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NXP Semiconductors MC32PF3000A3EP
- Part No.:
- MC32PF3000A3EP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC32PF3000A3EP.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:225
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Product details
Overview
MC32PF3000A3EP from NXP Semiconductors is a pre-programmed power management IC (PMIC) optimized for i.MX 6SX application processors with DDR3L memory, delivering four buck regulators (SW1A/B up to 2.75 A combined, SW2 at 1.25 A, SW3 at 1.5 A), six LDOs including VCC_SD and V33, RTC supply (VSNVS at 3.0 V), and DDR reference (VREFDDR). It supports dynamic voltage scaling, I²C programmability, and OTP-configured startup sequencing for embedded industrial systems.
For engineers reviewing the MC32PF3000A3EP datasheet, MC32PF3000A3EP pinout, MC32PF3000A3EP application, or MC32PF3000A3EP equivalent, key selection criteria include its i.MX 6SX + DDR3L–specific OTP configuration, 48-pin QFN wettable flank package, VIN input range (2.8–4.5 V), and integrated coin-cell charger for always-on SNVS domain operation.
Technical Context
The MC32PF3000A3EP implements SMARTMOS-based power architecture with configurable buck regulator topology: SW1A (1.0 A) and SW1B (1.75 A) can operate independently or in parallel as a single 2.75 A channel. Its OTP memory stores startup sequence timing, output voltages, PWRON edge/level mode, and I²C address (default 0x08), eliminating external configuration components.
It integrates dedicated analog blocks including VREFDDR (0.5 × SW3_OUT, ±1% accuracy), VSNVS (3.0 V, 1 mA), and dual-voltage VCC_SD (1.8 V/1.85 V or 2.85–3.3 V selectable via SD_VSEL), all synchronized to internal 32 kHz and 16 MHz clocks for precise rail sequencing in i.MX 6SX-based designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V (VIN supply); supports VPWR front-end LDO for 3.7–5.5 V systems |
| Buck Regulator Count | Four: SW1A/B (configurable 1.0/1.75 A or 2.75 A combined), SW2 (1.25 A), SW3 (1.5 A) |
| LDO Count & Output | Six: VCC_SD (100 mA, dual-voltage), V33 (350 mA), VLDO1–4 (100–350 mA, 0.8–3.3 V range) |
| VREFDDR Accuracy | 0.5 × SW3 output voltage, ±1% tolerance, 10 mA drive for DDR3L termination |
| RTC Supply | VSNVS = 3.0 V, 1.0 mA, battery-backed with integrated coin-cell charger |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz) compatible; address programmable 0x08–0x0F |
| OTP Memory | One-time programmable storage for startup sequence, voltage settings, PWRON mode, and I²C address |
Pinout & Package
MC32PF3000A3EP uses a 48-pin QFN package (98ASA00933D), 7.0 mm × 7.0 mm, wettable flank (WF-type), with exposed thermal pad (EP) tied to ground for enhanced thermal dissipation in industrial ambient conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB (Pin 1) | Open-drain fault interrupt output | Asserts low on overcurrent, undervoltage, or thermal fault; requires external pull-up for host processor notification |
| SW1ALX (Pin 8) / SW1BLX (Pin 9) | Switch node outputs | Connect to respective inductors in independent mode; shorted together when SW1A/B configured as single 2.75 A regulator |
| VCC_SD (Pin 33) / V33 (Pin 32) | Dual-output LDOs | VCC_SD supports SD card interface voltage selection (1.8 V or 3.3 V range) via SD_VSEL; V33 powers 3.3 V GPIO and peripherals |
| VSNVS (Pin 34) | Always-on RTC supply | Provides 3.0 V to i.MX 6SX Secure Non-Volatile Storage domain; powered from VIN or coin cell during backup |
| PWRON (Pin 48) | Power-on control input | Configurable for level- or edge-triggered wake-up; supports hardware debounce (31.25–750 ms) for mechanical switch interfacing |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured startup sequence | Eliminates external RC timing networks; enables precise 0.5–2.0 ms slot delays between 15 configurable regulator enable events |
| Dynamic voltage scaling (DVS) | Real-time SW1A/SW1B/SW2/SW3 output adjustment via I²C for i.MX 6SX core and memory rail optimization |
| DDR3L-specific power tree | Pre-programmed for i.MX 6SX + DDR3L: SW3 supplies VDDQ (0.9–1.65 V), VREFDDR derives from SW3 for matched tracking |
| VCC_SD dual-voltage support | Hardware-selectable 1.8 V/1.85 V or 2.85–3.3 V output via SD_VSEL pin, enabling compatibility with legacy and high-speed SD interfaces |
| Integrated coin-cell charging | Enables seamless RTC/SNVS backup without discrete charger IC; supports Li-ion or NiMH coin cells with charge current regulation |
Applications
| Industrial HMI Panels | Smart POS Terminals |
|---|---|
Use Scenario: Ruggedized touch-screen displays with i.MX 6SX SoC, DDR3L memory, and 3.3 V peripheral interfaces operating in factory environments. IC Role / Device Role / Timing Role: Central PMIC providing sequenced core (SW1A/B), memory (SW3 + VREFDDR), I/O (V33), and SD card (VCC_SD) rails with DVS for thermal management. Use Value: Reduces BOM count by integrating seven regulators and DDR reference; OTP programming ensures repeatable power-up behavior across production units. | Use Scenario: Compact retail payment terminals requiring secure boot, real-time clock, and dual-voltage SD card support for firmware updates. IC Role / Device Role / Timing Role: Powers i.MX 6SX application processor, LPDDR2/DDR3L memory, and secure element while maintaining VSNVS for tamper-resistant timekeeping. Use Value: Coin-cell backup enables uninterrupted RTC operation during main power loss; VCC_SD voltage select supports both legacy and UHS-I SD cards. |
| Medical Data Loggers | Home Energy Gateways |
Use Scenario: Battery-powered wearable monitors collecting sensor data and transmitting via BLE/Wi-Fi, requiring ultra-low quiescent current and reliable cold-start capability. IC Role / Device Role / Timing Role: Manages multi-rail power delivery (core, memory, radio, sensors) with programmable standby/sleep modes and precise reset timing via RESETBMCU. Use Value: SMARTMOS process enables <100 µA quiescent current in Sleep mode; OTP-configured startup avoids software dependency during initial boot. | Use Scenario: Residential smart meter gateways with i.MX 6SX, Zigbee/Thread radios, and local display, deployed in temperature-variable indoor environments. IC Role / Device Role / Timing Role: Supplies processor cores (SW1A/B), DDR3L (SW3 + VREFDDR), 3.3 V comms interfaces (V33), and always-on security domain (VSNVS). Use Value: Wettable flank QFN package ensures IPC Class 2 solder joint reliability; -40 °C to 85 °C rating matches residential HVAC operating envelope. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC32PF3000A4EP | OTP programmed for i.MX 6SX with standard DDR3 (not DDR3L); VREFDDR derived from fixed 0.5×VDDQ reference | Requires DDR3 memory interface; not validated for DDR3L low-voltage operation or extended temperature range | Select only if target system uses DDR3 (1.5 V) instead of DDR3L (1.35 V) memory |
| MC34PF3000A3EP | Same OTP configuration (i.MX 6SX + DDR3L) but rated for -40 °C to 105 °C industrial operation; identical pinout and electrical specs | Qualified for higher ambient temperatures; suitable for enclosed industrial enclosures or automotive-adjacent deployments | Choose for extended temperature requirements; otherwise electrically interchangeable with MC32PF3000A3EP |
Compared with MC32PF3000A3EP, MC32PF3000A4EP lacks DDR3L-specific VREFDDR tracking and operates only up to 85 °C, while MC34PF3000A3EP offers identical functionality with extended thermal qualification-making it a drop-in upgrade for harsher environments without layout or firmware changes.
Availability
MC32PF3000A3EP is available at Aetrix Electronics and suitable for industrial HMI panels, smart POS terminals, medical data loggers, and home energy gateways requiring stable component supply and long-term lifecycle support.
Supply support for MC32PF3000A3EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in ARM-based application processors and power management.
The PF3000 product line was designed specifically to deliver fully integrated, OTP-configurable power solutions for NXP's i.MX 6 and i.MX 7 families-enabling simplified board design, reduced external component count, and deterministic power sequencing in resource-constrained embedded systems.
FAQ
What is the primary application processor compatibility for the MC32PF3000A3EP?
The MC32PF3000A3EP is pre-programmed in OTP memory for use with the NXP i.MX 6SX application processor paired with DDR3L memory. Its startup sequence, voltage settings, and VREFDDR derivation are specifically calibrated for this combination, ensuring correct core, memory, and I/O rail sequencing without runtime configuration.
Does the MC32PF3000A3EP support dynamic voltage scaling (DVS) for i.MX 6SX core rails?
Yes, the MC32PF3000A3EP supports real-time DVS for SW1A, SW1B, SW2, and SW3 buck regulators via its I²C interface. This allows the i.MX 6SX processor to dynamically adjust core and memory supply voltages during operation-reducing power consumption during low-load states while maintaining stability under varying computational loads.
How does the VREFDDR output function in the MC32PF3000A3EP?
The VREFDDR output in the MC32PF3000A3EP is generated as 0.5 × the SW3 output voltage, providing a tightly tracked reference for DDR3L memory termination. It delivers up to 10 mA with ±1% accuracy and is directly derived from SW3 to ensure voltage correlation-critical for signal integrity in high-speed DDR3L interfaces on i.MX 6SX platforms.
Can the MC32PF3000A3EP operate without an external coin cell?
Yes, the MC32PF3000A3EP can operate without an external coin cell when VIN is present, as VSNVS is powered from the main supply. However, the coin cell is required to maintain RTC and SNVS domain functionality during main power loss. The integrated charger automatically conditions and regulates charge current to the connected cell.
What is the significance of the "A3" suffix in MC32PF3000A3EP?
Within the PF3000 family, the "A3" suffix denotes the OTP programming option for i.MX 6SX with DDR3L memory. This configures the internal startup sequence, SW3 voltage range, VREFDDR derivation logic, and associated timing parameters-ensuring out-of-box compatibility with i.MX 6SX reference designs using DDR3L, without requiring field reprogramming.
MC32PF3000A3EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- i.MX Processors
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC32PF3000A3EP FAQ
1.How can I place an order for MC32PF3000A3EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF3000A3EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF3000A3EP reliable?
The price and inventory of MC32PF3000A3EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF3000A3EP is usually 5 days.
3.What payment methods are accepted for MC32PF3000A3EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF3000A3EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF3000A3EP?
MC32PF3000A3EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF3000A3EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF3000A3EP?
For technical support, including MC32PF3000A3EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF3000A3EP requirements.
6.How does Aetrix verify that MC32PF3000A3EP is sourced from the original manufacturer or authorized distributors?
All MC32PF3000A3EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF3000A3EP meets industry standards.
7.What is the process for return or replacement of MC32PF3000A3EP?
All MC32PF3000A3EP units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF3000A3EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF3000A3EP part is unused and in its original packaging.
Return procedure for MC32PF3000A3EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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