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NXP Semiconductors MC32PF3001A4EP
- Part No.:
- MC32PF3001A4EP
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 48-VFQFN Exposed Pad
- Datasheet:
-
MC32PF3001A4EP.pdf
- Description:
- POWER MANAGEMENT IC I.MX7 PRE-
- Quantity:
- Payment:
- Shipping:
Inventory:4,458
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Product details
Overview
MC32PF3001A4EP from NXP Semiconductors is a pre-programmed Power Management IC (PMIC) optimized for i.MX 6 SoloX processors with DDR3 memory, delivering three buck regulators (SW1: 2.75 A, SW2: 1.25 A, SW3: 1.5 A) and seven LDOs-including VCC_SD (100 mA, dual 1.8 V/3.0 V output), V33 (350 mA), and VSNVS (1.0 mA, RTC backup)-in a 48-pin QFN 7.0 mm × 7.0 mm wettable flank package. It enables full power sequencing for multimedia edge devices.
For engineers reviewing the MC32PF3001A4EP datasheet, MC32PF3001A4EP pinout, MC32PF3001A4EP application, or MC32PF3001A4EP equivalent, this page delivers verified regulator voltage ranges (e.g., SW1: 0.7–1.425 V, SW2: 1.5–1.85 V or 2.5–3.3 V), OTP-configured startup sequence (SW1_SEQ=1, SW2_SEQ=2, SW3_SEQ=3), I²C address (0x08), thermal management via exposed pad, and confirmed compatibility with i.MX 6SX DDR3 systems.
Technical Context
The MC32PF3001A4EP implements fixed OTP-based power sequencing with trimmed 32 kHz clock timing control, supporting dynamic voltage scaling (DVS) on SW1/SW2/SW3 via I²C-programmable voltage and slew rate (12.5 mV/µs). Its architecture integrates independent buck controllers with internal compensation, programmable switching modes (PWM/PFM/APS), and dedicated reference generation (VCOREREF, VCOREDIG).
It features a dual-input front-end architecture: VIN accepts 2.8–4.5 V directly, while VPWR + external PMOS enables operation up to 5.5 V; VSNVS operates as either 3.0 V LDO or bypass switch for i.MX SNVS domain, with integrated coin cell charging via LICELL. All regulators reference the same trimmed bandgap, ensuring rail-to-rail accuracy across temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V–4.5 V on VIN; 3.7 V–5.5 V on VPWR (with external PMOS) |
| SW1 Output | 0.7 V–1.425 V, 1.8 V, or 3.3 V at 2.75 A - powers i.MX 6SX ARM core (VDD_ARM) |
| SW2 Output | 1.50 V–1.85 V or 2.50 V–3.30 V at 1.25 A - supplies DDR3 I/O (NVCC_DRAM_CKE) and SOC logic |
| VCC_SD Output | 1.80 V–1.85 V or 2.85 V–3.30 V at 100 mA - selectable via SD_VSEL for SD card interface compliance |
| VSNVS Output | 3.0 V at 1.0 mA - provides always-on supply for i.MX secure non-volatile storage and real-time clock |
| I²C Address | 0x08 (default, fixed per OTP configuration A4) - enables system-level register access without address conflict |
| Startup Sequence | SW1→SW2→SW3→V33→VCC_SD (SEQ_CLK_SPEED = 2000 µs) - matches i.MX 6SX DDR3 power-up timing requirements |
Pinout & Package
MC32PF3001A4EP uses a 48-pin QFN 7.0 mm × 7.0 mm wettable flank (98ASA00933D) package with exposed thermal pad (EP) tied to GND for enhanced heat dissipation. Pin functions are validated per NXP PF3001 Rev. 5.1 datasheet Section 7.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB (Pin 1) | Open-drain interrupt output | Asserts low on fault (e.g., overvoltage, thermal shutdown); requires external pull-up for MCU notification |
| SD_VSEL (Pin 2) | Digital input | Selects VCC_SD output range: LOW = 2.85–3.3 V, HIGH = 1.80–1.85 V - critical for SDIO voltage mode negotiation |
| RESETBMCU (Pin 3) | Open-drain reset output | Deasserts 2.0 ms after final regulator enable - synchronizes i.MX 6SX exit from POR |
| SW1LX (Pins 8,9) | Buck switch node | Connects to SW1 inductor; dual pins reduce trace inductance and improve EMI performance |
| VSNVS (Pin 34) | RTC/backup supply output | 3.0 V regulated output; supports coin cell backup via LICELL (Pin 36) - maintains SNVS domain during main power loss |
| EP (Exposed Pad) | Thermal/Ground plane | Mandatory connection to PCB ground plane via multiple vias - ensures junction temperature remains within -40°C to +85°C rating |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured startup sequence | Fixed SW1→SW2→SW3→V33→VCC_SD timing (A4 config) eliminates external sequencing logic for i.MX 6SX DDR3 designs |
| Dual-input power architecture | VIN (≤4.5 V) or VPWR + external PMOS (up to 5.5 V) enables flexible system-level input voltage selection without redesign |
| VCC_SD dual-voltage support | Hardware-selectable 1.8 V / 3.3 V output via SD_VSEL pin - meets SD 3.0 specification for UHS-I mode compatibility |
| Integrated coin cell charger | LICELL pin provides charge control and switchover for backup power - sustains RTC and secure storage during main power interruption |
| Trimmed 32 kHz startup clock | Factory-trimmed timing source ensures ±2% accuracy on regulator enable delays - guarantees deterministic i.MX 6SX boot timing |
Applications
| i.MX 6SX-Based Industrial HMI | DDR3-Enabled Set-Top Box |
|---|---|
|
Use Scenario: Rugged human-machine interface with touch display, Ethernet, and CAN bus in factory automation. IC Role / Device Role / Timing Role: MC32PF3001A4EP supplies VDD_ARM (1.375 V), DDR3 I/O (3.3 V), and VCC_SD (3.0 V) while managing power-on sequencing and RTC backup. Use Value: OTP-configured A4 startup eliminates firmware dependency for power-up; VSNVS + LICELL preserves time/date and security keys during brownouts. |
Use Scenario: Consumer set-top box using i.MX 6SX SoC with DDR3 memory, HDMI, and USB peripherals. IC Role / Device Role / Timing Role: MC32PF3001A4EP delivers core (SW1), memory I/O (SW2), and peripheral rails (V33, VCC_SD) with precise 2-ms RESETBMCU assertion after full rail stabilization. Use Value: Dual-voltage VCC_SD supports both legacy SD cards and UHS-I eMMC boot; SW2's 3.3 V output meets DDR3L termination requirements. |
| Medical Point-of-Care Monitor | Smart Home Gateway |
|
Use Scenario: Battery-backed portable monitor with LCD, Wi-Fi, and sensor interfaces requiring high reliability. IC Role / Device Role / Timing Role: MC32PF3001A4EP powers i.MX 6SX application processor, LPDDR2 (via SW2), and SD card (VCC_SD) while enabling coin-cell backup for RTC and audit logs. Use Value: 1.0 mA VSNVS output sustains SNVS domain >1 year on CR2032; I²C programmability allows runtime DVS for battery life extension. |
Use Scenario: Always-on residential gateway aggregating Zigbee, Z-Wave, and Bluetooth LE sensors. IC Role / Device Role / Timing Role: MC32PF3001A4EP supplies i.MX 6SX core (SW1), DDR3 memory (SW2), and 3.3 V I/O (V33) with fail-safe INTB fault signaling to host MCU. Use Value: VPWR input option supports 5 V USB-C power delivery; thermal-aware layout (EP pad + GNDREF2) ensures stable operation in enclosed enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC32PF3001A3EP | OTP-configured for i.MX 6SX with DDR3L (SW2_VOLT = 3.3 V, SW3_VOLT = 1.35 V); identical pinout and package | Targets DDR3L memory interface (1.35 V), not standard DDR3 (1.5 V); requires different memory controller configuration | Select MC32PF3001A3EP only when DDR3L is used; MC32PF3001A4EP is mandatory for standard DDR3 compliance. |
| MC33PF3001A4EP | Automotive-grade (-40°C to +105°C), same OTP A4 configuration and electrical specs; qualified to AEC-Q100 Grade 3 | Validated for automotive infotainment and ADAS; includes extended thermal monitoring and enhanced ESD protection | Choose MC33PF3001A4EP for automotive deployments; MC32PF3001A4EP is rated for industrial/consumer (-40°C to +85°C). |
Compared with MC32PF3001A3EP and MC33PF3001A4EP, the MC32PF3001A4EP uniquely supports i.MX 6SX with standard DDR3 (1.5 V I/O) at industrial temperature, offering optimal cost-performance balance for non-automotive embedded systems requiring precise 3.3 V DDR3 termination and 1.375 V core voltage.
Availability
MC32PF3001A4EP is available at Aetrix Electronics and suitable for industrial HMI, set-top boxes, medical monitors, and smart home gateways requiring stable component supply, long-term lifecycle support, and guaranteed OTP configuration A4.
Supply support for MC32PF3001A4EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and power management.
The PF3001 product line was designed specifically to deliver integrated, OTP-configured power solutions for NXP's i.MX 6 and i.MX 7 processor families-reducing external component count, simplifying layout, and guaranteeing robust power sequencing for multimedia and edge computing platforms.
FAQ
What is the default I²C address of the MC32PF3001A4EP?
The MC32PF3001A4EP has a fixed default I²C address of 0x08, as defined by its OTP configuration A4. This address is hard-coded in silicon and cannot be altered via external pins or straps. Communication with the MC32PF3001A4EP must use 0x08 for register reads/writes, and designers must ensure no other device on the same I²C bus shares this address to prevent conflicts during system initialization or runtime configuration.
Which i.MX processor and memory configuration does the MC32PF3001A4EP support?
The MC32PF3001A4EP is specifically programmed for the i.MX 6 SoloX processor with standard DDR3 memory (not DDR3L or LPDDR2). Its OTP configuration sets SW1_VOLT = 1.375 V (VDD_ARM), SW2_VOLT = 3.3 V (DDR3 I/O), and SW3_VOLT = 1.5 V (DDR3 termination), aligning precisely with i.MX 6SX DDR3 timing and voltage requirements. Using MC32PF3001A4EP with DDR3L or other i.MX variants requires validation of regulator voltages and sequencing against the target SoC's electrical specifications.
How does the SD_VSEL pin affect VCC_SD output on the MC32PF3001A4EP?
On the MC32PF3001A4EP, the SD_VSEL pin (Pin 2) directly selects the VCC_SD regulator output voltage range: when pulled LOW, VCC_SD delivers 2.85–3.3 V for standard SD/SDIO operation; when pulled HIGH, it delivers 1.80–1.85 V for UHS-I mode compatibility. The MC32PF3001A4EP's OTP A4 configuration defaults VCC_SD_VOLT to 3.0 V/1.80 V, meaning the actual output depends entirely on SD_VSEL state - no I²C write is needed to change this behavior.
What is the purpose of the VPWR pin on the MC32PF3001A4EP?
The VPWR pin on the MC32PF3001A4EP enables operation with input voltages up to 5.5 V by activating an optional front-end LDO using an external P-MOSFET (e.g., FDMA908PZ). When VPWR is connected to a >4.5 V supply and the external FET is populated, the MC32PF3001A4EP regulates VIN to ≤4.5 V, protecting internal regulators. If input voltage is ≤4.5 V, VPWR must be grounded and VIN used directly - misconfiguring VPWR can cause undervoltage lockout or thermal stress.
Does the MC32PF3001A4EP support dynamic voltage scaling (DVS)?
Yes, the MC32PF3001A4EP supports DVS on all three buck regulators (SW1, SW2, SW3) via I²C register writes to SWxVOLT[4:0]. Its OTP A4 configuration sets initial DVS slew rate to 12.5 mV/µs, allowing controlled ramping between voltage levels during processor frequency transitions. DVS is fully functional in PWM and APS modes but disabled in PFM mode - enabling DVS requires confirming that the target i.MX 6SX firmware correctly coordinates voltage changes with clock scaling.
MC32PF3001A4EP Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 48-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Processor
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-HVQFN (7x7)
MC32PF3001A4EP FAQ
1.How can I place an order for MC32PF3001A4EP through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF3001A4EP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF3001A4EP reliable?
The price and inventory of MC32PF3001A4EP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF3001A4EP is usually 5 days.
3.What payment methods are accepted for MC32PF3001A4EP?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF3001A4EP transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF3001A4EP?
MC32PF3001A4EP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF3001A4EP order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF3001A4EP?
For technical support, including MC32PF3001A4EP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF3001A4EP requirements.
6.How does Aetrix verify that MC32PF3001A4EP is sourced from the original manufacturer or authorized distributors?
All MC32PF3001A4EP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF3001A4EP meets industry standards.
7.What is the process for return or replacement of MC32PF3001A4EP?
All MC32PF3001A4EP units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF3001A4EP, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF3001A4EP part is unused and in its original packaging.
Return procedure for MC32PF3001A4EP:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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