NXP Semiconductors MC32PF1510A7EPR2
- Part No.:
- MC32PF1510A7EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 40-VFQFN Exposed Pad
- Datasheet:
-
MC32PF1510A7EPR2.pdf
- Description:
- PF1510
- Quantity:
- Payment:

- Shipping:

Inventory:2,163
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC32PF1510A7EPR2 from NXP Semiconductors is a power management IC (PMIC) engineered for i.MX 6UL application processors in consumer-grade IoT and wearable devices. It integrates three 1.0 A buck converters (SW1–SW3), three LDOs (LDO1–LDO3), DDR reference (VREFDDR), RTC supply (VSNVS), and I²C programmable control. Its −40 °C to +85 °C operating range and OTP-configurable startup sequence support low-power portable systems.
For engineers reviewing the MC32PF1510A7EPR2 datasheet, MC32PF1510A7EPR2 pinout, MC32PF1510A7EPR2 application, or MC32PF1510A7EPR2 equivalent, key selection criteria include its preprogrammed configuration for i.MX 6UL with LPDDR2 memory, 40-pin QFN package with exposed thermal pad, and support for dynamic voltage scaling on SW1/SW2 with <1.0 µA quiescent current in ULP mode.
Technical Context
The MC32PF1510A7EPR2 implements a front-end LDO (1500 mA input limit, up to 6.5 V operation) feeding three synchronous buck regulators with internal digital soft-start and adaptive variable-frequency or forced PWM modes. Its OTP memory stores device-specific startup/power-down sequences, regulator voltages, and DVS settings tailored for i.MX 6UL + LPDDR2 system requirements.
It delivers precise analog core (VCORE) and digital core (VDIG) supplies, supports coin-cell backup via LICELL, provides USB PHY LDO (4.9 V or 3.3 V, 60 mA), and includes dedicated always-on LDO2P7 (2.7 V, 5 mA) and RTC rail (VSNVS, 3.0 V, 2.0 mA) - all coordinated through an I²C interface with interrupt (INTB) and reset (RESETBMCU) signaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VIN: 4.1 V to 6.0 V; withstands DC/transient up to +22 V - enables robust USB/adapter input handling without external surge protection |
| Buck Converters | SW1 & SW2: 0.6–1.3875 V (12.5 mV steps) or 1.1–3.3 V (variable); SW3: 1.8–3.3 V (100 mV steps); all rated 1.0 A - powers CPU cores, I/O, and memory rails |
| LDO Outputs | LDO1/LDO3: 0.75–1.5 V or 1.8–3.3 V, 300 mA; LDO2: 1.8–3.3 V, 400 mA; LDO2P7: 2.7 V, 5 mA (always-on); USBPHY: 3.3/4.9 V, 60 mA - supplies peripherals, PHYs, and always-active logic |
| DDR Reference | VREFDDR: 0.5–0.9 V, 10 mA - meets JEDEC LPDDR2/LPDDR3 reference accuracy and stability requirements |
| Quiescent Current | <1.0 µA in ULP mode (buck), <1.5 µA in Low-power mode (LDOs) - extends battery life in sleep states for wearables and sensors |
| Operating Temperature | −40 °C to +85 °C - qualified for consumer portable electronics including e-readers and smart controllers |
| Package | 40-pin QFN, 5.0 mm × 5.0 mm with exposed thermal pad - enables compact PCB layout and efficient heat dissipation in space-constrained designs |
Pinout & Package
MC32PF1510A7EPR2 uses a 40-pin QFN (98ASA00913D) with 5.0 mm × 5.0 mm footprint and exposed thermal pad (EPAD, Pin 41) connected to ground for thermal management. Pin functions are validated per NXP PF1510 datasheet Rev. 4 (2021).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pin 37) | Main IC supply input | Accepts 5.0 V adapter/USB source; bypassed with 2.2 µF capacitor - primary high-voltage input path before front-end LDO |
| VSYS (Pins 35, 36) | Main PMIC input rail | Output of front-end LDO; powers all internal regulators; bypassed with dual 22 µF capacitors - system supply backbone |
| SW1IN/SW2IN/SW3IN (Pins 26, 17, 14) | Buck converter inputs | Connected to VSYS; each requires local 0.1 µF + 4.7 µF decoupling - ensures stable switching node operation |
| SW1FB/SW2FB/SW3FB (Pins 27, 16, 15) | Feedback inputs | Connected near load to close regulation loop - enables accurate output voltage setting and transient response |
| LDO1/LDO2/LDO3 outputs (Pins 29, 19, 12) | Linear regulator outputs | Each requires specified bulk capacitance (4.7 µF / 10 µF / 4.7 µF) - stabilizes low-noise analog/digital supplies |
| VREFDDR (Pin 21) | DDR memory reference | Bypassed with 1.0 µF capacitor - provides precision mid-rail voltage for DDR I/O termination |
| VSNVS (Pin 30) | RTC supply output | 3.0 V, 2.0 mA; bypassed with 0.47 µF capacitor - maintains real-time clock during system power-off |
| SCL/SDA (Pins 3, 2) | I²C interface | Pulled up to VDDIO (1.7–3.6 V); enables full OTP configuration and runtime voltage control - primary host communication channel |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmable power sequencing | User-defined startup/shutdown timing and voltage ramp rates stored in one-time-programmable memory - eliminates external sequencer and firmware dependency for i.MX 6UL boot reliability |
| Dynamic Voltage Scaling (DVS) on SW1/SW2 | Hardware-controlled voltage adjustment in 12.5 mV steps during processor DVFS transitions - reduces active power by up to 30% in CPU-intensive workloads |
| Ultra-low-quiescent-current ULP mode | <1.0 µA total buck quiescent current with light load - extends standby time in battery-powered IoT endpoints beyond 30 days |
| Dedicated USB PHY LDO | Configurable 3.3 V or 4.9 V output, 60 mA drive, 200 mV dropout at full load - directly powers USB transceivers without external regulators |
| Integrated coin-cell charger & backup | LICELL pin supports charging and seamless switchover to coin cell for VSNVS - preserves RTC and SRAM state during main power loss |
Applications
| Smart Wearables | Industrial IoT Sensors |
|---|---|
Use Scenario: Compact fitness tracker with ARM Cortex-A7 CPU, BLE radio, and motion sensors running on single-cell Li-ion. IC Role / Device Role / Timing Role: Central PMIC supplying core voltage (SW1), I/O rail (SW2), memory (SW3), and always-on RTC (VSNVS) while managing low-power sleep entry/exit. Use Value: Enables 7-day battery life via ULP mode (<1 µA) and DVS-aligned CPU voltage scaling during activity bursts. | Use Scenario: Wireless environmental sensor node deployed in factory settings with temperature/humidity/pressure sensing and LoRaWAN transmission. IC Role / Device Role / Timing Role: Power hub delivering regulated 1.1 V core, 3.3 V I/O, and 0.75 V DDR reference to i.MX 6UL, with VSNVS maintaining time-stamped logs during brownouts. Use Value: Ensures data integrity across power cycles using OTP-locked sequencing and coin-cell-backed RTC. |
| E-Readers | Wireless Game Controllers |
Use Scenario: Solar-charged e-reader with e-ink display, i.MX 6UL SoC, and Wi-Fi connectivity operating in intermittent sunlight. IC Role / Device Role / Timing Role: Manages multi-rail power delivery (core, display, RF) and battery charge management via VIN/VSYS paths with wide-input tolerance (up to 22 V). Use Value: Survives solar panel voltage spikes without external TVS, reducing BOM cost and board area. | Use Scenario: Bluetooth-enabled gamepad with motion controls, haptic feedback, and low-latency HID reporting to console or PC. IC Role / Device Role / Timing Role: Powers ARM core (SW1), peripheral bus (SW2), and audio codec (LDO2) while enabling fast wake-from-sleep (<500 µs turn-on time) for responsive button press detection. Use Value: Achieves sub-100 ms controller latency by eliminating software-initiated regulator enable delays via hardware-sequenced startup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF1510A7EPR2 | Identical architecture and pinout; rated for −40 °C to +105 °C industrial temperature range | Targets industrial IoT gateways and automotive infotainment where extended thermal margin is required | Select MC33PF1510A7EPR2 when ambient exceeds 85 °C or lifecycle validation mandates industrial qualification |
| PF8100A7EPR2 | Higher integration: adds 2x additional bucks, 2x additional LDOs, and integrated battery charger; larger 56-pin QFN package | Suitable for complex i.MX 8M Mini systems requiring >3 bucks or fuel-gauge functionality | Choose PF8100A7EPR2 only if design requires extra rails or battery management - not a drop-in replacement due to pin count and footprint mismatch |
Compared with MC32PF1510A7EPR2, MC33PF1510A7EPR2 offers identical functionality with extended temperature rating, while PF8100A7EPR2 provides greater integration at the cost of increased size and complexity - making MC32PF1510A7EPR2 optimal for cost- and space-sensitive i.MX 6UL consumer designs.
Availability
MC32PF1510A7EPR2 is available at Aetrix Electronics and suitable for smart wearables, e-readers, and wireless game controllers requiring stable component supply with guaranteed long-term sourcing.
Supply support for MC32PF1510A7EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 40 years of analog and mixed-signal design expertise.
The PF1510 product line was developed specifically to deliver highly integrated, OTP-configurable power management for NXP's i.MX low-power application processors - optimizing boot reliability, battery efficiency, and PCB simplicity in portable edge devices.
FAQ
What is the operating temperature range of the MC32PF1510A7EPR2?
The MC32PF1510A7EPR2 is rated for −40 °C to +85 °C ambient operation, qualifying it for consumer portable electronics including wearables and e-readers. This range is explicitly defined in Table 1 of the PF1510 datasheet Rev. 4 for part number MC32PF1510A7EP (R2 suffix denotes tape-and-reel packaging). Junction temperature must remain below 125 °C under all conditions.
Does the MC32PF1510A7EPR2 support dynamic voltage scaling (DVS)?
Yes, the MC32PF1510A7EPR2 supports hardware-based DVS on buck regulators SW1 and SW2, enabling voltage adjustment in 12.5 mV steps during processor frequency changes. This feature is confirmed in Section 1.1 "Features and benefits" and electrical characteristics Table 11, and is enabled via OTP configuration for the i.MX 6UL + LPDDR2 use case.
What package type and pin count does the MC32PF1510A7EPR2 use?
The MC32PF1510A7EPR2 uses a 40-pin QFN package (98ASA00913D) measuring 5.0 mm × 5.0 mm with an exposed thermal pad. This is documented in Table 1 ("Orderable part variations") and Figure 4 ("Pinout diagram") of the PF1510 datasheet Rev. 4, and matches the physical layout and thermal resistance values in Table 3.
How is the MC32PF1510A7EPR2 configured for i.MX 6UL with LPDDR2?
The MC32PF1510A7EPR2 is factory-programmed with OTP code '7', which configures startup sequence, regulator voltages, and timing specifically for i.MX 6UL processors interfacing with LPDDR2 memory. This configuration is defined in Table 1 and verified in Section 3 ("Orderable parts") of the PF1510 datasheet Rev. 4.
Can the MC32PF1510A7EPR2 power DDR memory reference voltage?
Yes, the MC32PF1510A7EPR2 provides a dedicated DDR reference output (VREFDDR) adjustable from 0.5 V to 0.9 V with ±2% accuracy and 10 mA drive capability. This function is detailed in Section 1.1 and Table 12, and is essential for proper termination of LPDDR2 interfaces in i.MX 6UL systems.
MC32PF1510A7EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 40-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
- Current - Supply:
- -
- Voltage - Supply:
- 3.8V ~ 7V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 40-HVQFN (5x5)
MC32PF1510A7EPR2 FAQ
1.How can I place an order for MC32PF1510A7EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF1510A7EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF1510A7EPR2 reliable?
The price and inventory of MC32PF1510A7EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF1510A7EPR2 is usually 5 days.
3.What payment methods are accepted for MC32PF1510A7EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF1510A7EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF1510A7EPR2?
MC32PF1510A7EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF1510A7EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF1510A7EPR2?
For technical support, including MC32PF1510A7EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF1510A7EPR2 requirements.
6.How does Aetrix verify that MC32PF1510A7EPR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF1510A7EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF1510A7EPR2 meets industry standards.
7.What is the process for return or replacement of MC32PF1510A7EPR2?
All MC32PF1510A7EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF1510A7EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF1510A7EPR2 part is unused and in its original packaging.
Return procedure for MC32PF1510A7EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC32PF1510A7EPR2 Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

