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NXP Semiconductors MC32PF3000A4EP
- Part No.:
- MC32PF3000A4EP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC32PF3000A4EP.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:1,962
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Product details
Overview
MC32PF3000A4EP from NXP Semiconductors is a pre-programmed power management IC (PMIC) optimized for i.MX 6SX application processors with DDR3 memory, delivering four buck regulators (SW1A/B up to 2.75 A combined, SW2 at 1.25 A, SW3 at 1.5 A), six LDOs including VCC_SD and V33, RTC supply (VSNVS at 3.0 V), and DDR reference (VREFDDR). It supports dynamic voltage scaling, I²C programmability, and OTP-configured startup sequencing for embedded compute systems.
For engineers reviewing the MC32PF3000A4EP datasheet, MC32PF3000A4EP pinout, MC32PF3000A4EP application, or MC32PF3000A4EP equivalent, this page delivers verified regulator output ranges, confirmed 48-pin QFN package mapping, validated I²C address configuration options, and real-world use cases in industrial HMI and secure edge gateways requiring stable multi-rail power with coin-cell backup.
Technical Context
The MC32PF3000A4EP implements a SMARTMOS-based architecture with configurable buck topology: SW1A and SW1B can operate independently (1.0 A / 1.75 A) or in parallel (2.75 A), while SW2 and SW3 support programmable output voltages across critical processor domains (e.g., VDD_SOC, VDD_ARM). Its OTP memory stores startup sequence timing, voltage setpoints, and PWRON/RESETBMCU behavior-eliminating external configuration components.
Control logic integrates direct hardware interfaces (PWRON, STANDBY, SD_VSEL, INTB, RESETBMCU) alongside I²C for runtime reconfiguration. The device supports three operational states-On, Standby, and Sleep/LPSR-with VSNVS maintaining RTC functionality during low-power modes, and VPWR input enabling operation up to 5.5 V via external PFET when VIN exceeds 4.5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8–4.5 V (VIN) or 3.7–5.5 V (VPWR with external PFET); enables flexible system-level power path design |
| SW1A/B Combined Output | 0.7–1.425 V / 0.7–1.475 V, 2.75 A max; powers i.MX 6SX core domain with DVS support |
| SW2 Output | 1.50–1.85 V or 2.50–3.30 V, 1.25 A; supplies SOC logic and DDR I/O rails |
| VCC_SD Output | 1.80–1.85 V or 2.85–3.30 V, 100 mA; dual-voltage SD card interface compliance |
| VREFDDR Output | 0.5 × SW3_OUT, 10 mA; precision DDR3 reference tracking internal core voltage |
| VSNVS Output | 3.0 V, 1.0 mA; always-on supply for i.MX SNVS/SRTC domain with coin-cell backup |
| I²C Address Range | 0x08–0x0F (OTP-programmable); avoids bus conflicts in multi-PMIC designs |
Pinout & Package
MC32PF3000A4EP uses a 48-pin QFN package (98ASA00933D), 7.0 mm × 7.0 mm, wettable flank, with exposed thermal pad (EP) tied to ground plane for thermal dissipation. Pin functions are validated per NXP PF3000 Rev. 10.1 datasheet Section 7.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB (Pin 1) | Open-drain fault interrupt | Asserts low on overcurrent, UVLO, or thermal fault; requires external pull-up for host MCU notification |
| SD_VSEL (Pin 2) | Digital select for VCC_SD range | Logic high → 1.80–1.85 V; logic low → 2.85–3.30 V; enables SD card voltage mode switching |
| RESETBMCU (Pin 3) | Open-drain reset output | Deasserts 2.0 ms after last regulator enable in startup sequence; configurable for fault detection |
| STANDBY (Pin 4) | Mode control input | Active-high or active-low (OTP-configurable) entry into low-power standby state |
| PWRON (Pin 48) | Power-on trigger | Level- or edge-sensitive (OTP-selectable); debounced falling-edge detection supports mechanical switch integration |
| SCL/SDA (Pins 46/45) | I²C interface | Standard-mode (100 kHz) or fast-mode (400 kHz); VDDIO-referenced, 4.7 kΩ pull-ups required |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured startup sequence | 15-slot programmable timing (0.5 ms or 2.0 ms per slot); eliminates external RC timing networks |
| SW1A/SW1B configuration flexibility | Single 2.75 A rail or independent 1.0 A / 1.75 A outputs; adapts to i.MX 6SX core vs. peripheral partitioning |
| VREFDDR tracking | Output = 0.5 × SW3 output voltage; ensures DDR3 termination accuracy without external resistive dividers |
| VSNVS coin-cell charging | Integrated charger with battery backup path; maintains RTC across main power loss in industrial gateways |
| VPWR front-end LDO support | External PFET control via LDOG pin; extends input range to 5.5 V while protecting internal regulators |
Applications
| Industrial HMI Panels | Secure Edge Gateways |
|---|---|
Use Scenario: Ruggedized touch displays with i.MX 6SX SoC, operating in factory environments with intermittent 24 V DC input and battery backup. IC Role / Device Role / Timing Role: Primary PMIC supplying VDD_CORE (SW1A/B), VDD_SOC (SW2), DDR3L I/O (VCC_SD), and SNVS domain (VSNVS). Use Value: OTP-programmed startup ensures deterministic power-up of display controller and crypto engine before OS boot; VREFDDR tracking guarantees DDR3 signal integrity at temperature extremes. |
Use Scenario: Network-attached IoT gateway with cellular/Wi-Fi connectivity, running Linux on i.MX 6SX and requiring tamper-resistant RTC and secure boot power sequencing. IC Role / Device Role / Timing Role: Central power hub managing core, memory, peripherals (USB OTG via SWBST), and security co-processor rails. Use Value: RESETBMCU fault-mode assertion halts boot on undervoltage or overcurrent, preventing corrupted firmware load; coin-cell-backed VSNVS preserves secure time across brownouts. |
| POS Terminal Controllers | Medical Data Loggers |
Use Scenario: Battery-powered retail terminals using i.MX 6SX with EMV contactless readers, requiring rapid wake-from-sleep and low quiescent current. IC Role / Device Role / Timing Role: Power manager enabling STANDBY-triggered low-power retention mode with VSNVS + SW3 active, while disabling non-essential LDOs. Use Value: Programmable soft-start ramp rate (25 mV/2 μs or 4 μs) prevents inrush-induced voltage droop during wake-up; SD_VSEL toggling supports dual-voltage SDIO for payment card readers. |
Use Scenario: Portable patient monitors logging ECG/SpO₂ data to microSD, powered by Li-ion with 8-hour runtime and 72-hour RTC holdover. IC Role / Device Role / Timing Role: Multi-rail source for analog front-end (VLDO2 at 1.2 V), microSD interface (VCC_SD), and flash memory (V33), with VSNVS sustaining RTC. Use Value: VLDO2's 0.8–1.55 V range enables precise biasing of low-noise amplifiers; VREFDDR tracking ensures accurate DDR3 data capture timing during burst writes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF3000A4ES | Automotive-grade (-40 °C to 105 °C), same OTP config (i.MX 6SX + DDR3), identical pinout | Qualified for automotive infotainment head units; includes extended temp validation and AEC-Q100 stress testing | Select for automotive deployments where ambient temperature exceeds 85 °C or functional safety compliance is required. |
| MC34PF3000A4EP | Industrial-grade (-40 °C to 105 °C), same OTP config and electrical specs, identical 48-QFN package | Targeted for industrial automation controllers; features enhanced ESD robustness (±4 kV HBM) and longer production lifecycle commitment | Choose for factory-floor equipment needing extended availability and higher ESD immunity than consumer-grade MC32 series. |
Compared with MC32PF3000A4EP, MC33PF3000A4ES adds automotive qualification and thermal margin, while MC34PF3000A4EP provides industrial reliability and ESD hardening-both retain identical power tree configuration and I²C register compatibility, enabling drop-in replacement in thermally demanding environments without layout changes.
Availability
MC32PF3000A4EP is available at Aetrix Electronics and suitable for industrial HMI panels, secure edge gateways, POS terminal controllers, and medical data loggers requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for MC32PF3000A4EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in ARM-based application processors and power management.
The PF3000 product line was designed specifically to deliver integrated, OTP-configurable power solutions for NXP's i.MX 6 and i.MX 7 families-enabling simplified board design, reduced BOM count, and deterministic power sequencing in resource-constrained embedded systems.
FAQ
What is the OTP programming configuration of MC32PF3000A4EP?
The MC32PF3000A4EP is factory-programmed with OTP option "4", which configures it for i.MX 6SX processors with DDR3 memory. This includes pre-set startup sequence timing, SW1A/B parallel mode, VREFDDR tracking enabled, and default I²C address 0x08. No field reprogramming of OTP is supported; runtime adjustments use I²C-accessible registers.
Does MC32PF3000A4EP support input voltages above 4.5 V?
Yes-MC32PF3000A4EP supports up to 5.5 V input via the VPWR pin when used with an external PFET controlled by the LDOG pin. The internal regulators remain protected at ≤4.5 V. When VIN ≤4.5 V, the device operates directly from VIN without external components. This dual-input architecture accommodates both USB-powered and industrial 5 V supply designs.
How does the VREFDDR output relate to SW3 on MC32PF3000A4EP?
On MC32PF3000A4EP, VREFDDR is internally generated as exactly 0.5 × the SW3 output voltage, eliminating need for external resistor dividers. This tracking ensures DDR3 termination voltage remains precisely half the core memory supply-critical for signal integrity in high-speed DDR3 interfaces. VREFDDR delivers up to 10 mA and requires only a 1.0 μF capacitor to ground.
Can MC32PF3000A4EP be used with i.MX 7 processors?
No-MC32PF3000A4EP is specifically programmed for i.MX 6SX with DDR3 and is not compatible with i.MX 7. For i.MX 7, NXP specifies MC32PF3000A1EP (DDR3L) or MC32PF3000A2EP (LPDDR3). Using MC32PF3000A4EP with i.MX 7 may result in incorrect core voltage, failed DDR initialization, or unstable RTC due to mismatched OTP startup parameters.
What is the function of the SD_VSEL pin on MC32PF3000A4EP?
The SD_VSEL pin on MC32PF3000A4EP selects between two VCC_SD output ranges: logic high sets 1.80–1.85 V for high-speed SD card operation, while logic low sets 2.85–3.30 V for standard SDIO peripherals. The pin is powered by VDDIO, and defaults to high if VDDIO is absent-ensuring safe low-voltage mode during power-up sequencing.
MC32PF3000A4EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- i.MX Processors
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC32PF3000A4EP FAQ
1.How can I place an order for MC32PF3000A4EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF3000A4EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF3000A4EP reliable?
The price and inventory of MC32PF3000A4EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF3000A4EP is usually 5 days.
3.What payment methods are accepted for MC32PF3000A4EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF3000A4EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF3000A4EP?
MC32PF3000A4EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF3000A4EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF3000A4EP?
For technical support, including MC32PF3000A4EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF3000A4EP requirements.
6.How does Aetrix verify that MC32PF3000A4EP is sourced from the original manufacturer or authorized distributors?
All MC32PF3000A4EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF3000A4EP meets industry standards.
7.What is the process for return or replacement of MC32PF3000A4EP?
All MC32PF3000A4EP units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF3000A4EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF3000A4EP part is unused and in its original packaging.
Return procedure for MC32PF3000A4EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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