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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

NXP Semiconductors MC32PF3000A0EP

Name: MC32PF3000A0EP
Brand: NXP Semiconductors
SKU: MC32PF3000A0EP
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MC32PF3000A0EP

Manufacturer:: NXP Semiconductors

Category:: Power Management - Specialized

Package:: 48-VFQFN Exposed Pad

Datasheet:: MC32PF3000A0EP.pdf

Description:: IC POWER MANAGEMENT 48QFN

Quantity:: RFQ Add To RFQ list

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Product details

Overview

MC32PF3000A0EP from NXP Semiconductors is a programmable power management IC (PMIC) engineered for i.MX 6SL/SX/UL and i.MX 7 application processors. It integrates four buck regulators (SW1A/B up to 2.75 A combined, SW2 at 1.25 A, SW3 at 1.5 A), six LDOs including V33 (350 mA) and VCC_SD (100 mA), RTC supply (VSNVS, 3.0 V), DDR reference (VREFDDR, 0.5–0.9 V), and coin-cell charging - enabling full-system power delivery in compact consumer-grade embedded designs.

For engineers reviewing the MC32PF3000A0EP datasheet, MC32PF3000A0EP pinout, MC32PF3000A0EP application, or MC32PF3000A0EP equivalent, this device supports I²C-programmable startup sequencing, dynamic voltage scaling (DVS), OTP-configurable regulator modes (PWM/PFM/APS), and dual-voltage SD card support via SD_VSEL - critical for low-power portable SoC systems requiring precise rail coordination and firmware-controlled power states.

Technical Context

The MC32PF3000A0EP implements a SMARTMOS-based architecture with integrated OTP memory that defines startup sequence, output voltages, PWRON configuration (level- or edge-triggered), and I²C slave address (0x08–0x0F). Its control logic enables coordinated power-up of processor cores (VCOREDIG, VCORE), memory domains (VREFDDR, SW3), and peripherals (V33, VLDO2) without external timing components.

SW1A and SW1B support configurable operation: independent 1.0 A / 1.75 A regulation or paralleled 2.75 A mode; SW2 offers dual-range output (1.50–1.85 V or 2.50–3.30 V); SWBST provides 5.0–5.15 V at 600 mA for USB OTG. All buck regulators support programmable soft-start ramp rate (25 mV/2 µs or 4 µs), current limit, and switching frequency.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	2.8–4.5 V (VIN) or 3.7–5.5 V (VPWR with external PFET) - supports single-supply battery or adapter input without external LDO pre-regulation
Buck Regulators	SW1A/B: 0.7–1.475 V, up to 2.75 A combined; SW2: 1.5–3.3 V, 1.25 A; SW3: 0.9–1.65 V, 1.5 A - powers ARM Cortex-A7 cores, SOC logic, and DDR I/O rails
LDO Outputs	V33: 2.85–3.30 V, 350 mA; VCC_SD: 1.8/3.3 V selectable, 100 mA; VLDO2: 0.8–1.55 V, 250 mA - supplies USB PHY, SDIO, and analog peripherals
VREFDDR & VSNVS	VREFDDR: 0.5×SW3_OUT (0.5–0.9 V), 10 mA; VSNVS: fixed 3.0 V, 1.0 mA - delivers precision DDR memory reference and always-on secure real-time clock domain
Interface & Control	I²C (0x08–0x0F address), OTP-programmable startup sequence (15-slot timing), PWRON/STANDBY/RESETBMCU/INTB logic pins - enables deterministic boot and fault-aware system reset
Package	48-pin QFN, 7.0 mm × 7.0 mm, wettable flank (98ASA00933D) - supports automated optical inspection and high thermal dissipation via exposed pad

Pinout & Package

MC32PF3000A0EP uses a 48-pin QFN package (98ASA00933D) with 7.0 mm × 7.0 mm footprint and wettable flank for enhanced solder joint reliability. The exposed pad (EP) serves as primary ground return for buck/boost regulators and must be connected to inner/external ground planes via multiple vias for thermal and electrical performance.

Pin/Terminal	Circuit Role	Design Meaning
INTB (Pin 1)	Open-drain interrupt output	Asserts low on overcurrent, thermal, or regulator fault; requires external pull-up for system-level fault detection and recovery
SD_VSEL (Pin 2)	Digital input for VCC_SD selection	Selects VCC_SD output: LOW = 2.85–3.30 V (SD card I/O), HIGH = 1.80–1.85 V (high-speed SD mode)
RESETBMCU (Pin 3)	Open-drain reset output	Deasserts 2 ms after final regulator enable (default) or only if no startup faults occur (OTP-configurable fault mode)
STANDBY (Pin 4)	Digital input for low-power state entry	Active-high or active-low (OTP-selectable) signal to enter Standby mode - maintains VSNVS and RTC while disabling non-critical rails
PWRON (Pin 48)	Power-on trigger input	Configurable as level- or edge-sensitive (OTP bit PWRON_CFG); supports mechanical switch debounce (up to 750 ms falling-edge delay)
SCL/SDA (Pins 46/45)	I²C interface signals	Standard open-drain bus (4.7 kΩ pull-up to VDDIO); enables runtime reconfiguration of voltages, sequencing, and DVS parameters
VIN (Pin 42)	Main power input	Primary supply for internal regulators when ≤4.5 V; connects to drain of external PFET when VPWR >4.5 V is used
EP (Exposed Pad)	Thermal & ground reference	Must be soldered to PCB ground plane with ≥4 thermal vias - critical for thermal dissipation and noise reduction in high-current switching paths

Key Features

Feature	Design Value
OTP-configurable startup sequence	15-slot programmable timing (0.5 ms or 2.0 ms per slot) eliminates need for external RC timers and ensures repeatable, deterministic boot across production units
SW1A/SW1B flexible topology	Single 2.75 A buck or independent 1.0 A + 1.75 A operation - adapts to core voltage requirements of i.MX 6UL vs. i.MX 7 without hardware change
VCC_SD dual-voltage support	Hardware-selectable 1.8 V or 3.3 V output via SD_VSEL pin - meets JEDEC SDIO spec for both legacy and UHS-I card interfaces
VREFDDR tracking architecture	Output set to 0.5×SW3 output voltage - maintains precise DDR termination voltage matching core supply during DVS transitions
Integrated coin-cell charger	LICELL pin supports charging and backup for VSNVS - sustains RTC and secure non-volatile storage during main power loss
Programmable I²C address	7-bit address range 0x08–0x0F (bit 3 hard-coded) - avoids bus conflicts in multi-PMIC or sensor-rich embedded systems

Applications

Tablet Power Management	eReader System Power
Use Scenario: Portable Android/Linux tablet with i.MX 6UL processor, LPDDR2 memory, and dual-voltage microSD slot. IC Role / Device Role / Timing Role: Primary PMIC delivering VCORE (1.0–1.3 V), VDD_SOC (1.1 V), VREFDDR (0.675 V), V33 (3.3 V), and VCC_SD (1.8 V/3.3 V) with synchronized startup. Use Value: Reduces BOM count by integrating 4 buck, 6 LDO, DDR ref, and RTC supply - eliminates discrete regulators and timing ICs required for i.MX 6UL power tree.	Use Scenario: E-ink eReader using i.MX 6SL with ultra-low standby current and coin-cell backup. IC Role / Device Role / Timing Role: Manages deep-sleep entry via STANDBY pin, maintains VSNVS (3.0 V) from coin cell, and powers eInk display controller from VLDO2 (1.2 V). Use Value: Achieves <1.0 µA system standby current by disabling all non-RTC rails while preserving secure timekeeping - enabled by dedicated VSNVS LDO and OTP-configurable sleep mode.
POS Terminal Power	Industrial Control HMI
Use Scenario: Battery-powered point-of-sale terminal with i.MX 6SX, DDR3L memory, and USB OTG host. IC Role / Device Role / Timing Role: Supplies SWBST (5.05 V, 600 mA) for USB OTG VBUS, SW2 (1.8 V) for DDR3L I/O, and V33 (3.3 V) for peripheral interfaces. Use Value: Enables USB OTG host functionality without external boost converter - SWBST integrates OCP fault interrupt (INTB) for safe peripheral hot-plug detection.	Use Scenario: Ruggedized HMI panel with i.MX 7Dual, industrial temperature range, and isolated CAN/USB interfaces. IC Role / Device Role / Timing Role: Powers ARM Cortex-A7 cores (SW1A/B), GPU (SW2), DDR3L (VREFDDR), and isolated interface LDOs (VLDO1/VLDO4) with programmable sequencing for ESD-safe power-up. Use Value: OTP-programmed startup order prevents latch-up in isolated communication ICs - SW1A enables first, followed by VLDO4 (3.3 V) for CAN transceiver, then SW2 for DDR.

Tablet Power Management

eReader System Power

Use Scenario: Portable Android/Linux tablet with i.MX 6UL processor, LPDDR2 memory, and dual-voltage microSD slot.

IC Role / Device Role / Timing Role: Primary PMIC delivering VCORE (1.0–1.3 V), VDD_SOC (1.1 V), VREFDDR (0.675 V), V33 (3.3 V), and VCC_SD (1.8 V/3.3 V) with synchronized startup.

Use Value: Reduces BOM count by integrating 4 buck, 6 LDO, DDR ref, and RTC supply - eliminates discrete regulators and timing ICs required for i.MX 6UL power tree.

Use Scenario: E-ink eReader using i.MX 6SL with ultra-low standby current and coin-cell backup.

IC Role / Device Role / Timing Role: Manages deep-sleep entry via STANDBY pin, maintains VSNVS (3.0 V) from coin cell, and powers eInk display controller from VLDO2 (1.2 V).

Use Value: Achieves <1.0 µA system standby current by disabling all non-RTC rails while preserving secure timekeeping - enabled by dedicated VSNVS LDO and OTP-configurable sleep mode.

POS Terminal Power

Industrial Control HMI

Use Scenario: Battery-powered point-of-sale terminal with i.MX 6SX, DDR3L memory, and USB OTG host.

IC Role / Device Role / Timing Role: Supplies SWBST (5.05 V, 600 mA) for USB OTG VBUS, SW2 (1.8 V) for DDR3L I/O, and V33 (3.3 V) for peripheral interfaces.

Use Value: Enables USB OTG host functionality without external boost converter - SWBST integrates OCP fault interrupt (INTB) for safe peripheral hot-plug detection.

Use Scenario: Ruggedized HMI panel with i.MX 7Dual, industrial temperature range, and isolated CAN/USB interfaces.

IC Role / Device Role / Timing Role: Powers ARM Cortex-A7 cores (SW1A/B), GPU (SW2), DDR3L (VREFDDR), and isolated interface LDOs (VLDO1/VLDO4) with programmable sequencing for ESD-safe power-up.

Use Value: OTP-programmed startup order prevents latch-up in isolated communication ICs - SW1A enables first, followed by VLDO4 (3.3 V) for CAN transceiver, then SW2 for DDR.

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MC33PF3000A7ES	Automotive-grade (-40 °C to 105 °C), same OTP programming option (7: i.MX 6UL with DDR3L), identical pinout and register map	Qualified for automotive infotainment and ADAS modules requiring AEC-Q100 Grade 2 compliance	Select MC33PF3000A7ES for automotive deployments; MC32PF3000A0EP is rated for consumer-grade 0–85 °C operation only
MC34PF3000A8EP	Industrial-grade (-40 °C to 105 °C), OTP option 8 (i.MX 6UL with DDR3), same 48-QFN package and I²C interface	Targeted at industrial HMIs and gateway controllers needing extended temperature stability and DDR3 compatibility	Choose MC34PF3000A8EP when DDR3 (not DDR3L/LPDDR2) memory is used and operating ambient exceeds 85 °C

Compared with MC32PF3000A0EP, MC33PF3000A7ES adds automotive qualification and higher temperature tolerance but shares identical power architecture and OTP configuration - while MC34PF3000A8EP supports DDR3 memory and industrial thermal range at the cost of different OTP mapping and non-consumer qualification.

Availability

MC32PF3000A0EP is available at Aetrix Electronics and suitable for tablets, eReaders, and POS terminals requiring stable component supply with consistent OTP configuration (Option 0: unprogrammed) and consumer-grade thermal performance.

Supply support for MC32PF3000A0EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.

The PF3000 product line was designed specifically to simplify power delivery for NXP's i.MX 6 and i.MX 7 families - integrating OTP-configurable sequencing, multi-rail efficiency, and SoC-specific features like VREFDDR tracking and SD_VSEL support.

FAQ

What is the operating temperature range for MC32PF3000A0EP?

MC32PF3000A0EP is rated for 0 °C to 85 °C ambient operation, making it suitable for consumer electronics such as tablets and eReaders. It is not qualified for automotive or extended industrial temperature ranges - those require MC33PF3000A7ES (-40 °C to 105 °C) or MC34PF3000A8EP (-40 °C to 105 °C), respectively. The datasheet specifies this range in Table 1 under "Temperature (TA)" for the ~EP suffix variants.

Does MC32PF3000A0EP include factory-programmed OTP settings?

No, MC32PF3000A0EP has OTP memory in "not programmed" state (Option 0), meaning all startup parameters - including regulator voltages, sequencing order, PWRON configuration, and I²C address - must be defined by the user during system integration. This allows full customization for specific i.MX 6/7 board designs, unlike pre-programmed variants such as MC32PF3000A1EP (Option 1 for i.MX 7 with DDR3L).

How does the VREFDDR output relate to other rails in MC32PF3000A0EP?

MC32PF3000A0EP's VREFDDR output is set to exactly 0.5× the SW3 output voltage (e.g., if SW3 is configured to 1.35 V, VREFDDR = 0.675 V), ensuring precise DDR memory termination voltage tracking during dynamic voltage scaling. This ratio-based generation eliminates need for external resistive dividers and maintains compliance with DDR3L/LPDDR2 specifications across process and temperature variations.

Can MC32PF3000A0EP support USB OTG functionality?

Yes, MC32PF3000A0EP integrates SWBST - a dedicated 5.0–5.15 V, 600 mA boost regulator with OCP fault interrupt - explicitly designed to supply USB OTG VBUS. Its SWBSTFB and SWBSTLX pins enable standard inductor/diode implementation, and the INTB pin reports overcurrent events to the host processor, fulfilling essential USB power delivery and safety requirements.

What is the purpose of the SD_VSEL pin on MC32PF3000A0EP?

The SD_VSEL pin on MC32PF3000A0EP selects between two output voltage ranges for the VCC_SD LDO: logic LOW configures 2.85–3.30 V for standard SD card I/O, while logic HIGH selects 1.80–1.85 V for high-speed UHS-I mode. This hardware-selectable dual-voltage capability meets JEDEC SDIO specifications without requiring software reconfiguration or external level shifters.

MC32PF3000A0EP Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 48-VFQFN Exposed Pad

Packaging:: Tray

Product Status:: Active

Applications:: i.MX Processors

Current - Supply:: -

Voltage - Supply:: 2.8V ~ 5.5V

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-HVQFN (7x7)

MC32PF3000A0EP FAQ

1.How can I place an order for MC32PF3000A0EP through Aetrix?

Please submit a Request for Quotation (RFQ) for MC32PF3000A0EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC32PF3000A0EP reliable?

The price and inventory of MC32PF3000A0EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF3000A0EP is usually 5 days.

3.What payment methods are accepted for MC32PF3000A0EP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF3000A0EP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC32PF3000A0EP?

MC32PF3000A0EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC32PF3000A0EP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC32PF3000A0EP?

For technical support, including MC32PF3000A0EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF3000A0EP requirements.

6.How does Aetrix verify that MC32PF3000A0EP is sourced from the original manufacturer or authorized distributors?

All MC32PF3000A0EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF3000A0EP meets industry standards.

7.What is the process for return or replacement of MC32PF3000A0EP?

All MC32PF3000A0EP units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF3000A0EP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC32PF3000A0EP part is unused and in its original packaging.

Return procedure for MC32PF3000A0EP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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