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NXP Semiconductors MC32PF1550A8EP

Part No.:
MC32PF1550A8EP
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
40-VFQFN Exposed Pad
Datasheet:
AetrixMC32PF1550A8EP.pdf
Description:
POWER MANAGEMENT IC 3 BUCK REGS
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,774

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Product details

Overview

MC32PF1550A8EP from NXP Semiconductors is a preprogrammed power management IC (PMIC) optimized for i.MX 6UL processors with DDR3L memory and edge-sensitive boot configuration. It integrates three 1.0 A buck converters, three LDOs (300 mA/400 mA/300 mA), RTC supply (VSNVS, 3.0 V), DDR reference voltage (VREFDDR, 0.5–0.9 V), linear battery charger (100–1000 mA), and I²C-controlled power sequencing - enabling full power delivery for battery-powered IoT and wearable systems.

For engineers reviewing the MC32PF1550A8EP datasheet, MC32PF1550A8EP pinout, MC32PF1550A8EP application, or MC32PF1550A8EP equivalent, this page delivers verified technical context, exact pin functions, real-world use cases for i.MX 6UL-based designs, and validated alternative parts with documented functional differences.

Technical Context

The MC32PF1550A8EP implements a tightly integrated analog/digital PMIC architecture with dedicated regulators for core (VCORE), digital (VDIG), and system (VSYS) rails, plus independent feedback paths for SW1/SW2 dynamic voltage scaling (DVS) and SW3 fixed-output operation. Its OTP-programmed startup sequence is configured specifically for i.MX 6UL with DDR3L timing and edge-sensitive reset assertion.

It supports dual-input power path management: VSYS is sourced either from VBATT (Li-ion) or VBUSIN (USB/adapter, up to 22 V withstand), with automatic switchover, battery supplement mode, and JEITA-compliant thermistor monitoring via THM and INT2P7 pins. All regulator outputs are software-configurable via I²C interface.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range (VBUSIN)4.1 V to 6.0 V nominal; withstands up to +22 V DC/transient - enables robust USB/adapter input handling without external protection.
Buck ConvertersSW1/SW2: 1.0 A, 0.6–1.3875 V (12.5 mV steps) or 1.1–3.3 V (variable); SW3: 1.0 A, 1.8–3.3 V (100 mV steps) - powers CPU core, SoC digital, and peripherals independently.
LDO RegulatorsLDO1/LDO3: 300 mA, 0.75–1.5 V or 1.8–3.3 V with load switch; LDO2: 400 mA, 1.8–3.3 V - supplies I/O, sensors, and low-noise analog blocks.
Battery ChargerLinear Li-ion/Li-Po charger; programmable 100–1000 mA CC, 3.5–4.44 V CV, 5–50 mA termination - supports safe, JEITA-temperature-aware charging.
DDR ReferenceVREFDDR: 0.5–0.9 V, 10 mA - meets JEDEC LPDDR3/DDR3L VREF accuracy and stability requirements.
Operating Temperature−40 °C to +105 °C - qualified for industrial-grade embedded applications including edge gateways and portable HMI.

Pinout & Package

MC32PF1550A8EP uses a 40-pin QFN package (5.0 mm × 5.0 mm, exposed pad), compatible with standard reflow profiles per JEDEC J-STD-020C. Thermal resistance RΘJA is 17.8 °C/W on an eight-layer board.

Pin/TerminalCircuit RoleDesign Meaning
SW1FB, SW2FB, SW3FBBuck output voltage feedbackResistive divider inputs enabling precise regulation of VCORE, VDIG, and peripheral rails.
VLDO1, VLDO2, VLDO3LDO output terminalsProvide regulated 0.75–3.3 V outputs with soft-start and current-limit protection for mixed-signal subsystems.
VSNVSRTC backup supply3.0 V, 2.0 mA rail sustaining real-time clock and SRAM during main power loss.
VREFDDRDDR memory reference0.5–0.9 V precision output referenced to VINREFDDR/2 - critical for DDR3L signal integrity.
SCL / SDAI²C interfaceStandard two-wire bus for runtime voltage control, status monitoring, and fault reporting to host processor.
ONKEY / PWRON / STANDBYPower-state control inputsEnable hardware-initiated power-on, standby entry, and wake-up sequencing without software intervention.
CHGBCharger LED driverOpen-drain sink driving external LED from VSYS - provides visual charge status indication.
THMThermistor bias nodeConnects to NTC thermistor; used with INT2P7 to implement JEITA-compliant battery temperature monitoring.

Key Features

FeatureDesign Value
OTP-configured startup sequencePreprogrammed for i.MX 6UL with DDR3L timing and edge-sensitive reset - eliminates external configuration EEPROM and reduces BOM count.
Dual-input power pathAutomatic VSYS sourcing from VBATT or VBUSIN with 22 V transient tolerance - enables seamless transition between battery and USB power without brownout.
Dynamic voltage scaling (SW1/SW2)Real-time voltage adjustment via I²C to match CPU performance states - reduces active power by up to 30 % in low-load conditions.
Battery supplement modeVSYS boosted from VBATT when VBUSIN drops below threshold - maintains system operation during adapter disconnection or sag.
Integrated coin cell chargerVSNVS-backed RTC sustained via LICELL input with trickle-charge capability - extends backup runtime beyond typical supercap solutions.

Applications

Smart WearablesIndustrial IoT Gateways

Use Scenario: Compact wrist-worn health monitor with i.MX 6UL, BLE radio, and optical heart-rate sensor.

IC Role / Device Role / Timing Role: MC32PF1550A8EP supplies VCORE (1.1 V), VDIG (1.8 V), VREFDDR (0.75 V), and USBPHY (3.3 V) while managing Li-ion charging and RTC backup.

Use Value: Single-chip power solution reduces PCB area by >40 % vs discrete regulators and enables <15 µA shutdown current for multi-week battery life.

Use Scenario: Edge gateway aggregating Modbus RTU sensors in factory automation, operating 24/7 on 24 VDC with local battery backup.

IC Role / Device Role / Timing Role: MC32PF1550A8EP regulates i.MX 6UL core/digital rails, powers isolated RS-485 transceivers via LDO2, and manages backup battery charging with thermal cutoff.

Use Value: −40 °C to +105 °C rating and 22 V input withstand ensure reliable operation in uncontrolled industrial environments with wide voltage transients.

Wireless Game ControllersHome Automation Hubs

Use Scenario: Low-latency Bluetooth gaming controller with motion sensing and haptic feedback, powered by single-cell Li-ion.

IC Role / Device Role / Timing Role: MC32PF1550A8EP delivers fast-transient VCORE (1.2 V) for ARM Cortex-A7 bursts, powers MEMS accelerometer via LDO3, and handles USB-C charging with LED status.

Use Value: DVS-enabled buck converters respond to CPU load changes within 10 µs, eliminating voltage droop during rapid game-state transitions.

Use Scenario: Voice-controlled smart hub integrating Wi-Fi, Zigbee, and Matter stack on i.MX 6UL, deployed in residential HVAC systems.

IC Role / Device Role / Timing Role: MC32PF1550A8EP powers Wi-Fi SoC (via LDO2), Zigbee module (via SW3), DDR3L memory (VREFDDR), and RTC (VSNVS) with battery fallback.

Use Value: Preconfigured DDR3L timing and edge-sensitive boot ensures deterministic cold-start behavior required for fail-safe HVAC control firmware loading.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC33PF1550A8EPSame silicon die and pinout; differs only in temperature grade (−40 °C to +85 °C vs. −40 °C to +105 °C).Valid for consumer-grade i.MX 6UL designs where ambient temperature stays ≤85 °C.Select MC33PF1550A8EP only if industrial temperature range is not required - identical functionality and layout compatibility.
PF8100Higher integration: adds 2x additional bucks (5 total), 2x more LDOs, and PMIC watchdog; no OTP preconfiguration - requires full register initialization.Targeted at i.MX 8M Mini/Plus platforms; lacks i.MX 6UL-specific boot timing and DDR3L VREF calibration.Choose PF8100 only for new i.MX 8M designs requiring greater flexibility; not drop-in for MC32PF1550A8EP due to different pinout, sequencing, and register map.

Compared with MC32PF1550A8EP, MC33PF1550A8EP offers identical features but reduced thermal margin, while PF8100 provides expanded capability at the cost of design complexity and non-compatible initialization - making MC32PF1550A8EP optimal for cost-sensitive, production-ready i.MX 6UL+DDR3L systems.

Availability

MC32PF1550A8EP is available at Aetrix Electronics and suitable for smart wearables, industrial IoT gateways, and wireless game controllers requiring stable component supply and long-term lifecycle support.

Supply support for MC32PF1550A8EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and associated power management.

The PF1550 product line was designed specifically to deliver fully integrated, preconfigured power solutions for NXP's i.MX low-power application processors - minimizing design effort while ensuring compliance with DDR, USB, and JEITA battery standards.

FAQ

What distinguishes MC32PF1550A8EP from other PF1550 variants?

MC32PF1550A8EP is preprogrammed with OTP configuration code "8", which specifies i.MX 6UL support with DDR3L memory interface timing and edge-sensitive reset behavior. Unlike generic PF1550 versions, it requires no external configuration and boots deterministically in target systems - eliminating register initialization overhead and reducing firmware validation scope.

Does MC32PF1550A8EP support DDR3L memory interfaces?

Yes, MC32PF1550A8EP includes a dedicated VREFDDR output (0.5–0.9 V, 10 mA) with internal VINREFDDR/2 division and tight accuracy matching JEDEC DDR3L specifications. Its OTP configuration also enables correct timing alignment for i.MX 6UL DDR3L PHY initialization sequences.

Can MC32PF1550A8EP operate without a battery connected?

Yes, MC32PF1550A8EP supports battery-less operation using VBUSIN (USB/adapter) as the primary source. Its integrated 50 mΩ battery isolation MOSFET allows VSYS to be powered directly from VBUSIN while keeping VBATT floating or disconnected - confirmed in the functional block diagram and pin description for CHGB and VBATT.

What thermal performance can be expected from MC32PF1550A8EP in a compact PCB layout?

MC32PF1550A8EP achieves RΘJA = 17.8 °C/W on an eight-layer board. With its exposed pad (EPAD, Pin 41) soldered to a solid ground plane, it sustains full 1.0 A buck loads at +105 °C ambient when derated per Figure 10 in the datasheet - validated for continuous operation in sealed enclosures with no forced airflow.

Is I²C communication mandatory to use MC32PF1550A8EP?

No, MC32PF1550A8EP operates autonomously after power-on using its OTP-programmed configuration. I²C is optional and used only for dynamic voltage scaling, runtime fault logging, or modifying charger parameters - all default settings (including SW1/SW2 voltages and charge current) are stored permanently in OTP and active without host interaction.

MC32PF1550A8EP Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
40-VFQFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Applications:
Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Current - Supply:
-
Voltage - Supply:
4.1V ~ 6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
40-HVQFN (5x5)

MC32PF1550A8EP FAQ

1.How can I place an order for MC32PF1550A8EP through Aetrix?

Please submit a Request for Quotation (RFQ) for MC32PF1550A8EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC32PF1550A8EP reliable?

The price and inventory of MC32PF1550A8EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF1550A8EP is usually 5 days.

3.What payment methods are accepted for MC32PF1550A8EP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF1550A8EP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC32PF1550A8EP?

MC32PF1550A8EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC32PF1550A8EP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC32PF1550A8EP?

For technical support, including MC32PF1550A8EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF1550A8EP requirements.

6.How does Aetrix verify that MC32PF1550A8EP is sourced from the original manufacturer or authorized distributors?

All MC32PF1550A8EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF1550A8EP meets industry standards.

7.What is the process for return or replacement of MC32PF1550A8EP?

All MC32PF1550A8EP units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF1550A8EP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC32PF1550A8EP part is unused and in its original packaging.

Return procedure for MC32PF1550A8EP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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