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NXP Semiconductors MC32PF1510A3EP
- Part No.:
- MC32PF1510A3EP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MC32PF1510A3EP.pdf
- Description:
- PF1510
- Quantity:
- Payment:
- Shipping:
Inventory:3,498
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Product details
Overview
MC32PF1510A3EP from NXP Semiconductors is a preprogrammed power management IC (PMIC) optimized for i.MX 6UL processors with DDR3L memory, delivering three 1.0 A buck converters (SW1–SW3), three LDOs (LDO1–LDO3), VSNVS RTC supply (3.0 V/2.0 mA), DDR reference (VREFDDR: 0.5–0.9 V/10 mA), and I²C programmability. It supports low-power IoT and wearable systems requiring tight voltage sequencing and dynamic voltage scaling.
For engineers reviewing the MC32PF1510A3EP datasheet, MC32PF1510A3EP pinout, MC32PF1510A3EP application, or MC32PF1510A3EP equivalent, key selection criteria include its OTP-configured startup sequence for i.MX 6UL + DDR3L, industrial-grade −40 °C to 105 °C operation, 40-pin QFN package with exposed thermal pad, and integrated coin-cell charger for backup power retention.
Technical Context
The MC32PF1510A3EP implements a dedicated OTP-programmed power tree for i.MX 6UL with DDR3L, featuring SW1 and SW2 with dynamic voltage scaling (0.6–1.3875 V in 12.5 mV steps or 1.1–3.3 V variable), SW3 fixed at 1.8–3.3 V, and LDO2P7 always-on 2.7 V/5.0 mA rail. Its front-end LDO accepts 4.1–6.0 V input and withstands up to +22 V transients.
Control logic includes I²C interface (SCL/SDA), open-drain interrupt (INTB) and reset (RESETBMCU), watchdog input (WDI), and processor-managed power states (STANDBY, PWRON, ONKEY). The device integrates digital core (VDIG), analog core (VCORE), and OTP memory for configurable startup/shutdown timing and regulator voltages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4.1 V to 6.0 V nominal; withstands DC/transient up to +22 V - enables robust USB/adapter input handling without external protection. |
| Buck Converters | SW1/SW2: 1.0 A, 0.6–1.3875 V (DVS) or 1.1–3.3 V; SW3: 1.0 A, 1.8–3.3 V - powers i.MX 6UL core, I/O, and DDR3L VDDQ independently. |
| LDO Outputs | LDO1/LDO3: 300 mA, 0.75–3.3 V with load switch; LDO2: 400 mA, 1.8–3.3 V; LDO2P7: 2.7 V/5.0 mA always-on - supplies peripheral rails and real-time clock backup. |
| VREFDDR & VSNVS | VREFDDR: 0.5–0.9 V/10 mA for DDR3L reference; VSNVS: 3.0 V/2.0 mA with coin-cell charging - ensures memory interface stability and RTC retention during main power loss. |
| Operating Temperature | −40 °C to 105 °C - qualified for industrial embedded applications including smart gateways and edge sensors. |
| Package | 40-pin QFN, 5.0 mm × 5.0 mm with exposed thermal pad - supports high-density PCB layouts and efficient thermal dissipation via EPAD grounding. |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) compatible - enables runtime voltage reconfiguration and status monitoring by host processor. |
Pinout & Package
MC32PF1510A3EP uses a 40-pin QFN (5.0 mm × 5.0 mm) with exposed thermal pad (EPAD), designed for industrial temperature range (−40 °C to 105 °C). The EPAD must be connected to inner/external ground planes via multiple vias for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1IN, SW2IN, SW3IN | Buck converter input nodes | Connect to VSYS (3.7 V typical); require local 0.1 µF + 4.7 µF bypassing - forms input filter for each regulator stage. |
| SW1FB, SW2FB, SW3FB | Voltage feedback inputs | Connect directly to respective output rails near load - enables precise closed-loop regulation and transient response optimization. |
| VLDO1, VLDO2, VLDO3 | LDO output terminals | Each requires dedicated ceramic bypass capacitor (4.7 µF or 10 µF) - ensures stability and low-noise supply for sensitive analog/digital blocks. |
| VSNVS, LICELL | RTC backup supply & coin-cell interface | VSNVS outputs 3.0 V; LICELL supports optional coin cell with internal charging circuit - maintains RTC and SRAM during main power interruption. |
| SCL, SDA, INTB, RESETBMCU | I²C bus and open-drain signals | SCL/SDA pulled up to VDDIO (1.7–3.6 V); INTB/RESETBMCU pulled up to VSNVS - ensures interoperability with i.MX 6UL GPIOs and fault signaling. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-Configured Power Sequencing | Preprogrammed startup/shutdown order and timing for i.MX 6UL + DDR3L - eliminates external sequencing IC and reduces BOM count. |
| Dynamic Voltage Scaling (DVS) | SW1 and SW2 support real-time voltage adjustment in 12.5 mV steps - enables processor DVFS for optimal power/performance trade-off in battery-powered wearables. |
| Ultra-Low Quiescent Current | 1.0 µA in ULP mode for buck regulators; <1.5 µA for LDOs in low-power mode - extends battery life in always-on sensor nodes and remote controllers. |
| Integrated Coin-Cell Charger | Charges external coin cell via LICELL pin while maintaining VSNVS 3.0 V output - provides seamless RTC backup without discrete charging circuitry. |
| Robust Input Protection | VIN withstands +22 V transients; overvoltage lockout at 6.5 V with 150 mV hysteresis - simplifies front-end design for unregulated adapter/USB inputs. |
Applications
| Wireless Game Controllers | Smart Home Gateways |
|---|---|
Use Scenario: Battery-powered handheld controller with Bluetooth LE connectivity, motion sensing, and haptic feedback. IC Role / Device Role / Timing Role: MC32PF1510A3EP supplies regulated core voltage (SW1), I/O voltage (SW2), DDR3L interface (VREFDDR), and RTC backup (VSNVS) for i.MX 6UL SoC. Use Value: DVS on SW1 enables dynamic core voltage scaling during gameplay vs. idle, reducing average system power by >35% versus fixed-voltage PMICs. | Use Scenario: Low-power residential gateway aggregating Zigbee, Z-Wave, and Wi-Fi traffic with local edge processing. IC Role / Device Role / Timing Role: MC32PF1510A3EP delivers sequenced power to i.MX 6UL CPU, DDR3L memory, and radio subsystems while maintaining RTC and secure boot integrity. Use Value: Integrated VSNVS + LICELL charging ensures uninterrupted timekeeping and firmware state retention during AC brownouts or battery swaps. |
| Industrial Edge Sensors | E-Readers with e-Ink Displays |
Use Scenario: Ruggedized environmental sensor node deployed in factory settings with wide ambient temperature swings. IC Role / Device Role / Timing Role: MC32PF1510A3EP powers i.MX 6UL application processor, analog front-end, and wireless modem across −40 °C to 105 °C operating range. Use Value: Industrial temperature rating and 22 V input tolerance eliminate need for external TVS diodes or thermal derating margins in harsh environments. | Use Scenario: Solar-charged e-reader with ultra-low standby current and fast wake-from-sleep page refresh. IC Role / Device Role / Timing Role: MC32PF1510A3EP supplies i.MX 6UL core (SW1), display driver (SW3), and memory interface (VREFDDR) with sub-µA quiescent current in ULP mode. Use Value: 1.0 µA buck quiescent current and programmable sleep modes extend battery life to >6 months on single charge. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF1510A3EP | Identical functionality and OTP configuration, but rated for −40 °C to 105 °C with enhanced thermal performance (lower RΘJA) | Same i.MX 6UL + DDR3L use case; preferred for higher ambient temperature or higher power density designs | Select MC34PF1510A3EP when board-level thermal resistance exceeds 20.6 °C/W or ambient exceeds 85 °C. |
| PF8100 | Higher integration (4 buck, 6 LDO, integrated fuel gauge), wider input (2.5–5.5 V), no coin-cell charger or VSNVS rail | Targets i.MX 8M Mini/Nano; lacks DDR3L-specific sequencing and RTC backup capability | Choose PF8100 only for new i.MX 8M designs requiring advanced battery management, not as drop-in replacement for MC32PF1510A3EP. |
Compared with MC34PF1510A3EP, the MC32PF1510A3EP offers identical i.MX 6UL + DDR3L sequencing but with slightly higher thermal resistance; versus PF8100, it provides targeted DDR3L support and VSNVS backup at lower cost and complexity for legacy i.MX 6UL platforms.
Availability
MC32PF1510A3EP is available at Aetrix Electronics and suitable for wireless game controllers, smart home gateways, industrial edge sensors, and e-readers requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MC32PF1510A3EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and associated power management.
The PF1510 product line was engineered specifically to deliver tightly integrated, OTP-configurable power solutions for NXP's i.MX 6 and i.MX 7ULP processor families, emphasizing low quiescent current, DDR memory interface support, and industrial reliability.
FAQ
What is the primary target processor and memory interface for the MC32PF1510A3EP?
The MC32PF1510A3EP is preprogrammed for the i.MX 6UL application processor with DDR3L memory interface. Its OTP configuration defines the exact power-up sequence, voltage levels, and timing for this specific combination, ensuring reliable boot and operation without external configuration.
Does the MC32PF1510A3EP support dynamic voltage scaling (DVS) on all buck converters?
No. The MC32PF1510A3EP supports DVS only on SW1 and SW2, enabling fine-grained voltage adjustment in 12.5 mV steps for processor core and I/O domains. SW3 operates in fixed-output mode (1.8–3.3 V in 100 mV steps) and does not support DVS, aligning with DDR3L VDDQ requirements.
How is RTC backup implemented in the MC32PF1510A3EP?
The MC32PF1510A3EP provides RTC backup via the VSNVS rail (3.0 V/2.0 mA) and integrated coin-cell charging circuit connected to the LICELL pin. When a coin cell is attached, the device charges it from VSYS and automatically switches to coin-cell power when main supply drops, maintaining RTC and critical registers.
What package type and thermal characteristics apply to the MC32PF1510A3EP?
The MC32PF1510A3EP uses a 40-pin QFN package (5.0 mm × 5.0 mm) with exposed thermal pad. Its junction-to-ambient thermal resistance (RΘJA) is 20.6 °C/W on a six-layer board, and it is rated for −40 °C to 105 °C ambient operation, making it suitable for thermally constrained industrial designs.
Can the MC32PF1510A3EP be used with i.MX 7ULP processors?
No. The MC32PF1510A3EP is specifically programmed for i.MX 6UL with DDR3L. For i.MX 7ULP, NXP specifies variants like MC32PF1510A2EP (LPDDR3) or MC32PF1510A4EP. Using MC32PF1510A3EP with i.MX 7ULP may result in incorrect power sequencing, voltage levels, or failure to boot due to OTP mismatch.
MC32PF1510A3EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply:
- -
- Voltage - Supply:
- 3.8V ~ 7V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-HVQFN (5x5)
MC32PF1510A3EP FAQ
1.How can I place an order for MC32PF1510A3EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF1510A3EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF1510A3EP reliable?
The price and inventory of MC32PF1510A3EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF1510A3EP is usually 5 days.
3.What payment methods are accepted for MC32PF1510A3EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF1510A3EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF1510A3EP?
MC32PF1510A3EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF1510A3EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF1510A3EP?
For technical support, including MC32PF1510A3EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF1510A3EP requirements.
6.How does Aetrix verify that MC32PF1510A3EP is sourced from the original manufacturer or authorized distributors?
All MC32PF1510A3EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF1510A3EP meets industry standards.
7.What is the process for return or replacement of MC32PF1510A3EP?
All MC32PF1510A3EP units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF1510A3EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF1510A3EP part is unused and in its original packaging.
Return procedure for MC32PF1510A3EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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