NXP Semiconductors MC32PF3000A8EPR2
- Part No.:
- MC32PF3000A8EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC32PF3000A8EPR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MC32PF3000A8EPR2 from NXP Semiconductors is a power management IC (PMIC) engineered for i.MX 6UL application processors with DDR3 memory, delivering four buck regulators (SW1A: 1.0 A, SW1B: 1.75 A, SW2: 1.25 A, SW3: 1.5 A), six LDOs including V33 (350 mA) and VCC_SD (100 mA), RTC supply (VSNVS, 3.0 V), DDR reference (VREFDDR, 0.5×SW3_OUT), and coin-cell charging - enabling full-system power for industrial embedded designs.
For engineers reviewing the MC32PF3000A8EPR2 datasheet, MC32PF3000A8EPR2 pinout, MC32PF3000A8EPR2 application, or MC32PF3000A8EPR2 equivalent, key selection criteria include its -40 °C to 85 °C industrial temperature rating, OTP-programmable startup sequence, I²C-configurable voltage rails, and support for dynamic voltage scaling on core buck regulators in consumer- and industrial-grade i.MX 6UL platforms.
Technical Context
The MC32PF3000A8EPR2 implements a multi-rail architecture with configurable SW1A/SW1B pairing (independent or combined 2.75 A), programmable PWM/PPM/APS switching modes, and integrated OTP memory storing startup timing, voltage setpoints, and I²C address (0x08–0x0F). Its control logic supports direct hardware sequencing via PWRON, STANDBY, and RESETBMCU signals alongside I²C register-level real-time adjustment.
It features dedicated analog blocks: VREFDDR generation referenced to SW3 output, VSNVS as either 3.0 V LDO or bypass switch for SNVS domain, and VPWR front-end LDO support using external P-MOSFET for >4.5 V input systems. All regulators include soft-start, current limiting, and feedback-based regulation with separate ground references (GNDREF1/GNDREF2/GNDREF) for noise isolation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V–4.5 V (VIN) or 3.7 V–5.5 V (VPWR with external FET); enables flexible system-level power path design |
| SW1A Output | 0.70–1.425 V / 1.8 V / 3.3 V, 1.0 A; supplies i.MX 6UL core or I/O domains with DVS support |
| SW2 Output | 1.50–1.85 V or 2.50–3.30 V, 1.25 A; powers SOC logic (VDD_SOC) or DDR I/O (NVCC_DRAM_CKE) |
| V33 Output | 2.85–3.30 V, 350 mA; delivers stable 3.3 V rail for GPIO, USB PHY, and peripherals |
| VREFDDR Output | 0.5 × SW3_OUT (0.45–0.825 V), 10 mA; provides precision DDR memory reference voltage |
| VSNVS Output | 3.0 V, 1.0 mA; powers i.MX SNVS/SRTC domain with coin-cell backup capability |
| I²C Address | Programmable 0x08–0x0F via OTP; avoids bus conflicts in multi-device systems |
| Startup Sequence | OTP-programmable per-regulator slot (1–15) with 0.5 ms or 2.0 ms step resolution; ensures deterministic power-up timing |
Pinout & Package
MC32PF3000A8EPR2 uses a 48-pin QFN package (98ASA00933D), 7.0 mm × 7.0 mm, wettable flank, with exposed thermal pad (EP) tied to ground for enhanced thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 INTB | Open-drain interrupt output | Asserts low on fault (OCP, UVLO, thermal); requires external pull-up for processor alert signaling |
| 2 SD_VSEL | Digital input | Selects VCC_SD output: HIGH = 1.80–1.85 V (SD card), LOW = 2.85–3.30 V (general I/O) |
| 3 RESETBMCU | Open-drain reset output | Deasserts 2.0 ms after last regulator enables; configurable for fault-monitoring mode |
| 4 STANDBY | Digital input | Active-high or active-low entry into Standby mode; requires coin cell if VIN ≤ 2.85 V |
| 6–11 SW1AFB, SW1AIN, SW1ALX, SW1BLX, SW1BIN, SW1BFB | Analog feedback/input/switch nodes | Support independent (SW1A + SW1B) or combined (2.75 A) buck operation; routing critical for regulation stability |
| 12 GNDREF1 | Ground reference | Isolated return for SW1A/B; must be separated from high-current paths to avoid noise coupling |
| 35 SWBSTLX | Boost switch node | Connects to inductor and Schottky diode anode; enables 5.0–5.15 V OTG supply at 600 mA |
| 36 LICELL | Coin-cell interface | Charges/backs up VSNVS; bypassed with 0.1 μF capacitor; supports battery-backed RTC operation |
| 45 SDA / 46 SCL | I²C bidirectional data/clock | Open-drain lines pulled to VDDIO (1.7–3.6 V); enable full OTP and runtime register configuration |
| 48 PWRON | Power-on trigger | Configurable as level- or edge-sensitive; debounced (31.25–750 ms) for mechanical switch interfacing |
| EP | Exposed thermal pad | Must be connected to internal/external ground planes via multiple vias for thermal and EMI performance |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmable power tree | Stores startup sequence, voltage setpoints, I²C address, and PWRON/RESETBMCU behavior - eliminates external configuration components |
| Configurable SW1A/SW1B topology | Software-selectable independent (1.0 A + 1.75 A) or paralleled (2.75 A) operation - adapts to core voltage/current requirements of i.MX 6UL |
| VREFDDR generation | Derives DDR reference directly from SW3 output (0.5×), ensuring tight tracking and eliminating external resistor divider |
| VSNVS dual-mode operation | Functions as 3.0 V LDO or bypass switch - maintains SNVS domain integrity during main power loss using coin-cell backup |
| Industrial temperature range | -40 °C to +85 °C operating range - qualified for extended-life industrial embedded applications without derating |
| VPWR front-end LDO support | Enables use with 4.5–5.5 V inputs via external P-MOSFET - extends system input voltage flexibility while protecting internal regulators |
Applications
| Industrial HMI Panels | i.MX 6UL-Based Edge Gateways |
|---|---|
|
Use Scenario: Fanless, sealed enclosure with wide ambient temperature swings and long operational lifetime. IC Role / Device Role: Primary PMIC supplying i.MX 6UL CPU cores (SW1A/SW1B), DDR3 memory (VREFDDR + SW2), and 3.3 V I/O (V33). Use Value: OTP-programmed startup sequence ensures deterministic boot; VSNVS coin-cell backup preserves RTC across power cycles. |
Use Scenario: Remote, battery-assisted IoT gateway requiring low quiescent current and reliable wake-from-sleep behavior. IC Role / Device Role: Manages power states (Standby/Sleep/Off) via STANDBY/PWRON, regulates LPDDR2 (SW3), and powers wireless modules (VLDO2, VLDO4). Use Value: Programmable PWRON debounce prevents false wake-ups; SW2's dual-voltage range supports both DDR3L and legacy DDR3 interfaces. |
| POS Terminals with Secure Boot | Medical Data Loggers |
|
Use Scenario: Tamper-resistant retail terminal with secure boot chain and audit logging. IC Role / Device Role: Supplies i.MX 6UL security subsystem (SW1A), crypto engine I/O (VCC_SD), and display backlight (SWBST 5.1 V). Use Value: SD_VSEL dynamically selects VCC_SD voltage for SD card vs. eMMC; SWBST enables USB OTG host functionality for firmware updates. |
Use Scenario: Portable, battery-powered device recording physiological signals with strict EMC and reliability requirements. IC Role / Device Role: Powers ultra-low-noise analog front-end (VLDO2: 0.8–1.55 V), microcontroller core (SW1A), and SD card (VCC_SD). Use Value: GNDREF1/GNDREF2 separation minimizes switching noise coupling into analog rails; VREFDDR accuracy ensures stable DDR3L operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF3000A7ES | Automotive-grade (-40 °C to 105 °C), same 48-QFN package and OTP programming model | Qualified for AEC-Q100 Grade 2; includes enhanced watchdog and fault reporting for safety-critical systems | Select when automotive qualification, extended temperature, or ASIL-B support is required - not drop-in due to different OTP configuration and thermal specs |
| MC34PF3000A8ES | Industrial-grade (-40 °C to 105 °C), identical feature set and pinout, but higher max junction temperature rating | Supports more thermally demanding enclosures; shares same i.MX 6UL DDR3 programming option (A8) | Choose for industrial deployments above 85 °C ambient - requires validation of thermal margin and OTP reprogramming for target board |
Compared with MC32PF3000A8EPR2, MC33PF3000A7ES adds automotive qualification and fault diagnostics at the cost of higher BOM complexity, while MC34PF3000A8ES extends thermal capability without altering functional behavior - both require OTP reconfiguration and thermal layout review for replacement.
Availability
MC32PF3000A8EPR2 is available at Aetrix Electronics and suitable for industrial HMI panels, i.MX 6UL-based edge gateways, and POS terminals requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for MC32PF3000A8EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and associated power management.
The PF3000 product line was designed specifically to deliver tightly integrated, OTP-configurable power solutions for NXP's i.MX 6 and i.MX 7 families - reducing external component count while enabling robust, application-specific power sequencing and voltage scaling.
FAQ
What is the operating temperature range for MC32PF3000A8EPR2?
MC32PF3000A8EPR2 is rated for -40 °C to +85 °C operation, qualifying it for industrial applications where extended ambient temperature stability is required. This range is defined in Table 1 of the PF3000 datasheet and applies specifically to the MC32 prefix variant. The device uses SMARTMOS technology to maintain regulation accuracy and startup reliability across this full span without derating.
How does MC32PF3000A8EPR2 support i.MX 6UL with DDR3 memory?
MC32PF3000A8EPR2 supports i.MX 6UL with DDR3 via its A8 OTP programming option, which configures SW2 for 2.50–3.30 V output (for DDR3 I/O), SW3 for 0.90–1.65 V (core), and VREFDDR to track 0.5×SW3_OUT. The part's pinout and startup sequence are optimized for this configuration, matching the power tree in Figure 4 of the datasheet.
Can MC32PF3000A8EPR2 be used with input voltages above 4.5 V?
Yes - MC32PF3000A8EPR2 supports 3.7–5.5 V input via the VPWR pin when paired with an external P-MOSFET configured as a front-end LDO. The internal regulators remain protected at ≤4.5 V. This configuration requires connecting VPWR to the FET drain and VIN to the regulated output, as specified in Section 8.2 of the datasheet.
What is the role of the SD_VSEL pin on MC32PF3000A8EPR2?
The SD_VSEL pin on MC32PF3000A8EPR2 selects the output voltage range of the VCC_SD LDO: logic HIGH sets 1.80–1.85 V for high-speed SD cards, while logic LOW sets 2.85–3.30 V for general-purpose I/O. Its input buffer is powered by VDDIO, and defaults to HIGH if VDDIO is absent - ensuring safe default behavior during power-up.
Does MC32PF3000A8EPR2 include battery backup capability?
Yes - MC32PF3000A8EPR2 integrates a coin-cell charger and VSNVS regulator/switch that delivers 3.0 V at 1.0 mA. When a coin cell is connected to LICELL, it powers the SNVS domain during main power loss, preserving RTC time and secure non-volatile state - critical for industrial logging and secure boot applications.
MC32PF3000A8EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- i.MX Processors
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC32PF3000A8EPR2 FAQ
1.How can I place an order for MC32PF3000A8EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF3000A8EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF3000A8EPR2 reliable?
The price and inventory of MC32PF3000A8EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF3000A8EPR2 is usually 5 days.
3.What payment methods are accepted for MC32PF3000A8EPR2?
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4.How is shipping managed for MC32PF3000A8EPR2?
MC32PF3000A8EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF3000A8EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF3000A8EPR2?
For technical support, including MC32PF3000A8EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF3000A8EPR2 requirements.
6.How does Aetrix verify that MC32PF3000A8EPR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF3000A8EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF3000A8EPR2 meets industry standards.
7.What is the process for return or replacement of MC32PF3000A8EPR2?
All MC32PF3000A8EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF3000A8EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF3000A8EPR2 part is unused and in its original packaging.
Return procedure for MC32PF3000A8EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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