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NXP Semiconductors MC32PF3001A1EPR2
- Part No.:
- MC32PF3001A1EPR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC32PF3001A1EPR2.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:2,800
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Product details
Overview
MC32PF3001A1EPR2 from NXP Semiconductors is a fixed-configuration Power Management IC (PMIC) optimized for i.MX 7 processors with DDR3L memory, delivering three buck regulators (SW1: 2.75 A, SW2: 1.25 A, SW3: 1.5 A) and seven LDOs-including VCC_SD (100 mA, dual 1.8 V/3.3 V), V33 (350 mA), and VSNVS (1.0 mA RTC supply)-in a 48-pin QFN 7.0 mm × 7.0 mm wettable flank package. It enables full power sequencing for multimedia application processors in space-constrained embedded systems.
For engineers reviewing the MC32PF3001A1EPR2 datasheet, MC32PF3001A1EPR2 pinout, MC32PF3001A1EPR2 application, or MC32PF3001A1EPR2 equivalent, this page provides verified regulator output voltages, OTP-programmed startup sequence (SW1_SEQ=1, SW2_SEQ=2, SW3_SEQ=5), I²C address (0x08), thermal management details, and validated alternative PMICs for i.MX 6/7 system designs.
Technical Context
The MC32PF3001A1EPR2 implements a fixed OTP-based power tree with pre-configured voltage rails and sequencing: SW1 delivers 1.10 V core voltage (A1 configuration), SW2 supplies 1.8 V for ARM cores and I/O, and SW3 outputs 1.35 V for DDR3L termination. All three buck regulators operate at 2.0 MHz PWM frequency with APS/PWM/PFM mode support and dynamic voltage scaling capability.
It integrates dedicated logic interfaces-PWRON (level-sensitive turn-on), RESETBMCU (2.0 ms post-startup deassertion), INTB (open-drain fault interrupt), and SD_VSEL (dual-range VCC_SD selection)-alongside a trimmed 16 MHz oscillator for timing-critical regulation and a 32 kHz clock for low-power states. The VSNVS rail supports battery-backed RTC operation with integrated coin cell charging.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V–4.5 V (VIN) or 3.7 V–5.5 V (VPWR with external PFET); determines system-level input compatibility and front-end LDO usage |
| SW1 Output | 1.10 V @ 2.75 A (OTP A1 config); powers i.MX 7 application processor core with dynamic voltage scaling support |
| VCC_SD Output | 1.85 V / 3.3 V selectable via SD_VSEL; meets dual-voltage SD card interface requirements per JEDEC spec |
| V33 Output | 3.3 V @ 350 mA; supplies USB OTG PHY, GPIOs, and peripheral I/O rails with low-noise LDO regulation |
| VSNVS Output | 3.0 V @ 1.0 mA; provides always-on RTC and secure non-volatile storage power with coin cell backup capability |
| I²C Address | 0x08 (default OTP); enables host MCU communication for runtime voltage adjustment and fault monitoring |
| Startup Sequence | Fixed OTP: SW1→SW2→V33→VLDO4→VCC_SD (SEQ_CLK_SPEED = 2000 µs); ensures safe i.MX 7 power-up timing compliance |
Pinout & Package
MC32PF3001A1EPR2 uses a 48-pin QFN 7.0 mm × 7.0 mm wettable flank (WF-type) package (98ASA00933D) with exposed thermal pad (EP) tied to GND for enhanced thermal dissipation. Pin functions are defined per NXP PF3001 Rev. 5.1 datasheet Section 7.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB (Pin 1) | Open-drain interrupt output | Asserts low on overvoltage, thermal fault, or undervoltage; requires external pull-up for MCU notification |
| SD_VSEL (Pin 2) | Digital input control | Selects VCC_SD output range: HIGH → 1.80–1.85 V; LOW → 2.85–3.30 V for SDIO interface compatibility |
| RESETBMCU (Pin 3) | Open-drain reset output | Deasserts 2.0 ms after final regulator enable; synchronizes i.MX 7 exit from POR without real-time rail monitoring |
| SW1LX (Pins 8 & 9) | Buck switch node | Connects directly to SW1 inductor; requires tight layout to minimize EMI and switching losses |
| VIN (Pin 42) | Main supply input | Primary power source for all regulators when VPWR not used; bypassed with 1.0 μF capacitor to GND |
| VPWR (Pin 31) | Front-end LDO input | Enables >4.5 V input operation via external P-MOSFET; unused in standard 3.3 V/3.7 V battery systems |
| LICELL (Pin 36) | Coin cell interface | Charges and backs up VSNVS rail; bypassed with 0.1 μF capacitor; supports optional CR2032 integration |
| EP (Exposed Pad) | Thermal & ground reference | Must be soldered to internal/external GND planes via multiple vias for thermal performance and noise reduction |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured power sequencing | Fixed startup order (SW1→SW2→V33→VLDO4→VCC_SD) eliminates external timing components and firmware dependency |
| Dual-range VCC_SD LDO | Hardware-selectable 1.8 V or 3.3 V output via SD_VSEL pin enables single-PCB support for legacy and high-speed SD cards |
| Integrated RTC power + coin cell charger | VSNVS rail delivers stable 3.0 V @ 1.0 mA with automatic Li-ion/Li-MnO₂ charging circuitry for tamper-resistant timekeeping |
| Multi-mode buck regulation | APS/PWM/PFM switching modes per regulator allow adaptive efficiency optimization across 1 mA–2.75 A load range |
| Trimmed 16 MHz oscillator | Factory-trimmed ±3% accuracy enables precise 2.0 MHz buck switching frequency and deterministic startup timing |
| Wettable flank QFN package | 48-pin 7×7 mm WF-type package supports automated optical inspection (AOI) and improves solder joint reliability in automotive/industrial reflow |
Applications
| Industrial HMI Panels | Medical Patient Monitors |
|---|---|
Use Scenario: Compact, fanless human-machine interface panels running Linux on i.MX 7 with DDR3L memory, requiring reliable multi-rail power under variable ambient temperatures. IC Role / Device Role / Timing Role: MC32PF3001A1EPR2 delivers sequenced core (1.10 V), I/O (1.8 V), and peripheral (3.3 V) rails while managing RTC backup and SD card interface voltage selection. Use Value: Eliminates discrete regulator count by 8+ devices; OTP-fixed sequencing reduces boot-time validation effort and firmware complexity. |
Use Scenario: Portable bedside monitors with continuous sensor data logging, battery backup, and regulatory-compliant low-power sleep modes. IC Role / Device Role / Timing Role: MC32PF3001A1EPR2 powers i.MX 7 SoC, ADC front-end, display driver, and USB charging circuit while maintaining VSNVS-powered RTC during main power loss. Use Value: Integrated coin cell charger and 1.0 mA VSNVS supply ensure >72-hour timekeeping during AC failure without external circuitry. |
| Smart Home Gateways | POS Terminals with Secure Boot |
Use Scenario: Always-on residential gateways aggregating Zigbee/Z-Wave/BLE traffic, requiring robust power delivery across temperature cycling and long-term reliability. IC Role / Device Role / Timing Role: MC32PF3001A1EPR2 supplies i.MX 7 application processor, Wi-Fi/Bluetooth co-processors, and secure element I/O rails with coordinated startup and fault reporting. Use Value: INTB interrupt and OTP-configured fault thresholds simplify safety-critical power monitoring without additional supervisor ICs. |
Use Scenario: PCI-compliant point-of-sale terminals using i.MX 7 with encrypted boot, requiring tamper-evident RTC and isolated power domains for secure peripherals. IC Role / Device Role / Timing Role: MC32PF3001A1EPR2 provides isolated VCC_SD (for secure SD card), V33 (for EMV contact interface), and VSNVS (for secure time-stamping) with hardware-enforced sequencing. Use Value: Dual-voltage VCC_SD and battery-backed VSNVS meet PCI PTS v6.0 requirements for secure time and storage integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF3001A6ES | Automotive-grade (-40 °C to 105 °C), same OTP A6 config (i.MX 6UL + LPDDR2), identical pinout and register map | Validated for automotive infotainment head units; includes extended temp qualification and AEC-Q100 stress testing | Select when operating ambient exceeds 85 °C or automotive qualification is required; no PCB changes needed |
| MC34PF3001A6ES | Industrial-grade (-40 °C to 105 °C), OTP A6 config (i.MX 6UL + LPDDR2), identical electrical specs but different startup timing trim | Targeted at industrial edge controllers with longer thermal cycles; shares same footprint but uses distinct SEQ_CLK_SPEED (2000 µs vs. 500 µs) | Choose for harsh industrial environments where extended temperature stability outweighs i.MX 7-specific tuning |
Compared with MC32PF3001A1EPR2, MC33PF3001A6ES adds automotive qualification at the cost of higher unit price, while MC34PF3001A6ES trades i.MX 7 DDR3L optimization for broader industrial thermal resilience-neither offers direct i.MX 7 DDR3L support, making MC32PF3001A1EPR2 the only drop-in solution for that specific processor/memory combination.
Availability
MC32PF3001A1EPR2 is available at Aetrix Electronics and suitable for industrial HMI panels, medical patient monitors, smart home gateways, and POS terminals requiring stable component supply across extended product lifecycles.
Supply support for MC32PF3001A1EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF3001 product line was designed specifically to deliver integrated, OTP-configured power solutions for NXP's i.MX 6 and i.MX 7 application processors-reducing BOM count, simplifying layout, and accelerating time-to-market for multimedia-embedded systems.
FAQ
What is the default I²C address of the MC32PF3001A1EPR2?
The MC32PF3001A1EPR2 has a factory-programmed default I²C address of 0x08, consistent across all PF3001 variants. This address is hard-coded in OTP memory and cannot be altered. Communication requires standard open-drain I²C signaling on SDA (Pin 45) and SCL (Pin 46), pulled up to VDDIO (Pin 47) at 4.7 kΩ. The MC32PF3001A1EPR2 responds only to this address unless modified via special programming tools not supported in field operation.
Does the MC32PF3001A1EPR2 support dynamic voltage scaling (DVS) for the core rail?
Yes, the MC32PF3001A1EPR2 supports dynamic voltage scaling on SW1-the 2.75 A buck regulator powering the i.MX 7 core. DVS is implemented via I²C writes to the SW1VOLT[4:0] register, enabling real-time adjustment between 0.7 V and 1.425 V in 25 mV steps. This feature is active in APS/PWM modes and allows the host processor to optimize power versus performance during runtime, as confirmed in Section 8.3.7 of the PF3001 datasheet Rev. 5.1.
How does the SD_VSEL pin affect VCC_SD output voltage on the MC32PF3001A1EPR2?
On the MC32PF3001A1EPR2, the SD_VSEL pin (Pin 2) directly selects the VCC_SD LDO output range: when pulled HIGH, VCC_SD delivers 1.80–1.85 V for high-speed SDIO interfaces; when pulled LOW, it delivers 2.85–3.30 V for legacy SD card compatibility. This selection is hardware-controlled and overrides OTP defaults-no I²C interaction is required. The buffer is powered by VDDIO, and absence of VDDIO forces SD_VSEL to default HIGH, ensuring safe low-voltage operation during power-up.
What is the purpose of the VPWR pin on the MC32PF3001A1EPR2, and when should it be used?
The VPWR pin (Pin 31) on the MC32PF3001A1EPR2 enables operation with input voltages up to 5.5 V by activating an external P-MOSFET-based front-end LDO. It must be connected to the main supply (e.g., 5 V rail) and used with LDOG (Pin 30) to drive the gate of the external FET. For standard 3.3 V or 3.7 V battery inputs ≤4.5 V, VPWR is grounded and VIN (Pin 42) serves as the primary input-using VPWR unnecessarily adds complexity and conduction loss.
Can the MC32PF3001A1EPR2 power both i.MX 7 and i.MX 6 processors?
Yes, the MC32PF3001A1EPR2 is explicitly qualified for i.MX 7 processors with DDR3L memory (OTP A1 config), but its architecture also supports i.MX 6 SoloLite, SoloX, and UltraLite families-as stated in Section 1 of the PF3001 datasheet. However, optimal performance requires matching the OTP variant to the target processor: MC32PF3001A1EPR2's fixed SW1_VOLT=1.10 V and SW3_VOLT=1.35 V are tuned for i.MX 7 DDR3L, whereas i.MX 6UL designs typically require A6/A7 variants with different core and DDR voltages.
MC32PF3001A1EPR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC32PF3001A1EPR2 FAQ
1.How can I place an order for MC32PF3001A1EPR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF3001A1EPR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF3001A1EPR2 reliable?
The price and inventory of MC32PF3001A1EPR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF3001A1EPR2 is usually 5 days.
3.What payment methods are accepted for MC32PF3001A1EPR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF3001A1EPR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF3001A1EPR2?
MC32PF3001A1EPR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF3001A1EPR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF3001A1EPR2?
For technical support, including MC32PF3001A1EPR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF3001A1EPR2 requirements.
6.How does Aetrix verify that MC32PF3001A1EPR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF3001A1EPR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF3001A1EPR2 meets industry standards.
7.What is the process for return or replacement of MC32PF3001A1EPR2?
All MC32PF3001A1EPR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF3001A1EPR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF3001A1EPR2 part is unused and in its original packaging.
Return procedure for MC32PF3001A1EPR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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