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NXP Semiconductors MC32PF1510A2EPR2

Part No.:
MC32PF1510A2EPR2
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
40-VFQFN Exposed Pad
Datasheet:
AetrixMC32PF1510A2EPR2.pdf
Description:
PF1510
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,099

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Product details

Overview

MC32PF1510A2EPR2 from NXP Semiconductors is a preprogrammed power management IC (PMIC) optimized for i.MX 7ULP processors with LPDDR3 memory in low-power IoT and wearable systems. It integrates three 1.0 A buck converters (SW1–SW3), three LDOs (LDO1–LDO3), VSNVS (3.0 V RTC supply), VREFDDR (0.5–0.9 V DDR reference), USB_PHY LDO, and OTP-configurable power sequencing.

For engineers reviewing the MC32PF1510A2EPR2 datasheet, MC32PF1510A2EPR2 pinout, MC32PF1510A2EPR2 application, or MC32PF1510A2EPR2 equivalent, this page delivers verified electrical specs, I²C-programmable DVS on SW1/SW2, industrial-grade −40 °C to 105 °C operation, and QFN40 package layout guidance for i.MX 7ULP-based designs.

Technical Context

The MC32PF1510A2EPR2 implements a multi-rail PMIC architecture with dedicated regulators for processor core (SW1), SoC I/O (SW2), and peripheral/DDR termination (SW3), plus always-on LDO2P7 (2.7 V) and VSNVS (3.0 V). Its OTP memory stores i.MX 7ULP–LPDDR3–specific startup/shutdown sequences, voltage setpoints, and timing parameters.

It supports dynamic voltage scaling on SW1 and SW2 via I²C commands, operates in forced PWM or adaptive variable-frequency modes, and features ultra-low quiescent current (1.0 µA in ULP mode) with peak efficiency >90% at mid-load. Input withstand capability up to +22 V DC ensures robustness against transient surges on VIN.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range4.1 V to 6.0 V on VIN; withstands up to +22 V DC transients - enables direct USB/adapter input without external surge protection
Buck ConvertersSW1/SW2: 0.6–1.3875 V (12.5 mV steps) or 1.1–3.3 V (variable); SW3: 1.8–3.3 V (100 mV steps) - covers i.MX 7ULP core, I/O, and LPDDR3 VDDQ/VTT rails
LDO OutputsLDO1/LDO3: 0.75–1.5 V or 1.8–3.3 V / 300 mA; LDO2: 1.8–3.3 V / 400 mA; LDO2P7: 2.7 V / 5 mA - supports mixed-voltage peripherals and always-on logic
VREFDDR & VSNVSVREFDDR: 0.5–0.9 V / 10 mA (LPDDR3-compatible); VSNVS: 3.0 V / 2.0 mA - provides precision DDR reference and RTC backup supply
Operating Temperature−40 °C to 105 °C - qualified for industrial ambient conditions in embedded gateways and edge sensors
Package40-pin QFN, 5.0 mm × 5.0 mm with exposed thermal pad - enables compact PCB layout and efficient heat dissipation in space-constrained wearables
I²C InterfaceStandard-mode (100 kHz) and fast-mode (400 kHz) compatible - allows real-time DVS control and status monitoring by host processor

Pinout & Package

MC32PF1510A2EPR2 uses a 40-pin QFN (5.0 mm × 5.0 mm) with exposed thermal pad (EPAD), designed for high-density portable applications requiring thermal performance and minimal footprint.

Pin/TerminalCircuit RoleDesign Meaning
VINMain IC supply inputAccepts 5.0 V adapter/USB input; bypassed with 2.2 µF capacitor - primary power entry point for front-end LDO
VSYSMain system rail outputRegulated 3.7 V output from front-end LDO; powers all internal regulators - serves as common input for SW1/SW2/SW3 and LDOs
SW1FB / SW2FB / SW3FBVoltage feedback inputsConnect directly to respective output rails near load - enables precise closed-loop regulation and DVS tracking
VLDO1 / VLDO2 / VLDO3LDO output terminalsEach requires local 4.7–10 µF ceramic bypass - delivers stable low-noise bias for analog/RF/peripheral ICs
VREFDDR / VSNVS / USBPHYDedicated reference/RTC/PHY suppliesVREFDDR needs 1.0 µF bypass; VSNVS requires 0.47 µF; USBPHY needs 1.0 µF - ensures DDR timing integrity and USB PHY compliance
SCL / SDA / INTB / RESETBMCUI²C interface and control signalsPull-up to VDDIO (1.7–3.6 V) required; INTB/RESETBMCU are open-drain - enables bidirectional communication and system-level fault signaling

Key Features

FeatureDesign Value
OTP-Configured i.MX 7ULP + LPDDR3 SequencingPreloaded startup/shutdown order, timing, and voltage setpoints eliminate external configuration EEPROM and reduce BOM count
Dynamic Voltage Scaling on SW1/SW2Real-time I²C-controlled output adjustment enables processor DVFS, reducing active power by up to 30% during low-compute states
Ultra-Low Quiescent Current1.0 µA in ULP mode with light load - extends battery life in always-on sensor nodes and wearable sleep modes
+22 V Input Withstand CapabilityRobust front-end LDO survives automotive-grade load-dump transients without external TVS diodes
VSNVS + Coin Cell ChargerIntegrated 3.0 V RTC supply with optional coin cell backup and charging circuit - maintains timekeeping during main power loss

Applications

Smart Wearable DevicesIndustrial IoT Gateways

Use Scenario: Compact wrist-worn health monitor with i.MX 7ULP, LPDDR3, BLE, and optical sensors.

IC Role / Device Role / Timing Role: MC32PF1510A2EPR2 supplies core (SW1), I/O (SW2), LPDDR3 VDDQ/VTT (SW3), and RTC (VSNVS) while managing power states via I²C.

Use Value: Enables 7-day battery life via ULP mode (1.0 µA) and DVS-driven core voltage scaling during sensor sampling intervals.

Use Scenario: Edge gateway aggregating Modbus, LoRa, and Wi-Fi traffic in factory automation.

IC Role / Device Role / Timing Role: MC32PF1510A2EPR2 powers i.MX 7ULP, DDR3L memory, and multiple interface PHYs with coordinated sequencing and thermal derating.

Use Value: −40 °C to 105 °C rating and +22 V input tolerance ensure reliable operation in uncontrolled industrial enclosures.

Wireless Game ControllersHome Automation Hubs

Use Scenario: Low-latency Bluetooth controller with motion sensing and haptic feedback.

IC Role / Device Role / Timing Role: MC32PF1510A2EPR2 delivers clean, sequenced power to i.MX 7ULP, IMU, and audio codec; VREFDDR stabilizes DDR interface.

Use Value: <10 mV output ripple on SW1/SW2 ensures jitter-free real-time motion processing and responsive haptics.

Use Scenario: Voice-controlled smart hub integrating Zigbee, Thread, and Matter stacks.

IC Role / Device Role / Timing Role: MC32PF1510A2EPR2 manages multi-rail power for i.MX 7ULP, secure element, and RF transceivers with independent LDO domains.

Use Value: LDO2P7 (2.7 V) and USBPHY (3.3 V/4.9 V) outputs meet strict noise requirements of RF front-ends and cryptographic accelerators.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC34PF1510A2EPR2Identical functionality and pinout; rated for −40 °C to 105 °C industrial temperature range (MC32PF1510A2EPR2 is consumer-grade −40 °C to 85 °C)Preferred for extended-temperature deployments such as outdoor gateways or automotive telematicsSelect MC34PF1510A2EPR2 when full industrial temp range is required; otherwise MC32PF1510A2EPR2 suffices for indoor wearables and hubs
PF8100A2EPR2Higher integration: adds 2x additional bucks, 2x additional LDOs, and integrated charger; larger 56-pin QFN packageTargets more complex i.MX 8M Mini/Plus platforms with dual DDR, camera, and display subsystemsChoose PF8100A2EPR2 only if extra rails and higher current (2.5 A bucks) are needed; MC32PF1510A2EPR2 offers optimal cost/size for i.MX 7ULP

Compared with MC34PF1510A2EPR2, the MC32PF1510A2EPR2 trades extended temperature rating for lower cost and same footprint, while PF8100A2EPR2 adds significant rail count and complexity unsuited for i.MX 7ULP's power profile.

Availability

MC32PF1510A2EPR2 is available at Aetrix Electronics and suitable for smart wearable devices, industrial IoT gateways, and wireless game controllers requiring stable component supply across production lifecycles.

Supply support for MC32PF1510A2EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The PF1510 product line delivers highly integrated, application-specific PMICs for NXP's i.MX application processors, with preprogrammed variants like MC32PF1510A2EPR2 targeting low-power, size-constrained edge devices.

FAQ

What is the operating temperature range for MC32PF1510A2EPR2?

The MC32PF1510A2EPR2 is specified for −40 °C to 85 °C ambient operation, qualifying it for consumer and commercial applications including wearables and home hubs. Its junction temperature limit is 125 °C, and thermal design must maintain RΘJA ≤ 20.6 °C/W on six-layer boards to stay within safe limits under full load.

Does MC32PF1510A2EPR2 support dynamic voltage scaling?

Yes, MC32PF1510A2EPR2 supports dynamic voltage scaling on SW1 and SW2 buck converters via I²C commands. This allows real-time adjustment of output voltages in 12.5 mV steps (0.6–1.3875 V range) to match i.MX 7ULP core frequency changes, reducing dynamic power consumption during low-activity periods.

What is the purpose of the VREFDDR output on MC32PF1510A2EPR2?

The VREFDDR output on MC32PF1510A2EPR2 provides a precision 0.5–0.9 V reference voltage for LPDDR3 memory interfaces, sourced from VINREFDDR/2. It delivers up to 10 mA with tight regulation (±2%) and requires a 1.0 µF ceramic bypass capacitor to ensure signal integrity and timing margin compliance in high-speed DDR links.

How is the MC32PF1510A2EPR2 programmed for i.MX 7ULP with LPDDR3?

The MC32PF1510A2EPR2 is factory-programmed with OTP configuration code "2", which defines i.MX 7ULP–LPDDR3–specific power-up sequencing, voltage setpoints (e.g., SW1 = 0.8 V core, SW2 = 1.1 V I/O), timing delays, and DVS enablement - eliminating need for external configuration during board bring-up.

What are the key differences between MC32PF1510A2EPR2 and MC34PF1510A2EPR2?

MC32PF1510A2EPR2 and MC34PF1510A2EPR2 share identical functionality, pinout, and OTP programming (code "2"), but differ in temperature rating: MC32PF1510A2EPR2 is rated −40 °C to 85 °C (consumer grade), while MC34PF1510A2EPR2 extends to −40 °C to 105 °C (industrial grade), making the latter suitable for harsher environments like factory floors or outdoor gateways.

MC32PF1510A2EPR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
40-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply:
-
Voltage - Supply:
3.8V ~ 7V
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
40-HVQFN (5x5)

MC32PF1510A2EPR2 FAQ

1.How can I place an order for MC32PF1510A2EPR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC32PF1510A2EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC32PF1510A2EPR2 reliable?

The price and inventory of MC32PF1510A2EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF1510A2EPR2 is usually 5 days.

3.What payment methods are accepted for MC32PF1510A2EPR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF1510A2EPR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC32PF1510A2EPR2?

MC32PF1510A2EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC32PF1510A2EPR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC32PF1510A2EPR2?

For technical support, including MC32PF1510A2EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF1510A2EPR2 requirements.

6.How does Aetrix verify that MC32PF1510A2EPR2 is sourced from the original manufacturer or authorized distributors?

All MC32PF1510A2EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF1510A2EPR2 meets industry standards.

7.What is the process for return or replacement of MC32PF1510A2EPR2?

All MC32PF1510A2EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF1510A2EPR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC32PF1510A2EPR2 part is unused and in its original packaging.

Return procedure for MC32PF1510A2EPR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

MC32PF1510A2EPR2 Tags

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