My Inquiry
My Account
NXP Semiconductors MC32PF3000A2EPR2
- Part No.:
- MC32PF3000A2EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC32PF3000A2EPR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:1,108
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC32PF3000A2EPR2 from NXP Semiconductors is a power management IC (PMIC) engineered for i.MX 7 processors with LPDDR3 memory, integrating four buck regulators (SW1A/B up to 2.75 A combined), six LDOs, RTC supply (VSNVS, 3.0 V), DDR reference (VREFDDR, 0.5–0.9 V), and coin-cell charging. It delivers full-system power for application processors, memory, and peripherals in compact consumer electronics.
For engineers reviewing the MC32PF3000A2EPR2 datasheet, MC32PF3000A2EPR2 pinout, MC32PF3000A2EPR2 application, or MC32PF3000A2EPR2 equivalent, key selection criteria include OTP-programmable startup sequence, dynamic voltage scaling support for core rails, I²C-configurable regulator voltages, and wettable-flank 48-QFN packaging for automated optical inspection.
Technical Context
The MC32PF3000A2EPR2 implements SMARTMOS technology with OTP-based configuration for fixed startup behavior and runtime I²C reprogramming. Its SW1A/SW1B architecture supports both independent operation (1.0 A / 1.75 A) and parallel mode (2.75 A), enabling flexible core voltage delivery for i.MX 7 SoCs requiring LPDDR3 interface compliance.
Regulator control includes programmable PWM/PPM/APS modes, soft-start sequencing with 0.5 ms or 2.0 ms slot resolution, and fault-interrupt signaling via INTB. The VCC_SD LDO supports dual-voltage SD card operation (1.8 V or 3.3 V) via SD_VSEL, while VREFDDR derives from SW3 output for precise DDR termination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V (VIN) or 3.7–5.5 V (VPWR with external PFET) |
| SW1A/B Combined Output | 2.75 A at 0.7–1.425 V; enables single-rail core supply for i.MX 7 CPU |
| VREFDDR Accuracy | 0.5 × SW3_OUT (±1% typical); provides matched DDR3L reference without external divider |
| VSNVS Output | 3.0 V, 1.0 mA; powers i.MX SNVS domain and maintains RTC during main power loss |
| I²C Address Range | 0x08–0x0F (OTP-programmable); avoids bus conflicts in multi-PMIC systems |
| Startup Sequence Slots | 15 configurable positions with 0.5/2.0 ms step; ensures safe power-up order for processor, memory, and peripherals |
| Package | 48-pin QFN, 7.0 mm × 7.0 mm, wettable flank; supports AOI and high-density PCB assembly |
Pinout & Package
MC32PF3000A2EPR2 uses a 48-pin QFN package (98ASA00933D) with wettable flanks, 7.0 mm × 7.0 mm footprint, and exposed thermal pad (EP) tied to ground for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB | Open-drain interrupt output | Signals overcurrent, undervoltage, or thermal faults to host processor; requires external pull-up |
| SD_VSEL | Digital input (VDDIO-referenced) | Selects VCC_SD output: 1.8 V/1.85 V (high) or 2.85–3.3 V (low); enables dual-voltage SD card support |
| RESETBMCU | Open-drain reset output | Deasserts 2.0 ms after final regulator enable; indicates full power rail readiness to i.MX 7 |
| SW1ALX / SW1BLX | Analog switch node outputs | Connect to shared inductor in parallel mode or separate inductors in independent mode; defines SW1A/B topology |
| VREFDDR | Analog reference output | Provides 0.5×SW3_OUT for DDR3L termination; bypassed with 1.0 μF capacitor to GND |
| EP | Exposed thermal pad | Ground return for buck/boost regulators; must connect to internal/external ground planes via multiple vias |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmable startup sequence | Eliminates external timing components; enables deterministic, repeatable power-up across i.MX 7/LPDDR3 designs |
| SW1A/SW1B parallel operation | Delivers 2.75 A core rail from single inductor layout, reducing BOM count and PCB area vs. discrete solutions |
| VCC_SD dual-voltage regulation | Supports both 1.8 V UHS-I and 3.3 V legacy SD card interfaces without external level shifters |
| VREFDDR derived from SW3 | Ensures tight tracking between DDR VDDQ and reference voltage, improving signal integrity and margin |
| Integrated coin-cell charger | Maintains VSNVS and RTC during main power loss; eliminates need for external charging circuitry |
Applications
| Tablet Power Management | eReader System Power |
|---|---|
Use Scenario: Portable tablet with i.MX 7 SoC, LPDDR3 RAM, and dual-voltage SD card slot. IC Role / Device Role / Timing Role: Central PMIC supplying all rails: VCORE (SW1A/B), VDD_SOC (SW2), VDD_IO (V33), VCC_SD, and VREFDDR. Use Value: OTP-configured startup sequence ensures correct power-up order; VCC_SD dual-voltage mode supports both UHS-I and legacy SD cards. | Use Scenario: Battery-powered eReader with always-on RTC, low-quiescent current requirements, and LPDDR3 memory. IC Role / Device Role / Timing Role: Provides ultra-low-power standby via STANDBY input and VSNVS-backed RTC; regulates core, memory, and display interface rails. Use Value: Coin-cell backup sustains RTC during battery removal; programmable sleep modes minimize system leakage current. |
| Industrial HMI Panel | Medical Wearable Monitor |
Use Scenario: Fanless industrial HMI using i.MX 7, DDR3L memory, and USB OTG peripheral. IC Role / Device Role / Timing Role: Delivers SWBST (5.0–5.15 V, 600 mA) for USB OTG VBUS; supplies V33, VLDO2 (0.8–1.55 V), and VREFDDR. Use Value: Boost regulator eliminates need for external charge pump; SW2's 1.5–1.85 V range matches i.MX 7 VDD_ARM requirements. | Use Scenario: Compact wearable with i.MX 6UL (pin-compatible family), LPDDR2, and sensor interface. IC Role / Device Role / Timing Role: Powers sensor LDOs (VLDO1/VLDO2), MCU core (SW3, 0.9–1.65 V), and secure RTC (VSNVS). Use Value: Wettable-flank QFN enables reliable reflow in small-form-factor assemblies; OTP lock prevents field configuration drift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF3000A7ES | Automotive-grade (-40 °C to 105 °C), same OTP option 7 (i.MX 6UL with DDR3L), identical pinout and register map | Qualified for automotive infotainment; requires AEC-Q100 documentation and extended temp validation | Select when operating above 85 °C or requiring automotive qualification; no hardware change needed |
| MC34PF3000A8ES | Industrial-grade (-40 °C to 105 °C), OTP option 8 (i.MX 6UL with DDR3), differs in DDR voltage mapping and startup defaults | Targeted for industrial gateways with DDR3 memory; lacks LPDDR3-specific timing calibration | Choose for DDR3-based i.MX 6UL designs; verify VREFDDR derivation and SW3 ramp rate compatibility |
Compared with MC32PF3000A2EPR2, MC33PF3000A7ES offers extended temperature operation without functional trade-offs, while MC34PF3000A8ES supports DDR3 instead of LPDDR3-requiring validation of memory interface timing and OTP startup parameters.
Availability
MC32PF3000A2EPR2 is available at Aetrix Electronics and suitable for tablets, eReaders, and industrial HMIs requiring stable component supply, long-term lifecycle support, and consistent OTP programming across production batches.
Supply support for MC32PF3000A2EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and consumer applications.
The PF3000 product line delivers highly integrated, OTP-configurable PMICs optimized for NXP's i.MX application processors, reducing external component count and simplifying power tree design for LPDDR3/DDR3L memory systems.
FAQ
What is the primary target processor for MC32PF3000A2EPR2?
MC32PF3000A2EPR2 is specifically configured for the NXP i.MX 7 application processor with LPDDR3 memory interface. Its OTP programming (option A2) sets startup sequences, voltage levels, and timing parameters aligned with i.MX 7's power requirements, including SW1A/B parallel operation for core voltage and VREFDDR derivation from SW3 output.
Does MC32PF3000A2EPR2 support both DDR3L and LPDDR3 memory types?
No - MC32PF3000A2EPR2 is pre-programmed for LPDDR3 (OTP option A2). While the underlying PF3000 silicon supports multiple memory types via OTP, this specific variant configures VREFDDR, SW3 ramp rate, and startup timing for LPDDR3 compliance. DDR3L support requires MC32PF3000A1ES or MC32PF3000A3ES variants.
How is the VCC_SD regulator voltage selected on MC32PF3000A2EPR2?
VCC_SD output voltage on MC32PF3000A2EPR2 is selected dynamically via the SD_VSEL pin: logic high yields 1.8–1.85 V for UHS-I SD cards, while logic low selects 2.85–3.3 V for legacy SD interfaces. The SD_VSEL buffer is powered by VDDIO, defaulting to high (1.8 V mode) if VDDIO is absent.
Can MC32PF3000A2EPR2 operate without an external coin cell?
Yes - MC32PF3000A2EPR2 functions fully without a coin cell, but VSNVS will be sourced from VIN and lost during main power interruption. For persistent RTC operation during battery removal or power loss, a coin cell must be connected to LICELL and properly biased per the datasheet's VSNVS power path requirements.
What package type and thermal features does MC32PF3000A2EPR2 use?
MC32PF3000A2EPR2 uses a 48-pin QFN package (98ASA00933D) with 7.0 mm × 7.0 mm footprint and wettable flanks for automated optical inspection. Its exposed thermal pad (EP) serves as the primary ground return for buck/boost regulators and must be connected to inner/outer ground planes via ≥6 thermal vias to maintain junction temperature within specification under full load.
MC32PF3000A2EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- i.MX Processors
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC32PF3000A2EPR2 FAQ
1.How can I place an order for MC32PF3000A2EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF3000A2EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF3000A2EPR2 reliable?
The price and inventory of MC32PF3000A2EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF3000A2EPR2 is usually 5 days.
3.What payment methods are accepted for MC32PF3000A2EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF3000A2EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF3000A2EPR2?
MC32PF3000A2EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF3000A2EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF3000A2EPR2?
For technical support, including MC32PF3000A2EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF3000A2EPR2 requirements.
6.How does Aetrix verify that MC32PF3000A2EPR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF3000A2EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF3000A2EPR2 meets industry standards.
7.What is the process for return or replacement of MC32PF3000A2EPR2?
All MC32PF3000A2EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF3000A2EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF3000A2EPR2 part is unused and in its original packaging.
Return procedure for MC32PF3000A2EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC32PF3000A2EPR2 Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
