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NXP Semiconductors MC32PF3000A1EPR2
- Part No.:
- MC32PF3000A1EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC32PF3000A1EPR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:3,593
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Product details
Overview
MC32PF3000A1EPR2 from NXP Semiconductors is a power management IC (PMIC) engineered for i.MX 7 processors with DDR3L memory, integrating four buck regulators (SW1A/B up to 2.75 A combined), six LDOs, RTC supply (VSNVS, 3.0 V), DDR reference (VREFDDR, 0.5–0.9 V), and coin-cell charging. It delivers complete system power for application processors, memory, and peripherals in space-constrained portable electronics.
For engineers reviewing the MC32PF3000A1EPR2 datasheet, MC32PF3000A1EPR2 pinout, MC32PF3000A1EPR2 application, or MC32PF3000A1EPR2 equivalent, key selection criteria include OTP-programmed startup sequence for i.MX 7 + DDR3L, I²C-configurable voltage rails, dynamic voltage scaling support, and wettable-flank 48-QFN package compatibility with thermal vias.
Technical Context
The MC32PF3000A1EPR2 implements SMARTMOS technology with OTP-programmed configuration for fixed startup behavior targeting i.MX 7 + DDR3L systems. Its control logic supports three operational modes-On, Standby, and Sleep/LPSR-with PWRON edge- or level-triggered wake-up and STANDBY input for low-power state entry.
It features programmable soft-start ramp rates (25 mV/2 µs or 4 µs), selectable PWM/PEM/APS switching modes per buck regulator, and I²C address configurability (0x08–0x0F). The SW1A/SW1B dual-buck architecture allows either independent operation (1.0 A / 1.75 A) or parallel 2.75 A mode, with feedback pins routed separately for optimal regulation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V (VIN) or 3.7–5.5 V (VPWR via external FET); enables flexible system-level power path design |
| Buck Regulator Count | Four configurable channels: SW1A/B (1.0 A / 1.75 A or 2.75 A combined), SW2 (1.25 A), SW3 (1.5 A) |
| LDO Count & Max Current | Six LDOs: V33 (350 mA), VLDO4 (350 mA), VLDO2 (250 mA), VCC_SD (100 mA), VLDO1/VLDO3 (100 mA each) |
| VREFDDR Output | 0.5–0.9 V, 10 mA; tracks 50% of SW3 output for precise DDR3L memory reference |
| RTC Supply (VSNVS) | 3.0 V, 1.0 mA; always-on rail powered by VIN or coin cell for secure non-volatile subsystems |
| I²C Interface | Configurable slave address (0x08–0x0F); supports real-time voltage, sequencing, and fault register access |
| OTP Memory | One-time programmable storage for startup sequence, regulator voltages, PWRON/RESETBMCU modes, and I²C address |
Pinout & Package
MC32PF3000A1EPR2 uses a 48-pin QFN package (7.0 mm × 7.0 mm, wettable flank, exposed pad) optimized for thermal dissipation and automated optical inspection. The exposed pad (EP) must be connected to inner/external ground planes via multiple vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB | Open-drain interrupt output | Asserts low on fault (OCP, UVLO, thermal); requires external pull-up for processor notification |
| SW1ALX / SW1BLX | Switch node outputs | Connect to respective inductors; tied together when SW1A/B operate in parallel 2.75 A mode |
| VCC_SD / SD_VSEL | Dual-voltage SD card LDO + control input | SD_VSEL selects 1.8 V/1.85 V or 2.85–3.3 V output; critical for high-speed SDIO interface compliance |
| VREFDDR / VINREFDDR / VHALF | DDR reference generation network | VHALF provides half-supply bias; VINREFDDR requires 1.0 μF net capacitance to ground for stable 0.5×SW3 tracking |
| PWRON / STANDBY | Power-state control inputs | PWRON supports edge- or level-triggered wake-up; STANDBY enables hardware-controlled low-power entry |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmed i.MX 7 + DDR3L power tree | Pre-configured startup sequence, voltage levels, and timing eliminates external configuration components and reduces BOM count |
| Dynamic voltage scaling (DVS) per buck | Enables real-time core voltage adjustment during processor load changes, reducing active power consumption |
| SW1A/SW1B dual-mode buck architecture | Supports either independent 1.0 A / 1.75 A rails or combined 2.75 A for high-current cores-no PCB redesign needed |
| VSNVS coin-cell backup capability | Maintains RTC and SNVS domain operation during main power loss, enabling secure timekeeping and tamper-resilient functions |
| Wettable flank QFN package | Enables automated solder-joint inspection and improves thermal performance over standard QFN in high-reliability applications |
Applications
| Tablet Power Management | eReader System Power |
|---|---|
Use Scenario: Portable tablet with i.MX 7 SoC, DDR3L RAM, and multi-rail peripherals including display, touch, and Wi-Fi. IC Role / Device Role / Timing Role: Central PMIC supplying VCORE, VDD_SOC, VDDA_1P8, NVCC_DRAM_CKE, and VCC_SD_IO with synchronized startup and DVS. Use Value: Single-chip solution replaces ≥7 discrete regulators, reduces layout area by 40%, and enables fast boot via OTP-optimized sequencing. | Use Scenario: Low-power eReader using i.MX 6SL with LPDDR2 and E Ink display requiring ultra-low standby current. IC Role / Device Role / Timing Role: Provides always-on VSNVS, regulated V33 for display interface, and sequenced LDOs for sensor and flash memory rails. Use Value: Achieves <5 µA system standby via Sleep/LPSR mode and coin-cell-backed RTC, extending battery life to >30 days. |
| Industrial HMI Panel | Medical Wearable Monitor |
Use Scenario: Fanless industrial HMI panel with i.MX 6SX, DDR3 memory, and CAN/Ethernet interfaces operating at -40 °C to 85 °C. IC Role / Device Role / Timing Role: Delivers robust 3.3 V, 1.8 V, and 1.2 V rails with thermal fault protection and I²C-monitored health status. Use Value: Wettable flank package ensures solder joint reliability; VPWR input option supports 5.5 V industrial supplies without external LDO. | Use Scenario: Compact wearable ECG monitor with i.MX 6UL, LPDDR2, and analog front-end requiring medical-grade power integrity. IC Role / Device Role / Timing Role: Supplies clean, low-noise analog rails (VLDO2: 0.8–1.55 V) and digital domains while maintaining SNVS for timestamped patient data. Use Value: Independent LDO regulation minimizes cross-talk between analog sensing and digital processing paths, meeting IEC 60601 ripple limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF3000A1ES | Same PF3000 silicon, but rated for -40 °C to 105 °C industrial temp range and shipped in tape-and-reel (no R2 suffix required) | Targeted at extended-temperature industrial or automotive-adjacent designs where ambient exceeds 85 °C | Select MC34PF3000A1ES if operating above 85 °C or requiring full industrial qualification; otherwise MC32PF3000A1EPR2 suffices for consumer-grade tablets/eReaders. |
| PF0100A0ES | Legacy NXP PMIC for i.MX 6SoloLite; lacks SW3, VREFDDR, coin-cell charger, and OTP programmability; fixed startup only | Supports simpler i.MX 6SL systems without DDR3L or advanced power states; no DVS or VREFDDR tracking | Choose PF0100A0ES only for cost-sensitive legacy i.MX 6SL designs without DDR3L or RTC backup needs; not suitable for i.MX 7 or new designs. |
Compared with MC34PF3000A1ES, MC32PF3000A1EPR2 offers identical functionality but lower temperature rating and tape-and-reel packaging; versus PF0100A0ES, it adds DDR3L support, VREFDDR, OTP flexibility, and enhanced thermal management-making it essential for modern i.MX 7 platforms.
Availability
MC32PF3000A1EPR2 is available at Aetrix Electronics and suitable for tablets, eReaders, and industrial HMI panels requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.
Supply support for MC32PF3000A1EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and associated power management.
The PF3000 product line was designed specifically to deliver integrated, OTP-configurable power solutions for NXP's i.MX 6 and i.MX 7 application processors-enabling compact, reliable, and software-flexible power trees in portable and embedded systems.
FAQ
What is the primary application target for the MC32PF3000A1EPR2?
The MC32PF3000A1EPR2 is pre-programmed for use with NXP i.MX 7 application processors paired with DDR3L memory. Its OTP configuration defines the startup sequence, voltage levels, and timing specifically for this combination, making it ideal for tablets, eReaders, and industrial HMIs requiring tight integration with i.MX 7 SoCs.
Does the MC32PF3000A1EPR2 support dynamic voltage scaling (DVS)?
Yes, the MC32PF3000A1EPR2 supports DVS on all four buck regulators (SW1A, SW1B, SW2, SW3). This allows real-time adjustment of output voltages under processor command to reduce dynamic power consumption during variable workload conditions, a key feature for battery-powered i.MX 7 systems.
How does the VREFDDR function work on the MC32PF3000A1EPR2?
The MC32PF3000A1EPR2 generates VREFDDR as 50% of the SW3 output voltage (0.5 × SW3_OUT), adjustable from 0.5 V to 0.9 V. This tracking architecture ensures precise DDR3L memory reference voltage alignment, eliminating need for external resistive dividers and improving signal integrity in high-speed memory interfaces.
Can the MC32PF3000A1EPR2 be used with i.MX 6UL instead of i.MX 7?
No-the MC32PF3000A1EPR2 is OTP-programmed specifically for i.MX 7 with DDR3L (programming option "1"). For i.MX 6UL, NXP specifies variants like MC32PF3000A6EPR2 (LPDDR2) or MC32PF3000A7EPR2 (DDR3L); using MC32PF3000A1EPR2 with i.MX 6UL may result in incorrect rail sequencing or voltage levels.
What package type and thermal considerations apply to the MC32PF3000A1EPR2?
The MC32PF3000A1EPR2 uses a 48-pin wettable flank QFN (98ASA00933D, 7.0 mm × 7.0 mm). Its exposed pad (EP) must be connected to ground planes via ≥4 thermal vias to maintain junction temperature within spec. The wettable flank design enables AOI-compatible solder joints critical for high-reliability manufacturing.
MC32PF3000A1EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- i.MX Processors
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC32PF3000A1EPR2 FAQ
1.How can I place an order for MC32PF3000A1EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF3000A1EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF3000A1EPR2 reliable?
The price and inventory of MC32PF3000A1EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF3000A1EPR2 is usually 5 days.
3.What payment methods are accepted for MC32PF3000A1EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF3000A1EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF3000A1EPR2?
MC32PF3000A1EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF3000A1EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF3000A1EPR2?
For technical support, including MC32PF3000A1EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF3000A1EPR2 requirements.
6.How does Aetrix verify that MC32PF3000A1EPR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF3000A1EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF3000A1EPR2 meets industry standards.
7.What is the process for return or replacement of MC32PF3000A1EPR2?
All MC32PF3000A1EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF3000A1EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF3000A1EPR2 part is unused and in its original packaging.
Return procedure for MC32PF3000A1EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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