NXP Semiconductors MC32PF3001A4EPR2

Overview

MC32PF3001A4EPR2 from NXP Semiconductors is a pre-programmed Power Management IC (PMIC) optimized for i.MX 6 SoloX processors with DDR3 memory, delivering three buck regulators (SW1: 2.75 A, SW2: 1.25 A, SW3: 1.5 A), seven LDOs including VCC_SD (100 mA, dual-voltage 1.80/3.0 V), and RTC backup supply (VSNVS: 3.0 V, 1.0 mA). It supports I²C configuration and dynamic voltage scaling in consumer-grade applications.

For engineers reviewing the MC32PF3001A4EPR2 datasheet, MC32PF3001A4EPR2 pinout, MC32PF3001A4EPR2 application, or MC32PF3001A4EPR2 equivalent, this page provides verified regulator output voltages, OTP-configured startup sequence (SW1=1.375 V, SW2=3.3 V, SW3=1.5 V), thermal-safe QFN-48 wettable flank package details, and validated alternatives for i.MX 6SX-based industrial and multimedia designs.

Technical Context

The MC32PF3001A4EPR2 implements fixed OTP-based power sequencing (SW1 SEQ=2, SW2 SEQ=4, SW3 SEQ=3, VCC_SD SEQ=3) with 2.0 MHz PWM switching frequency across all buck stages and uses a trimmed 16 MHz RC oscillator for timing-critical functions including DVS ramp rate (12.5 mV/µs) and startup control. Its internal architecture integrates dedicated analog reference generation (VCOREREF), core bias rails (VCOREDIG = 1.28 V in low-power modes), and fault-aware logic interfacing via INTB, RESETBMCU, and PWRON.

It features a dual-input front-end architecture supporting VIN (2.8–4.5 V) or VPWR (3.7–5.5 V) with external PMOS pass FET control via LDOG, while maintaining strict input voltage dependencies: VDDIO must be ≤ VIN, and VLDO2IN max = 3.4 V. The SD_VSEL pin selects VCC_SD output between 1.80–1.85 V or 2.85–3.30 V, enabling direct compatibility with high-speed SD card interfaces.

Key Specifications

Pinout & Package

MC32PF3001A4EPR2 is housed in a 48-pin QFN 7.0 mm × 7.0 mm wettable flank (WF-type) package (NXP package code 98ASA00933D), featuring an exposed thermal pad (EP) tied to GND for enhanced heat transfer. Pin layout follows standard PF3001 topology with dedicated ground references (GNDREF1, GNDREF2, GNDREF) isolated from high-current return paths to minimize noise coupling.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with MC32PF3001A4EPR2, MC34PF3001A4ES offers identical functionality with extended thermal rating, while PF8100A1ES provides broader feature set at cost of i.MX-specific optimizations and hardware compatibility - making the former a true grade variant and the latter a functionally distinct alternative.

Availability

MC32PF3001A4EPR2 is available at Aetrix Electronics and suitable for set-top box, industrial HMI, and point-of-sale terminal designs requiring stable component supply, long-term lifecycle support, and tape-and-reel packaging for automated assembly.

Supply support for MC32PF3001A4EPR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with deep expertise in ARM-based application processors and associated power management.

The PF3001 product line was designed specifically to deliver tightly integrated, OTP-optimized power solutions for NXP's i.MX 6 and i.MX 7 processor families, minimizing external components and simplifying board-level power architecture.

FAQ

What is the default I²C address of the MC32PF3001A4EPR2?

The MC32PF3001A4EPR2 uses a fixed default I²C address of 0x08, as defined in its OTP configuration. This address is unchangeable in hardware and serves as the primary communication channel for runtime register access, voltage adjustment, and fault status reading. All I²C transactions with MC32PF3001A4EPR2 must target this address, and no address pins or straps are provided for modification.

How does the SD_VSEL pin affect the VCC_SD output voltage in MC32PF3001A4EPR2?

In MC32PF3001A4EPR2, the SD_VSEL pin determines VCC_SD output range: when pulled HIGH, VCC_SD delivers 1.80–1.85 V for UHS-I SD card operation; when LOW, it delivers 2.85–3.30 V for legacy SDIO peripherals. The pin is VDDIO-referenced, and defaults to HIGH if VDDIO is absent - ensuring safe low-voltage boot until host processor asserts control.

What is the startup sequence order for MC32PF3001A4EPR2, and how is it configured?

The MC32PF3001A4EPR2 implements a fixed OTP-configured startup sequence: SW1 (SEQ=2) → SW3 (SEQ=3) → SW2 (SEQ=4) → VCC_SD (SEQ=3) → VLDO4 (SEQ=3) → V33 (SEQ=2). This ordering is hard-coded in one-time-programmable memory and cannot be altered via I²C; timing intervals are governed by a 2000 µs clock step derived from the internal 16 MHz oscillator.

Does MC32PF3001A4EPR2 support input voltages above 4.5 V, and if so, how?

Yes, MC32PF3001A4EPR2 supports up to 5.5 V input via the VPWR pin when used with an external PMOS pass FET (e.g., FDMA908PZ) controlled by the LDOG output. In this configuration, the internal LDO regulation loop maintains VIN ≤ 4.5 V for all downstream regulators. For ≤4.5 V systems, VPWR is grounded and VIN is used directly - no external FET required.

What is the purpose of the VSNVS rail in MC32PF3001A4EPR2, and what load can it drive?

The VSNVS rail in MC32PF3001A4EPR2 provides a dedicated 3.0 V, 1.0 mA always-on supply for the Secure Non-Volatile Storage (SNVS) and Real-Time Clock (RTC) domains of i.MX processors. It supports coin cell backup via the LICELL pin and maintains timekeeping and cryptographic key storage during main power loss, with built-in charge management and undervoltage protection.