low-activity states. |
| Coin-cell charger (LICELL) | Integrated trickle-charge circuit for backup battery-maintains RTC and SNVS state during main power loss without external components. |
| Ultra-low quiescent current modes | 1.0 µA buck ULP mode + <1.5 µA LDO low-power mode-enables multi-week battery life in BLE-connected wearables. |
| Industrial temperature rating | −40 °C to 105 °C operation with validated thermal resistance (RΘJA = 17.8 °C/W on 8-layer board)-supports deployment in uncontrolled ambient environments. |
Applications
| Wireless Game Controllers | Smart Wearables |
|---|---|
Use Scenario: Battery-powered handheld controllers with motion sensing, Bluetooth LE, and haptic feedback. IC Role / Device Role / Timing Role: Central PMIC supplying i.MX 6UL CPU core (SW1), I/O (SW3), DDR3L memory (VREFDDR), and RTC (VSNVS). Use Value: DVS on SW1 dynamically scales core voltage with game complexity, reducing average power by 22% versus fixed-rail operation. | Use Scenario: Fitness trackers with optical heart-rate sensor, accelerometer, and OLED display. IC Role / Device Role / Timing Role: Powers ARM Cortex-A7 CPU (SW1), sensor hub (LDO2), display driver (SW3), and always-on RTC (VSNVS). Use Value: 1.0 µA ULP buck mode extends 120 mAh coin cell life to >18 months in sleep state. |
| Embedded Monitoring Systems | Home Automation Hubs |
Use Scenario: Industrial vibration sensors with LoRaWAN backhaul and local edge analytics. IC Role / Device Role / Timing Role: Delivers regulated rails for i.MX 7ULP processor (SW1/SW2), LPDDR3 (VREFDDR), and wireless SoC (LDO2). Use Value: Preprogrammed A1 OTP config ensures correct DDR3L timing and power sequencing-reducing firmware bring-up time by 3 days. | Use Scenario: Zigbee/Z-Wave gateway aggregating smart lighting, thermostats, and security sensors. IC Role / Device Role / Timing Role: Supplies i.MX 6ULL application processor (SW1), Wi-Fi module (SW3), and secure element (LDO1). Use Value: Integrated coin-cell charger maintains timekeeping and network credentials during AC power outages up to 72 hours. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF1510A1EPR2 | Same die, −40 °C to 105 °C industrial temp grade (MC34 prefix denotes extended range; MC33 is obsolete variant) | Identical i.MX 6UL/DDR3L OTP programming and pinout-valid drop-in replacement where legacy stock exists | Select MC33PF1510A1EPR2 only if sourcing from existing inventory; new designs should use MC32PF1510A1EPR2 per NXP's current recommendation. |
| MPQ4436AGL-AEC1-P | Automotive-grade 3-channel buck (no LDOs, no DDR ref, no OTP, no coin-cell charge) | Requires external LDOs and sequencing logic for i.MX 6UL-increases BOM count and layout area by ≥7 components | Choose MPQ4436AGL-AEC1-P only for automotive AEC-Q100 compliance needs; not suitable for footprint- or feature-equivalent replacement. |
Compared with MC33PF1510A1EPR2, the MC32PF1510A1EPR2 offers identical functionality with updated manufacturing flow, while MPQ4436AGL-AEC1-P lacks integrated LDOs, DDR reference, and programmable sequencing-making it unsuitable as a functional substitute without significant system redesign.
Availability
MC32PF1510A1EPR2 is available at Aetrix Electronics and suitable for wireless game controllers, smart wearables, and embedded monitoring systems requiring stable component supply across long production lifecycles.
Supply support for MC32PF1510A1EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based application processors and power management.
The PF1510 product line was designed specifically to simplify power architecture for NXP's i.MX 6/7 series processors-integrating all essential rails, sequencing, and battery management into a single QFN package for space- and power-constrained edge devices.
FAQ
What is the OTP programming configuration of MC32PF1510A1EPR2?
The MC32PF1510A1EPR2 is factory-programmed with OTP code A1, which configures the device for default operation with i.MX 6UL processors using DDR3L memory. This includes preset startup timing, voltage levels for SW1–SW3 and LDOs, and power-down sequencing optimized for that platform. No field reprogramming of OTP is possible after shipment.
Does MC32PF1510A1EPR2 support dynamic voltage scaling on all buck converters?
No-MC32PF1510A1EPR2 supports dynamic voltage scaling (DVS) only on SW1 and SW2. SW3 operates at fixed output voltages between 1.8 V and 3.3 V in 100 mV steps and does not support DVS. This design allows CPU core and GPU rails to scale with workload while keeping I/O and peripheral supplies stable.
What is the maximum input voltage the VIN pin of MC32PF1510A1EPR2 can withstand?
The VIN pin of MC32PF1510A1EPR2 can withstand transient and DC inputs up to +22 V, as specified in the absolute maximum ratings. However, normal operating input voltage is limited to 4.1 V to 6.0 V. The 22 V rating provides surge protection against common adapter/USB hot-plug events without requiring external TVS diodes.
How does the coin-cell charging function work on MC32PF1510A1EPR2?
The MC32PF1510A1EPR2 integrates a dedicated coin-cell charger circuit connected to the LICELL pin. When a coin cell (e.g., CR2032) is attached, the PMIC trickle-charges it from the VSYS rail at a user-configurable rate, maintaining VSNVS (3.0 V) during main power loss. Charging current and end-of-charge detection are controlled via OTP settings and require no external components.
Is MC32PF1510A1EPR2 pin-compatible with other PF1510 variants like MC32PF1510A2EPR2?
Yes-MC32PF1510A1EPR2 is fully pin-compatible with all PF1510 family members, including MC32PF1510A2EPR2 and MC34PF1510A7EPR2. All share the identical 40-pin QFN (5 mm × 5 mm) package, pinout, and electrical interface. Differences exist only in OTP programming, temperature grade, and part-number suffix (e.g., A1 vs A2), not mechanical or signal-level compatibility.
MC32PF1510A1EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply:
- -
- Voltage - Supply:
- 3.8V ~ 7V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-HVQFN (5x5)
MC32PF1510A1EPR2 FAQ
1.How can I place an order for MC32PF1510A1EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF1510A1EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF1510A1EPR2 reliable?
The price and inventory of MC32PF1510A1EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF1510A1EPR2 is usually 5 days.
3.What payment methods are accepted for MC32PF1510A1EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF1510A1EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF1510A1EPR2?
MC32PF1510A1EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF1510A1EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF1510A1EPR2?
For technical support, including MC32PF1510A1EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF1510A1EPR2 requirements.
6.How does Aetrix verify that MC32PF1510A1EPR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF1510A1EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF1510A1EPR2 meets industry standards.
7.What is the process for return or replacement of MC32PF1510A1EPR2?
All MC32PF1510A1EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF1510A1EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF1510A1EPR2 part is unused and in its original packaging.
Return procedure for MC32PF1510A1EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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