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NXP Semiconductors MC32PF1510A6EP
- Part No.:
- MC32PF1510A6EP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MC32PF1510A6EP.pdf
- Description:
- POWER MANAGEMENT IC 3 BUCK REGS
- Quantity:
- Payment:
- Shipping:
Inventory:2,474
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Product details
Overview
MC32PF1510A6EP from NXP Semiconductors is a preprogrammed power management IC (PMIC) optimized for i.MX 6ULL processors with DDR3L memory, delivering three 1.0 A buck converters (SW1–SW3), three LDOs (LDO1–LDO3), VSNVS RTC supply (3.0 V/2.0 mA), DDR reference (VREFDDR, 0.5–0.9 V), and I²C programmability. It supports low-power IoT, smart wearables, and industrial embedded systems requiring tight voltage regulation and dynamic voltage scaling.
For engineers reviewing the MC32PF1510A6EP datasheet, MC32PF1510A6EP pinout, MC32PF1510A6EP application, or MC32PF1510A6EP equivalent, key selection considerations include its OTP-configured startup sequence for i.MX 6ULL+DDR3L, −40 °C to 105 °C industrial temperature rating, QFN40 5.0 mm × 5.0 mm package with exposed pad, and integrated coin-cell charger with VSNVS always-on capability.
Technical Context
The MC32PF1510A6EP implements a dedicated power architecture for i.MX 6ULL SoCs, featuring DVS-capable SW1/SW2 (0.6–1.3875 V in 12.5 mV steps) and fixed-output SW3 (1.8–3.3 V). Its front-end LDO accepts 4.1–6.0 V input and withstands up to +22 V transients, while internal OTP memory stores device-specific boot sequencing, voltage setpoints, and soft-start timing.
It integrates dual-mode operation-normal power mode (peak efficiency >90 % at 400 mA) and ultra-low-power (ULP) mode (quiescent current ≤1.0 μA per buck)-with programmable I²C interface (1.7–3.6 V VDDIO), watchdog timer (80 s period), and hardware control signals (PWRON, STANDBY, ONKEY, RESETBMCU) for full system power state orchestration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4.1 V to 6.0 V (VIN); withstands DC/transient up to +22 V - enables robust USB/adapter input handling without external protection |
| Buck Converters | SW1 & SW2: 1.0 A, 0.6–1.3875 V (DVS), 12.5 mV steps; SW3: 1.0 A, 1.8–3.3 V (no DVS), 100 mV steps - powers CPU core, GPU, and I/O rails separately |
| LDO Outputs | LDO1/LDO3: 300 mA, 0.75–3.3 V; LDO2: 400 mA, 1.8–3.3 V; LDO2P7: 2.7 V/5.0 mA always-on - supplies analog peripherals, USB PHY, and SNVS domain |
| VREFDDR & VSNVS | VREFDDR: 0.5–0.9 V/10 mA (DDR memory reference); VSNVS: 3.0 V/2.0 mA (RTC backup) - ensures accurate DDR termination and real-time clock retention |
| Operating Temperature | −40 °C to 105 °C - qualified for industrial-grade embedded applications including home automation and POS terminals |
| Package | QFN40, 5.0 mm × 5.0 mm, 0.5 mm pitch, exposed thermal pad - enables high-density PCB layout with efficient heat dissipation via multi-via grounding |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) compatible; VDDIO 1.7–3.6 V - allows direct connection to i.MX 6ULL GPIOs without level-shifting |
Pinout & Package
MC32PF1510A6EP uses a 40-pin QFN package (5.0 mm × 5.0 mm, 0.5 mm pitch) with an exposed thermal pad (EPAD, Pin 41) connected to ground for thermal management. Pin functions are validated per NXP PF1510 datasheet Rev. 4 (2021).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1IN (Pin 26) | Buck 1 input supply | Accepts VSYS (2.5–4.5 V); requires 0.1 µF + 4.7 µF local decoupling - feeds high-efficiency core voltage regulator |
| SW1FB (Pin 27) | Buck 1 feedback node | Connects near load to close regulation loop; sets output via resistor divider - enables precise 0.6–1.3875 V DVS for i.MX 6ULL ARM core |
| LDO2P7 (Pin 38) | Always-on 2.7 V regulator output | Mandatory 2.2 µF bypass to ground - powers SNVS domain and maintains RTC during deep sleep |
| VSNVS (Pin 30) | RTC supply output | 0.47 µF bypass required; supports coin-cell backup - sustains real-time clock and secure non-volatile storage |
| PWRON (Pin 6) | Power-on request input | Pull-up to VSNVS; triggers PMIC enable sequence - initiates controlled boot of i.MX 6ULL SoC |
| INTB (Pin 9) | Open-drain interrupt output | Pull-up to VSNVS or VDDIO; signals fault/ready events - alerts processor to overvoltage, thermal warning, or regulator ready status |
Key Features
| Feature | Design Value |
|---|---|
| OTP-Configured i.MX 6ULL Boot Sequence | Preprogrammed startup order, timing, and voltage ramp rates eliminate external configuration EEPROM and reduce BOM count |
| Dual-Mode Buck Regulation | Forced PWM (fixed-frequency) and adaptive variable-frequency modes optimize efficiency across 1 mA–1 A load range |
| VIN Transient Withstand | Withstands +22 V DC/transient on VIN pin - eliminates need for external TVS diodes in USB-powered designs |
| Integrated Coin-Cell Charger | Charges backup battery via LICELL pin while regulating VSNVS - enables seamless RTC operation during main power loss |
| Ultra-Low Quiescent Current | 1.0 μA per buck in ULP mode - extends battery life in always-on IoT sensors and wearable devices |
Applications
| Smart Wearables | Industrial IoT Gateways |
|---|---|
Use Scenario: Compact fitness tracker with i.MX 6ULL, BLE, and motion sensors operating on single-cell Li-ion. IC Role / Device Role / Timing Role: MC32PF1510A6EP delivers regulated core (SW1), I/O (SW3), DDR (VREFDDR), and RTC (VSNVS) voltages while managing sleep/wake transitions via STANDBY and PWRON. Use Value: Enables 14-day battery life via ULP buck mode (1.0 μA IQ) and integrated coin-cell backup for timekeeping during charging gaps. | Use Scenario: DIN-rail mounted edge gateway aggregating Modbus RTU sensors in factory automation. IC Role / Device Role / Timing Role: MC32PF1510A6EP powers i.MX 6ULL CPU, DDR3L memory, and isolated RS-485 transceivers, with VSNVS maintaining system clock across AC brownouts. Use Value: −40 °C to 105 °C rating and 22 V VIN tolerance ensure reliable operation in unconditioned industrial enclosures. |
| POS Terminals | Home Automation Hubs |
Use Scenario: Battery-backed retail terminal with touchscreen, barcode scanner, and thermal printer. IC Role / Device Role / Timing Role: MC32PF1510A6EP supplies 1.1 V core (SW1), 3.3 V I/O (SW3), 1.8 V USB PHY (USBPHY), and 3.0 V RTC (VSNVS), coordinated via I²C for dynamic power scaling. Use Value: DVS on SW1/SW2 reduces active power by 22 % during idle scanning, extending hot-swap battery runtime. | Use Scenario: Voice-controlled smart hub with Zigbee/Z-Wave radios, microphone array, and Wi-Fi coexistence. IC Role / Device Role / Timing Role: MC32PF1510A6EP powers i.MX 6ULL application processor, LPDDR3 memory, and RF front-ends using independent LDOs (LDO2, LDO3) and bucks (SW2, SW3). Use Value: Independent LDO outputs prevent noise coupling between audio ADC and RF sections, improving SNR by ≥18 dB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF1510A6EP | Identical electrical specs and pinout; rated for −40 °C to 105 °C industrial temp (same as MC32PF1510A6EP) | Same i.MX 6ULL+DDR3L OTP configuration; differs only in part prefix indicating alternate wafer lot/test flow | Select MC34PF1510A6EP when dual-sourcing or extended traceability is required for industrial production |
| PF8100A0EP | Higher integration: adds 2x additional bucks, 2x additional LDOs, and PMIC health monitoring; larger 48-pin QFN package | Targeted at i.MX 8M Mini/Plus; not OTP-matched to i.MX 6ULL; requires full schematic redesign | Choose PF8100A0EP only for new i.MX 8M designs needing expanded rail count and telemetry - not a drop-in replacement |
Compared with MC32PF1510A6EP, MC34PF1510A6EP offers identical functionality and qualification for i.MX 6ULL systems, while PF8100A0EP provides greater scalability at the cost of board redesign and firmware adaptation - making MC32PF1510A6EP optimal for cost-sensitive, volume-deployed i.MX 6ULL platforms.
Availability
MC32PF1510A6EP is available at Aetrix Electronics and suitable for industrial IoT gateways, smart wearables, and POS terminals requiring stable component supply across long product lifecycles and temperature extremes.
Supply support for MC32PF1510A6EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of embedded processing expertise.
The PF1510 product line delivers highly integrated, application-optimized PMICs for NXP's i.MX application processors, designed to minimize external components, simplify power sequencing, and extend battery life in portable and edge-connected devices.
FAQ
What is the primary target processor for MC32PF1510A6EP?
The MC32PF1510A6EP is specifically preprogrammed for the i.MX 6ULL processor with DDR3L memory interface, as confirmed in Table 1 of the PF1510 datasheet. Its OTP configuration defines the exact power-up sequence, voltage setpoints, and timing parameters required for reliable i.MX 6ULL boot and operation - it is not field-reprogrammable for other SoCs without hardware modification.
Does MC32PF1510A6EP support dynamic voltage scaling (DVS)?
Yes, MC32PF1510A6EP supports DVS on SW1 and SW2 buck converters, enabling real-time adjustment of output voltage in 12.5 mV steps between 0.6 V and 1.3875 V. This feature is used to dynamically match the i.MX 6ULL ARM core voltage to its operating frequency, reducing active power consumption during variable workload conditions.
What is the maximum input voltage MC32PF1510A6EP can withstand on the VIN pin?
MC32PF1510A6EP can withstand transient and DC inputs up to +22 V on the VIN pin, as specified in Section 1.1 of the datasheet. This robustness eliminates the need for external overvoltage protection circuitry when interfacing with unregulated USB or adapter sources, simplifying front-end design.
How is the RTC supply implemented in MC32PF1510A6EP?
MC32PF1510A6EP provides RTC functionality through the VSNVS pin (Pin 30), delivering a regulated 3.0 V output at 2.0 mA. It supports coin-cell backup via the LICELL pin and remains active in all power states, including deep sleep and power-off, ensuring continuous timekeeping and secure non-volatile storage retention.
What package type and thermal characteristics does MC32PF1510A6EP use?
MC32PF1510A6EP uses a 40-pin QFN package (5.0 mm × 5.0 mm, 0.5 mm pitch) with an exposed thermal pad. Its junction-to-board thermal resistance (RΘJB) is 8.8 °C/W, and junction-to-ambient (RΘJA) is 20.6 °C/W on a six-layer board - enabling reliable operation at full load in industrial ambient temperatures up to 105 °C.
MC32PF1510A6EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply:
- -
- Voltage - Supply:
- 4.1V ~ 6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-HVQFN (5x5)
MC32PF1510A6EP FAQ
1.How can I place an order for MC32PF1510A6EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF1510A6EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF1510A6EP reliable?
The price and inventory of MC32PF1510A6EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF1510A6EP is usually 5 days.
3.What payment methods are accepted for MC32PF1510A6EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF1510A6EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF1510A6EP?
MC32PF1510A6EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF1510A6EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF1510A6EP?
For technical support, including MC32PF1510A6EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF1510A6EP requirements.
6.How does Aetrix verify that MC32PF1510A6EP is sourced from the original manufacturer or authorized distributors?
All MC32PF1510A6EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF1510A6EP meets industry standards.
7.What is the process for return or replacement of MC32PF1510A6EP?
All MC32PF1510A6EP units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF1510A6EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF1510A6EP part is unused and in its original packaging.
Return procedure for MC32PF1510A6EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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