My Inquiry
My Account
NXP Semiconductors MC32PF1510A4EPR2
- Part No.:
- MC32PF1510A4EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MC32PF1510A4EPR2.pdf
- Description:
- PF1510
- Quantity:
- Payment:
- Shipping:
Inventory:3,376
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC32PF1510A4EPR2 from NXP Semiconductors is a preprogrammed power management IC (PMIC) optimized for i.MX 7ULP processors with LPDDR3 memory in low-power IoT and wearable systems. It integrates three 1.0 A buck converters, three LDOs (including USB_PHY and always-on LDO2P7), DDR reference (VREFDDR), RTC supply (VSNVS), coin cell charger, and OTP-configurable power sequencing - delivering full-system power for application processors, memory, and peripherals.
For engineers reviewing the MC32PF1510A4EPR2 datasheet, MC32PF1510A4EPR2 pinout, MC32PF1510A4EPR2 application, or MC32PF1510A4EPR2 equivalent, key selection criteria include its i.MX 7ULP–LPDDR3–specific OTP configuration, 40-pin QFN package with exposed pad, −40 °C to 105 °C industrial temperature rating, I²C programmability, and dynamic voltage scaling on SW1/SW2.
Technical Context
The MC32PF1510A4EPR2 implements a multi-rail PMIC architecture with dedicated regulators for core (SW1), GPU/memory I/O (SW2), and peripheral/IO (SW3) domains, plus analog/digital domain supplies (VCORE, VDIG), real-time clock backup (VSNVS), and DDR reference (VREFDDR). Its OTP memory stores startup/shutdown sequences, voltage setpoints, and DVS profiles tailored to i.MX 7ULP + LPDDR3 timing and voltage requirements.
It features a front-end LDO accepting 4.1–6.0 V input (with 22 V transient tolerance), supports forced PWM and adaptive variable-frequency operation per buck stage, delivers <1.0 µA quiescent current in ULP mode, and includes integrated watchdog, interrupt, reset, and standby control logic for seamless processor co-management via I²C interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4.1 V to 6.0 V (VIN); withstands DC/transient up to +22 V - enables robust USB/adapter input handling without external protection |
| Buck Converters | SW1 & SW2: 0.6–1.3875 V (12.5 mV steps) or 1.1–3.3 V (variable), 1.0 A, DVS-capable; SW3: 1.8–3.3 V (100 mV steps), 1.0 A - powers CPU core, GPU/memory I/O, and peripherals independently |
| LDO Outputs | LDO1/LDO3: 0.75–1.5 V / 1.8–3.3 V, 300 mA with load switch; LDO2: 1.8–3.3 V, 400 mA; LDO2P7: 2.7 V, 5 mA always-on; USBPHY: 3.3 V or 4.9 V, 60 mA - supports mixed-voltage SoC interfaces and PHY biasing |
| VREFDDR & VSNVS | VREFDDR: 0.5–0.9 V, 10 mA - meets JEDEC LPDDR3 reference accuracy; VSNVS: 3.0 V, 2.0 mA - provides RTC backup with coin-cell charging capability |
| OTP Configuration | Preprogrammed for i.MX 7ULP with LPDDR3 (Program Code A4) - eliminates runtime configuration overhead and ensures validated power-up sequence for target platform |
| Operating Temperature | −40 °C to 105 °C - qualified for industrial-grade embedded and wearable applications requiring extended thermal reliability |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) compatible - enables host processor control of voltage, sequencing, and mode transitions during runtime |
Pinout & Package
MC32PF1510A4EPR2 is housed in a 40-pin QFN package (5.0 mm × 5.0 mm, 0.5 mm pitch) with exposed thermal pad (EPAD). The package supports high-density PCB layouts and efficient thermal dissipation via inner/outer ground plane vias to the EPAD.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1IN / SW2IN / SW3IN | Buck input supply nodes | Accept VSYS (2.5–4.5 V); require local 0.1 µF + 4.7 µF bypassing - define input path for each regulator stage |
| SW1FB / SW2FB / SW3FB | Voltage feedback inputs | Connect near load to minimize trace impedance errors - enable precise output regulation under dynamic load conditions |
| VLDO1 / VLDO2 / VLDO3 | LDO output terminals | Each requires dedicated ceramic output capacitor (4.7 µF or 10 µF) - ensure stability and transient response for sensitive digital/analog rails |
| VSNVS | RTC backup supply output | Bypassed with 0.47 µF capacitor - maintains real-time clock and SRAM retention during main power loss |
| SCL / SDA | I²C communication lines | Pulled up to VDDIO (1.7–3.6 V); support standard/fast-mode - provide bidirectional configuration and monitoring interface |
| INTB / RESETBMCU | Open-drain status outputs | Pull-up to VSNVS or ≤VDDIO rail - signal fault conditions, power-good status, or reset requests to host processor |
| EPAD (Pin 41) | Thermal and electrical ground | Mandatory connection to PCB ground planes via multiple vias - critical for thermal performance and noise suppression in buck switching paths |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmed i.MX 7ULP + LPDDR3 power sequence | Eliminates firmware initialization delay and guarantees correct voltage ramp order, timing, and hold conditions for boot-critical memory interface |
| Dynamic Voltage Scaling on SW1/SW2 | Enables real-time core voltage adjustment during CPU frequency scaling - reduces active power by up to 40% in burst-workload scenarios |
| Front-end LDO with 22 V transient tolerance | Withstands automotive-grade load-dump surges and USB hot-plug transients without external TVS - simplifies input protection design |
| Ultra-low-quiescent-current ULP mode | 1.0 µA total system quiescent current (buck + LDOs) - extends battery life in always-on sensor nodes and wearables beyond 3 months on a single coin cell |
| Integrated DDR VREF and RTC supply | VREFDDR accuracy ±2% over temp/load; VSNVS stable at 3.0 V ±3% - meets LPDDR3 JEDEC AC/DC specifications without external components |
| USBPHY LDO with 4.9 V option | Directly powers USB 2.0 PHY circuits requiring 4.9 V nominal - avoids need for discrete charge pump or boost converter in portable USB hosts |
Applications
| Smart Wearables | Industrial IoT Gateways |
|---|---|
Use Scenario: Compact wrist-worn health monitor with i.MX 7ULP, LPDDR3, BLE, and optical sensors. IC Role / Device Role / Timing Role: Single-chip power source for processor core (SW1), memory I/O (SW2), display/USB (SW3), sensor bias (LDO2), and RTC (VSNVS). Use Value: Enables 7-day battery life via ULP mode and DVS; OTP configuration ensures reliable cold-boot from deep sleep without host intervention. | Use Scenario: Ruggedized edge gateway deploying i.MX 7ULP in factory automation, with RS-485, CAN, and Wi-Fi modules. IC Role / Device Role / Timing Role: Centralized power manager providing isolated, sequenced rails for SoC, DDR, PHYs, and interface controllers across −40 °C to 105 °C. Use Value: Industrial temperature rating and 22 V input tolerance eliminate external surge protection; VREFDDR/VSNVS integration reduces BOM count by 2 components. |
| POS Terminals | E-Readers |
Use Scenario: Battery-backed retail POS terminal using i.MX 7ULP, LPDDR3, eMMC, and touchscreen controller. IC Role / Device Role / Timing Role: Powers application processor (SW1), memory bus (SW2), display backlight driver (SW3), and secure element (LDO1). Use Value: Preprogrammed A4 OTP guarantees boot compatibility with NXP's i.MX 7ULP reference design; coin-cell charger maintains transaction logs during AC failure. | Use Scenario: Solar-charged e-reader with i.MX 7ULP, LPDDR3, and E Ink display. IC Role / Device Role / Timing Role: Supplies core (SW1), memory (SW2), display driver (SW3), and always-on wake-up circuitry (LDO2P7, VSNVS). Use Value: 1.0 µA ULP mode extends shelf life; USBPHY LDO supports onboard USB-C charging and debug without secondary regulator. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF1510A4EPR2 | Same silicon, −40 °C to 85 °C consumer temperature grade; identical OTP code A4 and pinout | Targeted for cost-sensitive consumer wearables and e-readers where extended industrial temp is unnecessary | Select when ambient operating temperature remains below 85 °C and qualification to industrial standards is not required |
| PF8200A0EP | Different architecture: dual-core PMIC with higher current bucks (2.5 A), no OTP, requires full I²C configuration; supports i.MX 8M Mini | Designed for higher-performance applications requiring >1 A core rails and advanced thermal management | Choose only if migrating to i.MX 8M platform or needing >1.0 A per buck; not drop-in compatible with PF1510 footprint or firmware |
Compared with MC32PF1510A4EPR2, MC33PF1510A4EPR2 offers identical functionality at lower temperature grade and cost, while PF8200A0EP targets next-generation i.MX 8M designs with higher power and configurability - neither replaces the A4 OTP's validated i.MX 7ULP + LPDDR3 boot sequence.
Availability
MC32PF1510A4EPR2 is available at Aetrix Electronics and suitable for smart wearables, industrial IoT gateways, and battery-powered POS terminals requiring stable component supply, long-term lifecycle support, and guaranteed OTP configuration for i.MX 7ULP platforms.
Supply support for MC32PF1510A4EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based application processors and power management.
The PF1510 product line was designed specifically to deliver highly integrated, OTP-optimized power solutions for NXP's i.MX ultra-low-power application processors - reducing system complexity and accelerating time-to-market for battery-constrained edge devices.
FAQ
What is the OTP programming configuration of MC32PF1510A4EPR2?
MC32PF1510A4EPR2 is factory-programmed with OTP code A4, which configures it specifically for i.MX 7ULP processors paired with LPDDR3 memory. This includes validated startup/shutdown sequences, voltage setpoints for SW1/SW2/SW3, DVS profiles, and timing parameters aligned with i.MX 7ULP boot requirements - no runtime I²C reconfiguration is needed for basic operation.
Does MC32PF1510A4EPR2 support dynamic voltage scaling (DVS)?
Yes, MC32PF1510A4EPR2 supports DVS on buck regulators SW1 and SW2, enabling real-time adjustment of output voltage in 12.5 mV steps between 0.6 V and 1.3875 V. This feature is enabled by default in the A4 OTP configuration and allows the i.MX 7ULP processor to scale core voltage dynamically with frequency, reducing active power consumption during variable-workload operation.
What is the maximum input voltage tolerance for MC32PF1510A4EPR2?
MC32PF1510A4EPR2's VIN pin withstands transient and DC inputs from 0 V up to +22 V, with an overvoltage lockout threshold of 6.5 V (typical). This robust input tolerance allows direct connection to unregulated USB or adapter sources without external surge protection, making it suitable for portable and industrial environments with unstable input rails.
How does MC32PF1510A4EPR2 manage ultra-low-power operation?
MC32PF1510A4EPR2 achieves 1.0 µA quiescent current in ULP mode by disabling switching activity in all bucks, placing LDOs in low-power state, and retaining only essential logic (RTC, watchdog, I²C interface). This mode is activated automatically during processor standby and sustains VSNVS, LDO2P7, and register state - enabling weeks-long battery life in always-on sensor nodes.
Is MC32PF1510A4EPR2 pin-compatible with other PF1510 variants?
Yes, all PF1510 variants - including MC32PF1510A4EPR2 - share identical 40-pin QFN packaging, pinout, and mechanical footprint. Differences are limited to OTP programming (A0–A7), temperature grade (MC32 = industrial, MC33 = consumer), and tape-and-reel suffix (R2). No PCB layout change is required when substituting between same-package variants.
MC32PF1510A4EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply:
- -
- Voltage - Supply:
- 3.8V ~ 7V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-HVQFN (5x5)
MC32PF1510A4EPR2 FAQ
1.How can I place an order for MC32PF1510A4EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF1510A4EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF1510A4EPR2 reliable?
The price and inventory of MC32PF1510A4EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF1510A4EPR2 is usually 5 days.
3.What payment methods are accepted for MC32PF1510A4EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF1510A4EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF1510A4EPR2?
MC32PF1510A4EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF1510A4EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF1510A4EPR2?
For technical support, including MC32PF1510A4EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF1510A4EPR2 requirements.
6.How does Aetrix verify that MC32PF1510A4EPR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF1510A4EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF1510A4EPR2 meets industry standards.
7.What is the process for return or replacement of MC32PF1510A4EPR2?
All MC32PF1510A4EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF1510A4EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF1510A4EPR2 part is unused and in its original packaging.
Return procedure for MC32PF1510A4EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC32PF1510A4EPR2 Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
