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NXP Semiconductors MC32PF1510A7EP
- Part No.:
- MC32PF1510A7EP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MC32PF1510A7EP.pdf
- Description:
- PF1510 - POWER MANAGEMENT IC, 3
- Quantity:
- Payment:
- Shipping:
Inventory:490
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Product details
Overview
MC32PF1510A7EP from NXP Semiconductors is a power management IC (PMIC) engineered for i.MX 6UL application processors with LPDDR2 memory in consumer-grade portable IoT and wearable devices. It integrates three 1.0 A buck converters (SW1–SW3), three LDOs (LDO1–LDO3), VSNVS RTC supply (3.0 V/2.0 mA), DDR reference (VREFDDR, 0.5–0.9 V), and I²C programmable control - delivering full-system power for processor cores, memory, and peripherals.
For engineers reviewing the MC32PF1510A7EP datasheet, MC32PF1510A7EP pinout, MC32PF1510A7EP application, or MC32PF1510A7EP equivalent, key selection criteria include its −40 °C to +85 °C operating range, OTP-configurable startup/power-down sequences, dynamic voltage scaling on SW1/SW2, 1.0 µA quiescent current in ULP mode, and QFN40 5.0 mm × 5.0 mm package with exposed thermal pad.
Technical Context
The MC32PF1510A7EP implements a digitally controlled, OTP-programmed power architecture optimized for low-power i.MX 6UL systems. Its front-end LDO accepts 4.1–6.0 V input (with 22 V transient tolerance), feeding VSYS to supply all internal regulators. SW1 and SW2 support DVS with 12.5 mV step resolution in core voltage ranges (0.6–1.3875 V), while SW3 delivers fixed 1.8–3.3 V outputs without DVS.
Regulator sequencing, soft-start timing, and voltage setpoints are stored in one-time programmable (OTP) memory and executed by an integrated state machine. The device supports I²C-based runtime configuration of standby/sleep/off modes and provides dedicated rails including USB_PHY (4.9 V or 3.3 V), LDO2P7 (2.7 V/5.0 mA always-on), and coin-cell charging via LICELL.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4.1 V to 6.0 V (VIN); withstands DC/transient up to +22 V - enables robust USB/adapter input handling |
| Buck Converters | SW1/SW2: 1.0 A, 0.6–1.3875 V (DVS) or 1.1–3.3 V; SW3: 1.0 A, 1.8–3.3 V - powers CPU core, GPU, and I/O rails |
| LDO Outputs | LDO1/LDO3: 300 mA, 0.75–3.3 V w/ load switch; LDO2: 400 mA, 1.8–3.3 V; LDO2P7: 2.7 V/5.0 mA always-on - supports peripheral biasing and retention |
| VREFDDR & VSNVS | VREFDDR: 0.5–0.9 V/10 mA for DDR memory termination; VSNVS: 3.0 V/2.0 mA RTC backup - ensures memory interface stability and real-time clock continuity |
| Quiescent Current | 1.0 µA in ULP mode (SW1/SW2); <1.5 µA in LDO low-power mode - extends battery life in sleep states |
| Package & Temp Range | QFN40, 5.0 mm × 5.0 mm w/ EPAD; −40 °C to +85 °C - suited for compact consumer wearables and IoT edge nodes |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) compatible; VDDIO 1.7–3.6 V - enables host MCU communication without level-shifting |
Pinout & Package
MC32PF1510A7EP uses a 40-pin QFN package (98ASA00913D) with 5.0 mm × 5.0 mm footprint and exposed thermal pad (EPAD, Pin 41) connected to ground for thermal dissipation. Pin functions are validated per NXP PF1510 datasheet Rev. 4 (March 2021).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pin 37) | Main IC supply input | Accepts 5.0 V adapter/USB source; bypassed with 2.2 µF capacitor - primary high-voltage entry point |
| VSYS (Pins 35, 36) | Main PMIC input rail | Distributed 3.7 V system bus fed by front-end LDO; bypassed with 47 µF capacitor - powers all internal regulators |
| SW1FB/SW2FB/SW3FB (Pins 27, 16, 15) | Buck feedback inputs | Connect near load to close regulation loop; enable precise output voltage control under dynamic load |
| LDO1/LDO2/LDO3 (Pins 29, 19, 12) | Linear regulator outputs | Provide low-noise bias for sensors, audio codecs, or I/O interfaces; require local 4.7–10 µF ceramic decoupling |
| VREFDDR (Pin 21) | DDR memory reference output | Supplies termination voltage to LPDDR2 memory; requires 1.0 µF capacitor - critical for signal integrity |
| VSNVS (Pin 30) | RTC backup supply | 3.0 V/2.0 mA output for real-time clock; bypassed with 0.47 µF capacitor - maintains time during main power loss |
| SCL/SDA (Pins 3, 2) | I²C interface signals | Enable host MCU to configure OTP settings, monitor status, and control power modes - no external pull-ups required if VDDIO supplied |
| EPAD (Pin 41) | Thermal ground plane | Must be soldered to inner/external PCB ground layers via multiple vias - essential for thermal performance and EMI reduction |
Key Features
| Feature | Design Value |
|---|---|
| OTP-Programmable Sequencing | User-defined startup/power-down order, timing, and soft-start ramp - eliminates need for external sequencer logic in i.MX 6UL designs |
| Dynamic Voltage Scaling (DVS) | SW1 and SW2 support real-time voltage adjustment in 12.5 mV steps - enables adaptive core voltage scaling for power/performance optimization |
| Ultra-Low Quiescent Current | 1.0 µA in ULP mode for buck converters; <1.5 µA for LDOs - extends battery runtime in deep-sleep states for wearables |
| Integrated Coin-Cell Charger | LICELL pin supports charging and backup switching for 3 V coin cells - sustains RTC and SRAM retention during main power failure |
| Robust Input Protection | VIN withstands +22 V transients; UVLO/overvoltage thresholds (4.0 V / 6.5 V) with hysteresis - improves system reliability in unregulated adapter environments |
Applications
| Smart Wearables | IoT Edge Sensors |
|---|---|
Use Scenario: Compact fitness tracker with ARM Cortex-A7 core, LPDDR2 memory, and BLE connectivity. IC Role / Device Role / Timing Role: MC32PF1510A7EP supplies core voltage (SW1), I/O rail (SW3), DDR reference (VREFDDR), and RTC backup (VSNVS) - enabling full SoC power management in <100 mm² form factor. Use Value: OTP-configured sequencing reduces BOM count; 1.0 µA ULP quiescent current extends battery life to >7 days in active monitoring mode. | Use Scenario: Battery-powered environmental sensor node deploying i.MX 6UL with Wi-Fi and temperature/humidity sensing. IC Role / Device Role / Timing Role: MC32PF1510A7EP powers processor (SW1/SW2), memory (VREFDDR), peripherals (LDO2), and RTC (VSNVS) - supporting intermittent wake-up and data transmission cycles. Use Value: DVS on SW1 allows dynamic core voltage scaling during sensor sampling vs. RF transmission, reducing average system power by 22%. |
| Home Automation Hubs | Wireless Game Controllers |
Use Scenario: Voice-controlled smart home hub using i.MX 6UL, LPDDR2, and multi-protocol radio (Zigbee + Thread). IC Role / Device Role / Timing Role: MC32PF1510A7EP delivers regulated rails for application processor (SW1), DDR memory interface (VREFDDR), USB PHY (USBPHY), and always-on subsystem (LDO2P7) - ensuring deterministic boot and low-latency response. Use Value: Integrated USB_PHY LDO (4.9 V/60 mA) eliminates discrete regulator; LDO2P7 provides stable 2.7 V for secure element and wake-up logic. | Use Scenario: Low-latency Bluetooth gaming controller with motion sensors, haptic feedback, and i.MX 6UL processing. IC Role / Device Role / Timing Role: MC32PF1510A7EP supplies core voltage (SW1), sensor bias (LDO1), haptic driver (SW3), and RTC (VSNVS) - meeting sub-10 ms latency requirements across power states. Use Value: Fast turn-on time (<500 µs) and programmable soft-start prevent brownouts during rapid mode transitions between idle and active gameplay. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF1510A7EP | Identical functionality and pinout; rated for −40 °C to +105 °C industrial operation | Targeted at industrial automation and extended-temperature embedded systems | Select MC34PF1510A7EP when ambient operating temperature exceeds +85 °C |
| PF8100A7EP | Higher integration: adds 2x additional bucks, 2x additional LDOs, and PMIC watchdog; larger 6×6 mm QFN56 package | Designed for i.MX 8M Mini/Plus with dual-core ARM Cortex-A53 and advanced multimedia peripherals | Choose PF8100A7EP only when migrating to i.MX 8M platform requiring expanded rail count and higher current capability |
Compared with MC34PF1510A7EP, the MC32PF1510A7EP offers identical electrical performance and feature set but is qualified for consumer-grade temperature range (−40 °C to +85 °C), making it cost-optimized for wearables and portable IoT. Versus PF8100A7EP, it provides minimal sufficient regulation for i.MX 6UL with lower BOM cost and smaller PCB footprint.
Availability
MC32PF1510A7EP is available at Aetrix Electronics and suitable for low-power IoT applications, smart wearable devices, and wireless game controllers requiring stable component supply across consumer-grade temperature ranges.
Supply support for MC32PF1510A7EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with leadership in ARM-based application processors and power management.
The PF1510 product line was designed specifically to deliver highly integrated, OTP-configurable power solutions for NXP's i.MX 6 and i.MX 7ULP application processors in space-constrained, battery-operated edge devices.
FAQ
What is the operating temperature range specified for the MC32PF1510A7EP?
The MC32PF1510A7EP is rated for an ambient operating temperature range of −40 °C to +85 °C, qualifying it for consumer-grade applications such as smart wearables and portable IoT devices. This specification is explicitly defined in Table 1 of the PF1510 datasheet Rev. 4 and distinguishes it from the industrial-grade MC34PF1510A7EP variant.
Does the MC32PF1510A7EP support dynamic voltage scaling (DVS) on all buck converters?
No, the MC32PF1510A7EP supports DVS only on SW1 and SW2 buck converters, enabling fine-grained voltage adjustment in 12.5 mV steps within the 0.6 V to 1.3875 V range. SW3 operates in fixed-output mode (1.8 V to 3.3 V in 100 mV steps) without DVS capability, as confirmed in Section 1.1 Features and Benefits of the datasheet.
How is the MC32PF1510A7EP configured for use with i.MX 6UL and LPDDR2 memory?
The MC32PF1510A7EP is preprogrammed with OTP configuration code "7", which defines the startup sequence, voltage setpoints, and timing parameters optimized for i.MX 6UL processors paired with LPDDR2 memory. This configuration is factory-programmed and cannot be modified in the field, as documented in Table 1 of the PF1510 datasheet.
What is the purpose of the VSNVS pin on the MC32PF1510A7EP?
The VSNVS (Secure Non-Volatile Supply) pin on the MC32PF1510A7EP delivers a regulated 3.0 V output at up to 2.0 mA to maintain real-time clock (RTC) operation and secure non-volatile memory retention during main power loss. It is bypassed with a 0.47 µF capacitor and supports coin-cell backup via the LICELL pin.
Can the MC32PF1510A7EP be used with i.MX 7ULP processors?
No, the MC32PF1510A7EP is specifically configured for i.MX 6UL with LPDDR2 (OTP code "7") and is not compatible with i.MX 7ULP. For i.MX 7ULP support, NXP specifies alternative variants such as MC32PF1510A2EP or MC32PF1510A4EP, both of which are preprogrammed for LPDDR3 memory and different power sequencing requirements.
MC32PF1510A7EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Applications:
- -
- Current - Supply:
- -
- Voltage - Supply:
- 4.1V ~ 6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-HVQFN (5x5)
MC32PF1510A7EP FAQ
1.How can I place an order for MC32PF1510A7EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF1510A7EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF1510A7EP reliable?
The price and inventory of MC32PF1510A7EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF1510A7EP is usually 5 days.
3.What payment methods are accepted for MC32PF1510A7EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF1510A7EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF1510A7EP?
MC32PF1510A7EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF1510A7EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF1510A7EP?
For technical support, including MC32PF1510A7EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF1510A7EP requirements.
6.How does Aetrix verify that MC32PF1510A7EP is sourced from the original manufacturer or authorized distributors?
All MC32PF1510A7EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF1510A7EP meets industry standards.
7.What is the process for return or replacement of MC32PF1510A7EP?
All MC32PF1510A7EP units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF1510A7EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF1510A7EP part is unused and in its original packaging.
Return procedure for MC32PF1510A7EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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