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NXP Semiconductors MC32PF1510A6EPR2
- Part No.:
- MC32PF1510A6EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MC32PF1510A6EPR2.pdf
- Description:
- PF1510
- Quantity:
- Payment:
- Shipping:
Inventory:2,782
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Product details
Overview
MC32PF1510A6EPR2 from NXP Semiconductors is a power management IC (PMIC) engineered for i.MX 6ULL processors with DDR3L memory in low-power IoT and wearable systems. It integrates three 1.0 A buck converters (SW1–SW3), three LDOs (LDO1–LDO3), VSNVS (3.0 V/2.0 mA), VREFDDR (0.5–0.9 V/10 mA), USB_PHY LDO, and OTP-configurable power sequencing.
For engineers reviewing the MC32PF1510A6EPR2 datasheet, MC32PF1510A6EPR2 pinout, MC32PF1510A6EPR2 application, or MC32PF1510A6EPR2 equivalent, this page delivers verified regulator output ranges, I²C programmability, thermal ratings up to 105 °C, and confirmed compatibility with i.MX 6ULL + DDR3L reference designs.
Technical Context
The MC32PF1510A6EPR2 implements a multi-rail PMIC architecture with dedicated regulators for processor core (SW1/SW2 DVS-capable), I/O (SW3), memory interface (VREFDDR), real-time clock (VSNVS), and USB PHY biasing. Its OTP memory stores preprogrammed startup/shutdown sequences optimized for i.MX 6ULL with DDR3L timing and voltage requirements.
It supports dynamic voltage scaling on SW1 and SW2 for ARM core power optimization, operates across −40 °C to 105 °C, and uses a 40-pin QFN (5.0 mm × 5.0 mm) with exposed thermal pad. Input tolerance extends to +22 V DC transients on VIN, while VSYS accepts 2.5–4.5 V for buck regulation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VIN Range | 4.1 V to 6.0 V nominal; withstands 0–22 V DC transients - enables robust USB/adapter input handling without external protection. |
| SW1/SW2 Output | 0.6–1.3875 V (12.5 mV steps) or 1.1–3.3 V (variable steps); DVS support - matches i.MX 6ULL core voltage scaling profiles. |
| SW3 Output | 1.8–3.3 V (100 mV steps); no DVS - supplies stable I/O voltage for DDR3L interfaces and peripherals. |
| VREFDDR Range | 0.5–0.9 V @ 10 mA - precisely tracks half-VDDQ for DDR3L reference compliance. |
| VSNVS Output | 3.0 V @ 2.0 mA - powers RTC and maintains state during deep sleep with coin-cell backup capability. |
| Quiescent Current | 1.0 μA in ULP mode (SW1/SW2) - minimizes battery drain in always-on IoT edge nodes. |
| OTP Configuration | Preprogrammed for i.MX 6ULL + DDR3L (Program Code A6) - eliminates runtime configuration overhead and ensures validated power-up timing. |
Pinout & Package
MC32PF1510A6EPR2 is housed in a 40-pin QFN package (5.0 mm × 5.0 mm) with exposed thermal pad (EPAD), optimized for thermal dissipation in space-constrained portable designs. Pin count and layout match NXP's PF1510 family standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Main IC supply input | Accepts 5.0 V adapter/USB source; bypassed with 2.2 µF capacitor - primary high-voltage input path to front-end LDO. |
| VSYS | Main system input to buck regulators | Supplies SW1/SW2/SW3, LDOs, and analog core; requires 2×22 µF or 47 µF bulk capacitance - defines regulated rail foundation. |
| SW1FB / SW2FB / SW3FB | Voltage feedback inputs | Connect directly to respective output rails near load - enables precise closed-loop regulation and transient response tuning. |
| VREFDDR / VINREFDDR | DDR reference generator | VREFDDR outputs half of VINREFDDR; VINREFDDR must have ≥1.0 µF net capacitance - ensures DDR3L VTT tracking accuracy. |
| VSNVS | RTC and always-on supply | 3.0 V output with 0.47 µF bypass; supports coin-cell backup via LICELL - maintains timekeeping and secure state during main power loss. |
| SCL / SDA | I²C interface | Operates at 1.7–3.6 V; pulled up to VDDIO - enables runtime reconfiguration, status monitoring, and fault reporting. |
| EPAD | Thermal and ground return | Must connect to inner/external ground planes via multiple vias - critical for thermal performance and EMI control in high-efficiency switching operation. |
Key Features
| Feature | Design Value |
|---|---|
| Three 1.0 A buck converters with DVS on SW1/SW2 | Enables adaptive core voltage scaling for i.MX 6ULL CPU clusters, reducing dynamic power by >30% vs fixed-voltage operation. |
| OTP-programmed startup sequence (A6 code) | Guarantees correct power-up order for i.MX 6ULL + DDR3L: VCORE → VDDIO → VREFDDR → peripherals - prevents latch-up or initialization failure. |
| VSNVS + LICELL integration | Provides seamless RTC backup with integrated coin-cell charging circuit - eliminates need for external battery management components. |
| USB_PHY LDO (4.9 V or 3.3 V, 60 mA) | Directly powers USB 2.0 PHY with <350 mV dropout and 75 dB PSRR - meets USB electrical compliance without external filtering. |
| −40 °C to 105 °C operating range | Validated for industrial-grade embedded applications including smart home gateways and ruggedized wearables - no derating required at full temperature span. |
Applications
| Smart Home Sensor Hub | Industrial Wearable Monitor |
|---|---|
Use Scenario: Battery-powered Zigbee/Z-Wave gateway aggregating temperature, motion, and door sensors in HVAC or security systems. IC Role / Device Role / Timing Role: MC32PF1510A6EPR2 supplies i.MX 6ULL application processor, DDR3L memory, and wireless SoC peripherals with synchronized power sequencing. Use Value: Ultra-low 1.0 μA ULP quiescent current extends 2xAA battery life to >2 years; VSNVS retains time and network keys during brownouts. | Use Scenario: Ruggedized wrist-worn device monitoring vital signs in factory or field environments with ambient temperatures up to 105 °C. IC Role / Device Role / Timing Role: MC32PF1510A6EPR2 delivers regulated rails to i.MX 6ULL, analog front-end, and BLE radio while managing thermal headroom via EPAD grounding. Use Value: 105 °C rating and 8.8 °C/W junction-to-board thermal resistance ensure stable operation under continuous sensor sampling and RF transmission loads. |
| POS Terminal with e-Ink Display | Low-Power Edge Gateway |
Use Scenario: Portable point-of-sale terminal using e-Ink display, barcode scanner, and contactless payment module powered by single-cell Li-ion. IC Role / Device Role / Timing Role: MC32PF1510A6EPR2 powers i.MX 6ULL CPU, DDR3L, e-Ink controller, and secure element with programmable standby/sleep modes. Use Value: Dynamic voltage scaling on SW1/SW2 reduces CPU active power by 40%; LDO2P7 (2.7 V/5 mA) supplies always-on secure crypto engine. | Use Scenario: Cellular-connected edge node performing local AI inference and MQTT telemetry upload in remote infrastructure monitoring. IC Role / Device Role / Timing Role: MC32PF1510A6EPR2 manages power to i.MX 6ULL, LPDDR3 memory, LTE modem, and environmental sensors with I²C-based runtime voltage adjustment. Use Value: Preprogrammed A6 OTP config ensures deterministic boot timing for OTA firmware updates; SW3's 92% efficiency at 400 mA minimizes heat in sealed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF1510A6EP | Same functional spec, rated for −40 °C to 105 °C industrial temp range; identical pinout and OTP code A6. | Designed for extended-temperature industrial deployments where ambient exceeds 85 °C. | Select MC34PF1510A6EP when board-level thermal design cannot guarantee junction temperature stays below 125 °C at 105 °C ambient. |
| PF8100A0EP | Higher integration: adds 2x additional bucks, 2x additional LDOs, and PMIC watchdog; different pinout and OTP structure. | Targeted at i.MX 8M Mini/Plus platforms requiring more rails and advanced safety features. | Choose PF8100A0EP only when migrating to newer i.MX 8M processors - not a drop-in replacement for i.MX 6ULL systems. |
Compared with MC32PF1510A6EPR2, MC34PF1510A6EP offers identical functionality with enhanced thermal qualification, while PF8100A0EP provides expanded rail count and safety features but requires PCB redesign and firmware adaptation.
Availability
MC32PF1510A6EPR2 is available at Aetrix Electronics and suitable for smart home sensor hubs, industrial wearables, and POS terminals requiring stable component supply with guaranteed long-term lifecycle support.
Supply support for MC32PF1510A6EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 30 years of embedded processing expertise.
The PF1510 product line was designed specifically to deliver compact, OTP-configured power management for NXP's i.MX low-power application processors - enabling rapid system integration with minimal external components.
FAQ
What is the primary target processor for MC32PF1510A6EPR2?
The MC32PF1510A6EPR2 is preprogrammed with OTP code A6 specifically for the i.MX 6ULL processor with DDR3L memory interface. Its power sequencing, voltage ranges, and timing parameters are validated against NXP's i.MX 6ULL reference designs, ensuring reliable boot and operation without custom configuration.
Does MC32PF1510A6EPR2 support dynamic voltage scaling (DVS)?
Yes, MC32PF1510A6EPR2 supports DVS on SW1 and SW2 buck converters, allowing real-time adjustment of output voltage in 12.5 mV steps between 0.6 V and 1.3875 V. This feature is essential for optimizing power consumption of the i.MX 6ULL ARM Cortex-A7 cores during varying workload conditions.
What is the function of the VREFDDR and VINREFDDR pins on MC32PF1510A6EPR2?
VREFDDR outputs a precision voltage equal to half of VINREFDDR, supporting DDR3L memory reference requirements. VINREFDDR must be supplied with ≥1.0 µF net capacitance to ground, and VREFDDR itself is rated for 0.5–0.9 V at 10 mA - ensuring accurate VTT tracking for stable DDR3L interface operation in MC32PF1510A6EPR2-based systems.
Can MC32PF1510A6EPR2 operate from a single-cell Li-ion battery?
No - MC32PF1510A6EPR2 requires a 4.1–6.0 V input on VIN for its front-end LDO and a 2.5–4.5 V VSYS supply for internal regulators. A single-cell Li-ion (2.7–4.2 V) cannot meet the VIN requirement. Systems must use a boost converter or dual-cell configuration to generate the required 5 V input for MC32PF1510A6EPR2.
Is MC32PF1510A6EPR2 pin-compatible with other PF1510 variants?
Yes, all PF1510 variants - including MC32PF1510A6EPR2 - share identical 40-pin QFN packaging, pinout, and mechanical footprint. Differences exist only in OTP programming (e.g., A6 for i.MX 6ULL+DDR3L) and temperature grade (MC32 = consumer 85 °C, MC34 = industrial 105 °C), enabling hardware reuse across product tiers.
MC32PF1510A6EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply:
- -
- Voltage - Supply:
- 3.8V ~ 7V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-HVQFN (5x5)
MC32PF1510A6EPR2 FAQ
1.How can I place an order for MC32PF1510A6EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF1510A6EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF1510A6EPR2 reliable?
The price and inventory of MC32PF1510A6EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF1510A6EPR2 is usually 5 days.
3.What payment methods are accepted for MC32PF1510A6EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF1510A6EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF1510A6EPR2?
MC32PF1510A6EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF1510A6EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF1510A6EPR2?
For technical support, including MC32PF1510A6EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF1510A6EPR2 requirements.
6.How does Aetrix verify that MC32PF1510A6EPR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF1510A6EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF1510A6EPR2 meets industry standards.
7.What is the process for return or replacement of MC32PF1510A6EPR2?
All MC32PF1510A6EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF1510A6EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF1510A6EPR2 part is unused and in its original packaging.
Return procedure for MC32PF1510A6EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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