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NXP Semiconductors MC32PF3000A0EPR2
- Part No.:
- MC32PF3000A0EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC32PF3000A0EPR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:3,952
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Product details
Overview
MC32PF3000A0EPR2 from NXP Semiconductors is a power management IC (PMIC) engineered for i.MX 6UL application processors with LPDDR2 memory, delivering four buck regulators (SW1A: 1.0 A, SW1B: 1.75 A, SW2: 1.25 A, SW3: 1.5 A), six LDOs including VCC_SD (100 mA, dual-voltage), V33 (350 mA), and VSNVS (3.0 V, 1.0 mA), plus DDR reference (VREFDDR) and coin-cell charging. It powers complete embedded systems in industrial handheld terminals.
For engineers reviewing the MC32PF3000A0EPR2 datasheet, MC32PF3000A0EPR2 pinout, MC32PF3000A0EPR2 application, or MC32PF3000A0EPR2 equivalent, key selection factors include OTP-programmable startup sequence, I²C-configurable dynamic voltage scaling across buck rails, VPWR front-end LDO support for >4.5 V inputs, and wettable-flank QFN-48 package compatibility with i.MX 6UL power tree requirements.
Technical Context
The MC32PF3000A0EPR2 implements SMARTMOS technology with integrated OTP memory to store regulator voltages, startup timing (0.5 ms or 2.0 ms per slot), and mode configuration-eliminating external resistive programming. Its control logic supports three operational states (On, Standby, Sleep/LPSR) managed via PWRON, STANDBY, and RESETBMCU pins, with programmable edge/level sensitivity on PWRON and active-high/low inversion on STANDBY.
Power architecture includes configurable SW1A/SW1B pairing (independent or combined 2.75 A), SW2 output range selection (1.50–1.85 V or 2.50–3.30 V), and VREFDDR generation at 0.5 × SW3_OUT. The VCC_SD regulator uses SD_VSEL input to switch between 1.80–1.85 V (SD card I/O) and 2.85–3.30 V (general-purpose), while VSNVS operates as either LDO or bypass switch powered by VIN or coin cell.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V (VIN) or 3.7–5.5 V (VPWR with external PFET); enables flexible system-level supply design |
| Buck Regulator Count | Four independent or combinable channels (SW1A/B, SW2, SW3); supports core, SOC, I/O, and DDR domains |
| Max Output Current | SW1A: 1.0 A, SW1B: 1.75 A, SW2: 1.25 A, SW3: 1.5 A; meets i.MX 6UL peak load demands without external boost |
| LDO Count & Key Outputs | Six LDOs: VCC_SD (100 mA, dual-voltage), V33 (350 mA), VLDO2 (250 mA, 0.8–1.55 V), VSNVS (1.0 mA, 3.0 V) |
| VREFDDR Accuracy | 0.5 × SW3_OUT, ±1% typical; provides precise DDR memory reference without external divider network |
| I²C Address Range | 0x08–0x0F (OTP-programmable LSBs); avoids bus conflicts in multi-PMIC or sensor-rich designs |
| Startup Sequence Control | OTP-programmable 15-slot sequence with 0.5/2.0 ms resolution; ensures deterministic power-up for i.MX 6UL boot reliability |
Pinout & Package
MC32PF3000A0EPR2 is housed in a 48-pin QFN package (98ASA00933D), 7.0 mm × 7.0 mm, wettable flank (WF-type), rated for −40 °C to +85 °C operation in consumer applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB | Open-drain fault interrupt output | Signals overcurrent, UVLO, or thermal fault to host processor; requires external pull-up |
| RESETBMCU | Open-drain reset output | Deasserts 2.0 ms after final regulator enable; configurable for fault-monitoring mode |
| PWRON | Power-on control input | Edge- or level-sensitive start trigger; supports mechanical switch debouncing up to 750 ms |
| SD_VSEL | Digital select for VCC_SD voltage | High = 1.80–1.85 V (SD card I/O), Low = 2.85–3.30 V (general-purpose); powered by VDDIO |
| SCL / SDA | I²C interface signals | Enable real-time voltage/frequency reconfiguration and fault register readback |
| SW1ALX / SW1BLX | Switch node outputs | Connect to respective inductors; SW1A/B can be paralleled via shared LX connection |
| VIN / VPWR | Main and high-voltage inputs | VIN ≤ 4.5 V direct; VPWR > 4.5 V requires external PFET for front-end LDO operation |
| GNDREF1 / GNDREF2 / GNDREF | Isolated ground references | Separate return paths for buck stages and core logic prevent noise coupling into sensitive analog blocks |
Key Features
| Feature | Design Value |
|---|---|
| OTP-Programmable Power Tree | Stores startup sequence, regulator voltages, and I²C address-reduces BOM count and eliminates resistor networks |
| Configurable SW1A/SW1B Operation | Independent (1.0 A + 1.75 A) or combined (2.75 A) mode; adapts to i.MX 6UL core voltage and current profiles |
| VCC_SD Dual-Voltage Support | Hardware-selectable 1.8 V or 3.3 V output via SD_VSEL; satisfies SDIO timing requirements without external switching |
| VREFDDR Generation | Internally derived at 0.5 × SW3_OUT with <1% error; removes need for precision external resistor divider |
| VPWR Front-End LDO Interface | LDOG gate driver controls external P-MOSFET; extends input range to 5.5 V while protecting internal regulators |
| Industrial Temperature Grade | −40 °C to +85 °C rating (per MC32 prefix); validated for use in ruggedized handheld and terminal equipment |
Applications
| Handheld Industrial Terminal | Secure POS System |
|---|---|
|
Use Scenario: Ruggedized barcode scanner with i.MX 6UL, LPDDR2, and dual-voltage SD card interface. IC Role / Device Role / Timing Role: Central PMIC supplying ARM core (SW1A/B), SOC logic (SW2), DDR I/O (VREFDDR), and secure element (V33). Use Value: OTP-programmed startup ensures deterministic boot before OS load; VCC_SD dual-voltage supports legacy and UHS-I SD cards. |
Use Scenario: PCI-compliant payment terminal with EMV contact chip, NFC, and tamper-evident enclosure. IC Role / Device Role / Timing Role: Powers i.MX 6UL application processor, secure crypto module (VLDO2), and isolated communication interfaces (V33, VLDO4). Use Value: VSNVS 3.0 V rail maintains RTC and security state during main power loss; coin-cell charging enables long-term tamper logging. |
| Smart Home Gateway | Medical Data Logger |
|
Use Scenario: Edge gateway aggregating Zigbee, BLE, and Wi-Fi sensors with local AI inference on i.MX 6UL. IC Role / Device Role / Timing Role: Delivers core (SW1A/B), memory (SW3 + VREFDDR), and peripheral rails (VLDO1, VLDO2) with dynamic voltage scaling. Use Value: DVS reduces active power by 22% during low-load inference cycles; SW2's 2.5–3.3 V range powers Wi-Fi SoC directly. |
Use Scenario: Battery-powered wearable ECG monitor with i.MX 6UL, analog front-end, and Bluetooth LE radio. IC Role / Device Role / Timing Role: Manages ultra-low-power sleep modes (LPSR), coin-cell backup (LICELL), and precision analog supplies (VLDO2, VREFDDR). Use Value: Standby current <1.5 μA preserves battery life; VSNVS 3.0 V maintains RTC and SRAM retention during deep sleep. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF3000A8ES | Same PF3000 silicon, but rated −40 °C to +105 °C (industrial grade) and pre-programmed for i.MX 6UL with DDR3 | Targets higher ambient temperature environments (e.g., factory floor gateways) and DDR3 memory instead of LPDDR2 | Select when operating above 85 °C or using DDR3; requires board-level validation of DDR timing margins |
| PF8100A0ES | Different architecture: single-phase buck + 5 LDOs; no SW1A/B combination, no VREFDDR generator, no coin-cell charger | Designed for simpler i.MX 6SoloLite systems without DDR memory or RTC backup requirements | Choose only for cost-optimized, non-RTC, non-DDR designs; lacks VREFDDR, VSNVS, and OTP flexibility of MC32PF3000A0EPR2 |
Compared with MC34PF3000A8ES, MC32PF3000A0EPR2 offers lower temperature rating but exact LPDDR2/OTP configuration for i.MX 6UL; versus PF8100A0ES, it delivers full DDR support, coin-cell backup, and programmable sequencing-critical for secure, memory-rich industrial terminals.
Availability
MC32PF3000A0EPR2 is available at Aetrix Electronics and suitable for industrial handheld terminals, secure point-of-sale systems, and smart home gateways requiring stable component supply, long-lifecycle support, and traceable sourcing.
Supply support for MC32PF3000A0EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based application processors and power management.
The PF3000 product line was designed specifically to simplify power delivery for NXP's i.MX 6 and i.MX 7 families-integrating OTP-programmable sequencing, DDR reference generation, and coin-cell backup into a single wettable-flank QFN package.
FAQ
What is the operating temperature range for MC32PF3000A0EPR2?
MC32PF3000A0EPR2 is qualified for −40 °C to +85 °C operation, matching consumer-grade thermal requirements. This range is defined by its MC32 prefix and aligns with typical industrial handheld and terminal environments where ambient heat buildup occurs but does not exceed 85 °C junction limits under proper PCB thermal design.
Does MC32PF3000A0EPR2 support DDR3L memory voltage reference?
No, MC32PF3000A0EPR2 is pre-programmed for i.MX 6UL with LPDDR2 (Ordering Code A5), not DDR3L. Its VREFDDR output is generated as 0.5 × SW3_OUT and configured during OTP programming; DDR3L support requires MC32PF3000A7ES (Code A7) or MC34PF3000A7ES (Code A7, industrial grade).
How is the VCC_SD output voltage selected on MC32PF3000A0EPR2?
MC32PF3000A0EPR2 uses the SD_VSEL pin to select VCC_SD output: logic high sets 1.80–1.85 V for SD card I/O compliance, while logic low selects 2.85–3.30 V for general-purpose peripherals. The SD_VSEL buffer is powered by VDDIO, defaulting to high if VDDIO is absent-ensuring safe boot into low-voltage mode.
Can MC32PF3000A0EPR2 operate with a 5.0 V input supply?
Yes, MC32PF3000A0EPR2 accepts 5.0 V via the VPWR pin when used with an external P-MOSFET controlled by the LDOG pin. Direct 5.0 V connection to VIN is not allowed, as VIN max is 4.5 V; the VPWR path routes input through the front-end LDO to protect internal regulators.
What package type and pin count does MC32PF3000A0EPR2 use?
MC32PF3000A0EPR2 uses a 48-pin QFN package (98ASA00933D), 7.0 mm × 7.0 mm, with wettable flank (WF-type) leads for automated optical inspection. The R2 suffix indicates tape-and-reel packaging per JEDEC standard J-STD-020, supporting high-volume SMT assembly.
MC32PF3000A0EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- i.MX Processors
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC32PF3000A0EPR2 FAQ
1.How can I place an order for MC32PF3000A0EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF3000A0EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF3000A0EPR2 reliable?
The price and inventory of MC32PF3000A0EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF3000A0EPR2 is usually 5 days.
3.What payment methods are accepted for MC32PF3000A0EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF3000A0EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF3000A0EPR2?
MC32PF3000A0EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF3000A0EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF3000A0EPR2?
For technical support, including MC32PF3000A0EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF3000A0EPR2 requirements.
6.How does Aetrix verify that MC32PF3000A0EPR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF3000A0EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF3000A0EPR2 meets industry standards.
7.What is the process for return or replacement of MC32PF3000A0EPR2?
All MC32PF3000A0EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF3000A0EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF3000A0EPR2 part is unused and in its original packaging.
Return procedure for MC32PF3000A0EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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