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NXP Semiconductors MC32PF3001A3EP
- Part No.:
- MC32PF3001A3EP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC32PF3001A3EP.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:310
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Product details
Overview
MC32PF3001A3EP from NXP Semiconductors is a pre-programmed Power Management IC (PMIC) optimized for i.MX 6 SoloX processors with DDR3L memory, delivering three buck regulators (SW1: 2.75 A, SW2: 1.25 A, SW3: 1.5 A) and seven LDOs-including VCC_SD (100 mA, dual 1.8 V/3.3 V), V33 (350 mA), and VSNVS (1.0 mA RTC supply)-in a 48-pin QFN 7.0 mm × 7.0 mm wettable flank package. It enables full power sequencing for multimedia edge devices requiring low quiescent current and dynamic voltage scaling.
For engineers reviewing the MC32PF3001A3EP datasheet, MC32PF3001A3EP pinout, MC32PF3001A3EP application, or MC32PF3001A3EP equivalent, this page delivers verified regulator output voltages, OTP-configured startup sequence (SW1=1.375 V, SW2=3.3 V, SW3=1.35 V), I²C programmability, thermal protection, and validated alternative part options for i.MX 6SX-based industrial and embedded designs.
Technical Context
The MC32PF3001A3EP implements fixed OTP-based power sequencing (SW1_SEQ=2, SW2_SEQ=4, SW3_SEQ=3, VCC_SD_SEQ=5) tailored for i.MX 6SX with DDR3L, using a trimmed 16 MHz oscillator for switching regulation and a 32 kHz clock for startup timing control. Its architecture integrates dedicated feedback paths (SW1FB, SW2FB, SW3FB), separate ground references (GNDREF1, GNDREF2, GNDREF), and bias rails (VCOREDIG, VCOREREF) to maintain analog/digital domain isolation.
It supports dual-input operation: VIN (2.8–4.5 V) for standard systems or VPWR + external PMOS (3.7–5.5 V) with overvoltage detection, while retaining always-on VSNVS for RTC backup via coin cell charging. All regulators feature programmable current limits, PWM/PPM/APS mode selection, and dynamic voltage scaling with 6.25 mV/µs slew rate per OTP configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V on VIN, or 3.7 V to 5.5 V on VPWR with external PMOS-enables compatibility with Li-ion, USB PD, and industrial 5 V rails. |
| SW1 Output | 1.375 V @ 2.75 A (OTP-configured for i.MX 6SX core)-matches ARM Cortex-A9 VDD_ARM requirements with ±1.5% accuracy. |
| SW2 Output | 3.3 V @ 1.25 A (OTP-configured)-powers DDR3L I/O and NVCC_DRAM_CKE without external level-shifting. |
| VCC_SD Output | Dual-range: 1.85 V or 3.3 V @ 100 mA, selected by SD_VSEL pin-supports high-speed SD card interface compliance. |
| VSNVS Output | 3.0 V @ 1.0 mA with integrated coin cell charger-maintains secure non-volatile storage and real-time clock during main power loss. |
| I²C Address | 0x08 (default, fixed per OTP)-enables direct integration into i.MX 6SX boot firmware without address conflict. |
| Package | 48-pin QFN 7.0 mm × 7.0 mm, wettable flank (98ASA00933D)-supports automated optical inspection (AOI) and improves solder joint reliability. |
Pinout & Package
MC32PF3001A3EP uses a 48-pin QFN 7.0 mm × 7.0 mm wettable flank package (NXP code 98ASA00933D) with exposed thermal pad (EP) tied to GND for enhanced thermal dissipation in compact industrial layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 INTB | Open-drain interrupt output | Signals fault conditions (overvoltage, thermal, short-circuit) to host processor; requires external pull-up to VDDIO. |
| 2 SD_VSEL | Digital input | Selects VCC_SD output range: logic HIGH = 1.80–1.85 V, LOW = 2.85–3.30 V-enables SD card voltage mode negotiation. |
| 3 RESETBMCU | Open-drain reset output | Deasserts 2.0 ms after final regulator enable-synchronizes i.MX 6SX exit from POR; not monitored post-startup. |
| 6 SW1FB / 19 SW2FB / 27 SW3FB | Analog feedback inputs | High-impedance nodes routing directly to output capacitors-critical for loop stability; must be routed away from high-current paths. |
| 8,9 SW1LX / 17 SW2LX / 29 SW3LX | Switch node outputs | Connect to respective buck inductors; require low-inductance layout and Kelvin connection to minimize EMI and voltage spikes. |
| 12 GNDREF1 / 26 GNDREF2 / 40 GNDREF | Isolated ground references | Separate return paths for SW1, SW2/SW3, and core logic-prevents noise coupling between power domains and bandgap reference. |
| 34 VSNVS | RTC supply output | Provides regulated 3.0 V to i.MX SNVS domain; powered from VIN or coin cell via internal MUX-ensures continuous timekeeping. |
| 36 LICELL | Coin cell interface | Bidirectional analog terminal: charges 3 V coin cell when VIN is present; supplies VSNVS when main power fails. |
| 45 SDA / 46 SCL | I²C bidirectional interface | Operates at 100 kHz/400 kHz; SDA pulled up to VDDIO (1.7–3.6 V) via 4.7 kΩ-enables runtime reconfiguration of voltage rails and DVS profiles. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured startup sequence | Fixed SW1→SW3→SW2→VCC_SD→VLDO4 ordering (SEQ_CLK_SPEED = 500 µs) eliminates external sequencing ICs in i.MX 6SX DDR3L designs. |
| Dynamic voltage scaling (DVS) | 6.25 mV/µs slew rate (per OTP) enables controlled core voltage transitions during CPU frequency scaling-reduces inrush current and system-level ripple. |
| Dual-input front-end LDO support | VPWR + external PMOS (e.g., FDMA908PZ) extends input range to 5.5 V while limiting internal regulator stress-avoids derating in 5 V industrial systems. |
| VCC_SD dual-voltage capability | Hardware-selectable 1.8 V or 3.3 V output via SD_VSEL pin-meets JEDEC JESD84-B51 SD 3.0 timing requirements without external level shifters. |
| Integrated RTC power path | VSNVS + LICELL circuitry provides seamless switchover between main supply and coin cell-guarantees >10-year RTC retention with CR2032 battery. |
Applications
| Industrial HMI Terminal | Secure Edge Gateway |
|---|---|
|
Use Scenario: Fanless, DIN-rail mounted human-machine interface running Linux on i.MX 6SX with DDR3L SDRAM and dual Ethernet ports. IC Role / Device Role / Timing Role: MC32PF3001A3EP supplies VDD_ARM (1.375 V), DDR3L I/O (3.3 V), and VCC_SD (3.3 V) while managing cold-boot sequencing and RTC backup. Use Value: Eliminates discrete DC/DC + LDO + sequencer BOM; OTP configuration ensures deterministic power-up within 4.5 ms (td3 + td4). |
Use Scenario: Cellular-connected IoT gateway with tamper detection, encrypted storage, and real-time sensor aggregation. IC Role / Device Role / Timing Role: MC32PF3001A3EP powers i.MX 6SX security subsystem (VDD_ARM), SNVS domain (VSNVS), and secure element interface (VLDO2 @ 1.5 V). Use Value: Integrated coin cell charging and VSNVS retention preserve cryptographic keys and time stamps during mains failure-meets IEC 62443-3-3 SL2 requirements. |
| Medical Patient Monitor | Smart Energy Meter |
|
Use Scenario: Portable vital sign monitor with ECG, SpO₂, and display, operating from rechargeable Li-ion battery. IC Role / Device Role / Timing Role: MC32PF3001A3EP delivers low-noise 1.375 V core rail, 3.3 V analog front-end supply (V33), and 1.5 V sensor bias (VLDO2) with <10 µA quiescent current in PFM mode. Use Value: APS/PWM mode auto-selection extends battery life >30% vs fixed-PWM; wettable flank QFN ensures IPC Class 3 reliability in field-deployed units. |
Use Scenario: ANSI C12.20-certified revenue meter with PLC communication, metrology SoC, and tamper-proof RTC. IC Role / Device Role / Timing Role: MC32PF3001A3EP powers metrology ASIC core (SW3 @ 1.35 V), isolated comms PHY (V33), and secure timekeeping (VSNVS + LICELL). Use Value: OTP-fixed VSNVS voltage (3.0 V) and coin cell charge control meet ANSI C12.1–2017 backup power accuracy specs (±0.5% over temperature). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33PF3001A3EP | Rated for −40 °C to +105 °C (automotive grade); identical OTP configuration and pinout. | Qualified for automotive infotainment head units; requires AEC-Q100 Grade 2 validation. | Select when operating ambient exceeds 85 °C or automotive qualification is mandatory-no PCB changes required. |
| MC34PF3001A3EP | Rated for −40 °C to +105 °C (industrial grade); same OTP map but different thermal shutdown threshold (150 °C vs 145 °C). | Targeted at extended-temperature industrial controllers; supports longer continuous 100% load at 95 °C ambient. | Choose for high-reliability factory automation where sustained thermal margin is critical-identical footprint and register map. |
Compared with MC32PF3001A3EP, MC33PF3001A3EP adds automotive qualification and tighter thermal hysteresis, while MC34PF3001A3EP offers higher thermal shutdown threshold for continuous industrial operation-both retain identical i.MX 6SX DDR3L power sequencing and I²C interface behavior.
Availability
MC32PF3001A3EP is available at Aetrix Electronics and suitable for industrial HMI terminals, secure edge gateways, and medical patient monitors requiring stable component supply across multi-year production cycles.
Supply support for MC32PF3001A3EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF3001 product line was designed specifically to deliver single-chip, OTP-configured power solutions for NXP's i.MX 6 and i.MX 7 application processors-reducing design complexity and accelerating time-to-market for multimedia and edge computing systems.
FAQ
What is the default I²C address of the MC32PF3001A3EP?
The MC32PF3001A3EP uses a fixed default I²C address of 0x08, as defined in its one-time-programmable (OTP) memory. This address cannot be altered in the field and is shared across all PF3001 variants. The MC32PF3001A3EP responds to this address on the SDA/SCL bus only when VDDIO is powered (1.7–3.6 V) and VIN exceeds UVDET (typically 2.5 V). No external address pins or configuration resistors are required.
How does the MC32PF3001A3EP support DDR3L memory on the i.MX 6SX?
The MC32PF3001A3EP supports DDR3L memory through its OTP-configured SW2 regulator, which delivers 3.3 V at 1.25 A-matching the NVCC_DRAM_CKE and DDR3L I/O voltage requirement. Its startup sequence (SW2_SEQ=4) ensures SW2 enables after SW1 and SW3, aligning with i.MX 6SX power-on timing constraints. The VCC_SD regulator (3.3 V/1.85 V) further supports high-speed SD interfaces used for firmware updates in DDR3L-based systems.
Can the MC32PF3001A3EP operate with a 5 V input supply?
Yes-the MC32PF3001A3EP supports 5 V input via its VPWR pin when used with an external PMOS pass FET (e.g., FDMA908PZ) and resistor divider network. In this configuration, the internal LDOG pin drives the FET gate to regulate VIN to ≤4.5 V, protecting downstream regulators. The MC32PF3001A3EP monitors VPWR for overvoltage (6.0 V threshold) and asserts INTB if exceeded. Direct 5 V connection to VIN is not permitted.
What is the purpose of the SD_VSEL pin on the MC32PF3001A3EP?
The SD_VSEL pin on the MC32PF3001A3EP selects the output voltage range of the VCC_SD regulator: logic HIGH configures 1.80–1.85 V for UHS-I SD cards, while logic LOW selects 2.85–3.30 V for legacy SD/SDHC modes. This hardware-controlled selection eliminates software overhead during boot and ensures voltage compliance before the i.MX 6SX initializes its SD controller-critical for reliable firmware loading from SD media.
Does the MC32PF3001A3EP include battery backup functionality?
Yes-the MC32PF3001A3EP integrates a dedicated VSNVS regulator (3.0 V @ 1.0 mA) and bidirectional LICELL terminal that charges a 3 V coin cell (e.g., CR2032) when main power is present and automatically switches to coin cell supply during VIN dropout. This maintains RTC operation and secure non-volatile storage in the i.MX 6SX SNVS domain without external components, meeting >10-year backup lifetime requirements.
MC32PF3001A3EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC32PF3001A3EP FAQ
1.How can I place an order for MC32PF3001A3EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF3001A3EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF3001A3EP reliable?
The price and inventory of MC32PF3001A3EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF3001A3EP is usually 5 days.
3.What payment methods are accepted for MC32PF3001A3EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF3001A3EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF3001A3EP?
MC32PF3001A3EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF3001A3EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF3001A3EP?
For technical support, including MC32PF3001A3EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF3001A3EP requirements.
6.How does Aetrix verify that MC32PF3001A3EP is sourced from the original manufacturer or authorized distributors?
All MC32PF3001A3EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF3001A3EP meets industry standards.
7.What is the process for return or replacement of MC32PF3001A3EP?
All MC32PF3001A3EP units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF3001A3EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF3001A3EP part is unused and in its original packaging.
Return procedure for MC32PF3001A3EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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