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NXP Semiconductors MC32PF3000A3EPR2
- Part No.:
- MC32PF3000A3EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC32PF3000A3EPR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:1,762
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Product details
Overview
MC32PF3000A3EPR2 from NXP Semiconductors is a pre-programmed power management IC (PMIC) optimized for i.MX 6SX application processors with DDR3L memory, delivering four buck regulators (SW1A/B up to 2.75 A combined), six LDOs, VREFDDR reference, RTC supply (VSNVS), and coin-cell charging. It operates from 2.8–4.5 V input and supports dynamic voltage scaling for ARM core and SOC rails in portable industrial edge devices.
For engineers reviewing the MC32PF3000A3EPR2 datasheet, MC32PF3000A3EPR2 pinout, MC32PF3000A3EPR2 application, or MC32PF3000A3EPR2 equivalent, this page provides verified regulator configurations, I²C-addressable OTP startup sequencing, SW1A/B independent/combined mode behavior, VCC_SD dual-voltage selection via SD_VSEL, and thermal-aware 48-QFN wettable flank package layout guidance.
Technical Context
The MC32PF3000A3EPR2 implements a SMARTMOS-based multi-rail architecture with configurable buck topology: SW1A (1.0 A) and SW1B (1.75 A) can operate independently or combine into a single 2.75 A phase-interleaved channel. Its OTP memory stores fixed startup sequence, voltage setpoints (e.g., SW2 at 1.50–1.85 V or 2.50–3.30 V), and PWRON edge/level detection configuration - eliminating external timing components.
It integrates dedicated analog blocks including VREFDDR (0.5×SW3 output, ±1% accuracy), VSNVS (3.0 V, 1 mA always-on), and coin-cell charger with LICELL pin control. All seven LDOs - VLDO1 (1.8–3.3 V, 100 mA), VLDO2 (0.80–1.55 V, 250 mA), VCC_SD (1.8/3.15 V, 100 mA), V33 (2.85–3.30 V, 350 mA), VLDO3/VLDO4 (1.8–3.3 V, 100/350 mA) - are powered from VIN or switched rails, enabling hierarchical power tree design for i.MX 6SX systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V (VIN rail); supports VPWR front-end LDO for 3.7–5.5 V inputs via external PFET |
| Buck Regulator Count | Four: SW1A (1.0 A), SW1B (1.75 A), SW2 (1.25 A), SW3 (1.5 A); SW1A/B configurable as independent or combined 2.75 A |
| LDO Count & Key Outputs | Six LDOs: V33 (350 mA), VCC_SD (100 mA, dual-voltage via SD_VSEL), VLDO2 (250 mA, 0.8–1.55 V), VLDO4 (350 mA) |
| VREFDDR Accuracy | 0.5 × SW3 output, ±1% tolerance, 10 mA drive - directly supports DDR3L memory reference compliance |
| OTP Configuration | Pre-programmed for i.MX 6SX + DDR3L (code A3); stores startup sequence, voltage setpoints, PWRON_CFG, I²C address (0x08 default) |
| Package | 48-pin QFN, 7.0 mm × 7.0 mm, wettable flank (98ASA00933D); EP pad tied to ground for thermal dissipation |
| I²C Interface | Standard-mode (100 kHz) and fast-mode (400 kHz); slave address programmable from 0x08 to 0x0F via OTP |
Pinout & Package
MC32PF3000A3EPR2 uses a 48-pin 7.0 mm × 7.0 mm QFN package with wettable flank (98ASA00933D) and exposed thermal pad (EP). The package supports automated optical inspection (AOI) and improves solder joint reliability in high-volume manufacturing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 INTB | Digital interrupt output | Open-drain fault indicator; asserts low on overcurrent, UVLO, or thermal shutdown - requires external pull-up |
| 2 SD_VSEL | Digital configuration input | Selects VCC_SD output: LOW = 2.85–3.30 V, HIGH = 1.80–1.85 V - enables SD card interface voltage flexibility |
| 3 RESETBMCU | Digital reset output | Open-drain processor reset signal; deasserts 2.0 ms after last regulator enables - configurable for fault-monitoring mode |
| 4 STANDBY | Digital mode control input | Active-high entry to Standby mode; polarity invertible via OTP_STANDBYINV - maintains VSNVS during low-power retention |
| 6–11 SW1AFB/SW1AIN/SW1ALX/SW1BLX/SW1BIN/SW1BFB | Analog switcher interface | Supports SW1A/B independent operation or combined 2.75 A mode; feedback pins require Kelvin routing for regulation stability |
| 35 SWBSTLX | Analog boost node | Connects to boost inductor and Schottky diode anode; enables 5.0–5.15 V, 600 mA OTG supply with PFM/Auto mode |
| 36 LICELL | Analog battery interface | Bi-directional coin-cell connection; charges backup battery and supplies VSNVS when main input fails - bypassed with 0.1 μF |
| 45 SDA / 46 SCL | I²C bidirectional interface | Open-drain data/clock lines; require 4.7 kΩ pull-ups to VDDIO (1.7–3.6 V) - enable runtime reconfiguration of non-OTP registers |
| 48 PWRON | Digital power control input | Configurable edge- or level-sensitive wake-up trigger; debounced (31.25–750 ms) to reject mechanical switch bounce |
| EP | Thermal ground | Exposed pad functions as primary ground return for buck/boost regulators - must connect to inner/outer GND planes via multiple vias |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured power tree | Eliminates external resistors/timers; stores i.MX 6SX + DDR3L startup sequence, voltage setpoints, and PWRON behavior |
| SW1A/B dual-mode buck | Enables flexible core rail design: independent 1.0 A + 1.75 A outputs or combined 2.75 A for higher current ARM cores |
| VCC_SD dual-voltage LDO | Hardware-selectable 1.8 V (eMMC/SDIO) or 3.15 V (legacy SD) output - simplifies host controller compatibility without firmware change |
| VREFDDR tracking reference | Derives DDR3L reference from SW3 output (0.5×), ensuring tight tracking and eliminating discrete resistor divider error |
| Integrated coin-cell charger | Provides seamless RTC backup: charges Li/MnO₂ cell via LICELL pin and maintains VSNVS during main power loss |
| Wettable flank QFN package | Enables AOI-capable solder joint inspection and improves thermal performance over standard QFN - critical for industrial ambient temps |
Applications
| Industrial HMI Panel | Secure POS Terminal |
|---|---|
Use Scenario: Fanless 7-inch display panel with i.MX 6SX, DDR3L, capacitive touch, and isolated CAN bus. IC Role / Device Role / Timing Role: MC32PF3000A3EPR2 supplies VDD_ARM (1.1 V), VDD_SOC (1.0 V), VCC_SD (3.15 V), V33 (3.3 V), and VREFDDR (0.55 V) with synchronized startup. Use Value: Pre-programmed A3 OTP eliminates boot-time configuration overhead and ensures deterministic power-up timing for real-time UI responsiveness. |
Use Scenario: PCI-compliant payment terminal with EMV chip reader, thermal printer, and encrypted secure element. IC Role / Device Role / Timing Role: MC32PF3000A3EPR2 powers i.MX 6SX core, LPDDR2 interface, crypto co-processor (VLDO2 @ 1.2 V), and secure storage (VCC_SD @ 1.8 V). Use Value: Dual-voltage VCC_SD and hardware-controlled STANDBY/RESETBMCU enable rapid wake-from-sleep and tamper-resilient power cycling. |
| Medical Data Logger | Smart Building Gateway |
Use Scenario: Battery-backed wearable ECG monitor with i.MX 6SX, flash storage, BLE radio, and analog front-end. IC Role / Device Role / Timing Role: MC32PF3000A3EPR2 delivers ultra-low-quiescent SW3 (0.9–1.65 V) for sensor ADC, VLDO2 (0.8–1.55 V) for BLE SoC, and VSNVS (3.0 V) for RTC during deep sleep. Use Value: Coin-cell charging via LICELL extends offline logging duration; VSNVS retention ensures accurate timestamping across power cycles. |
Use Scenario: DIN-rail mounted gateway aggregating Zigbee, Z-Wave, and Ethernet traffic using i.MX 6SX and DDR3L. IC Role / Device Role / Timing Role: MC32PF3000A3EPR2 generates VDD_LPSR (1.0 V), NVCC_GPIOx (3.3 V), and VREFDDR (0.675 V) while managing thermal load via EP pad conduction. Use Value: Wettable flank QFN and robust thermal GND path support continuous operation at 70 °C ambient - validated for industrial enclosure deployment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF3000A3ES | Automotive-grade (-40 °C to 105 °C), same OTP A3 programming and pinout | Qualified per AEC-Q100 Grade 2; required for automotive infotainment or ADAS edge nodes | Select MC33PF3000A3ES only when extended temperature range and automotive qualification are mandatory |
| MC34PF3000A3ES | Industrial-grade (-40 °C to 105 °C), identical electrical specs and OTP A3 configuration | Designed for factory automation controllers where extended thermal margin and long-term availability are prioritized | Choose MC34PF3000A3ES for industrial environments exceeding 85 °C ambient or requiring 15-year lifecycle support |
Compared with MC32PF3000A3EPR2, MC33PF3000A3ES adds AEC-Q100 qualification for automotive use, while MC34PF3000A3ES offers broader industrial temperature range and longer product longevity - both retain identical i.MX 6SX + DDR3L power tree configuration and pin-compatible layout.
Availability
MC32PF3000A3EPR2 is available at Aetrix Electronics and suitable for industrial HMI panels, secure POS terminals, medical data loggers, and smart building gateways requiring stable component supply, guaranteed tape-and-reel packaging (R2 suffix), and full traceability.
Supply support for MC32PF3000A3EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and integrated power management.
The PF3000 product line was designed specifically to simplify power architecture for NXP's i.MX 6 and i.MX 7 families - integrating OTP-configurable multi-rail generation, DDR reference, and battery backup into a single compact package.
FAQ
What is the OTP programming code embedded in MC32PF3000A3EPR2?
The MC32PF3000A3EPR2 contains OTP programming code A3, which configures the device for i.MX 6SX processors with DDR3L memory. This includes fixed startup sequence order, voltage setpoints for all regulators (e.g., SW2 at 1.50–1.85 V), PWRON edge-detection mode, and default I²C address 0x08. The OTP content is factory-programmed and cannot be modified in the field.
Does MC32PF3000A3EPR2 support both independent and combined operation of SW1A and SW1B buck regulators?
Yes, MC32PF3000A3EPR2 supports both modes via OTP configuration. In independent mode, SW1A delivers 1.0 A and SW1B delivers 1.75 A at separate output voltages. In combined mode, they operate as a single 2.75 A buck regulator with interleaved switching - reducing output ripple and improving thermal distribution. Pin SW1ALX and SW1BLX must be shorted externally in combined mode.
How does the VCC_SD regulator on MC32PF3000A3EPR2 adapt to different SD card interface requirements?
The VCC_SD regulator on MC32PF3000A3EPR2 provides hardware-selectable output: SD_VSEL = LOW sets 2.85–3.30 V for legacy SD cards, while SD_VSEL = HIGH selects 1.80–1.85 V for UHS-I/eMMC interfaces. This dual-voltage capability eliminates need for external level shifters and allows single-hardware design to support multiple memory types without firmware changes.
What is the role of the LICELL pin on MC32PF3000A3EPR2, and how is it used in battery backup systems?
The LICELL pin on MC32PF3000A3EPR2 serves as bidirectional coin-cell interface: it charges a backup battery (e.g., CR2032) when main power is present and supplies VSNVS (3.0 V, 1 mA) during main power loss. A 0.1 μF capacitor is required between LICELL and GND. This ensures continuous RTC operation and secure state retention in medical loggers or industrial controllers during brownouts.
Can MC32PF3000A3EPR2 operate with input voltages above 4.5 V, and if so, how is overvoltage protection implemented?
Yes, MC32PF3000A3EPR2 supports 3.7–5.5 V input via the VPWR pin using an external P-MOSFET as a front-end LDO. VIN remains clamped at ≤4.5 V for internal regulators, preventing overstress. The LDOG pin drives the gate of the external PFET, and VPWR connects to system input. This architecture avoids derating internal switches while maintaining compatibility with common 5 V supply rails.
MC32PF3000A3EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- i.MX Processors
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC32PF3000A3EPR2 FAQ
1.How can I place an order for MC32PF3000A3EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF3000A3EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF3000A3EPR2 reliable?
The price and inventory of MC32PF3000A3EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF3000A3EPR2 is usually 5 days.
3.What payment methods are accepted for MC32PF3000A3EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF3000A3EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF3000A3EPR2?
MC32PF3000A3EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF3000A3EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF3000A3EPR2?
For technical support, including MC32PF3000A3EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF3000A3EPR2 requirements.
6.How does Aetrix verify that MC32PF3000A3EPR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF3000A3EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF3000A3EPR2 meets industry standards.
7.What is the process for return or replacement of MC32PF3000A3EPR2?
All MC32PF3000A3EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF3000A3EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF3000A3EPR2 part is unused and in its original packaging.
Return procedure for MC32PF3000A3EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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