NXP Semiconductors MC32PF3001A6EP

Overview

MC32PF3001A6EP from NXP Semiconductors is a pre-programmed Power Management IC (PMIC) optimized for i.MX 6UL processors with LPDDR2 memory, delivering three buck regulators (SW1: 2.75 A, SW2: 1.25 A, SW3: 1.5 A) and seven LDOs-including VCC_SD (100 mA, dual 1.8 V/3.3 V), V33 (350 mA), and VSNVS (1.0 mA RTC supply)-in a 48-pin QFN 7.0 mm × 7.0 mm wettable flank package. It supports dynamic voltage scaling and I²C programmability for embedded industrial control and medical monitoring systems.

For engineers reviewing the MC32PF3001A6EP datasheet, MC32PF3001A6EP pinout, MC32PF3001A6EP application, or MC32PF3001A6EP equivalent, this page delivers verified regulator output voltages, OTP-configured startup sequencing (SW1=1.4 V, SW2=3.3 V, SW3=1.2 V), thermal-safe package details, and validated alternative PMICs for i.MX 6UL-based designs requiring stable multi-rail power delivery.

Technical Context

The MC32PF3001A6EP implements fixed OTP-based power sequencing (SW1_SEQ=3, SW2_SEQ=3, SW3_SEQ=3, VCC_SD_SEQ=3) tailored for i.MX 6UL with LPDDR2, using a trimmed 16 MHz RC oscillator to derive 2.0 MHz switching frequency across all bucks and a 32 kHz clock for startup timing control. Its internal architecture integrates dedicated feedback paths (SW1FB, SW2FB, SW3FB), independent input rails (VIN, VPWR), and core bias supplies (VCOREDIG, VCOREREF) with trim-in-package references.

Regulator control logic includes PFM/PWM/APS mode selection per buck, programmable current limits, and fault detection via INTB interrupt-while VSNVS operates as a dedicated 3.0 V, 1.0 mA always-on RTC rail with coin cell charging capability. The device uses SD_VSEL to select VCC_SD output between 1.80–1.85 V or 2.85–3.30 V, and supports external front-end LDO operation via VPWR/LDOG for input voltages up to 5.5 V.

Key Specifications

Pinout & Package

MC32PF3001A6EP uses a 48-pin QFN 7.0 mm × 7.0 mm wettable flank (WF-type) package (98ASA00933D) with exposed thermal pad (EP) tied to ground for enhanced thermal dissipation. Pin functions are fully defined in NXP's PF3001 datasheet Rev. 5.1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar PMIC applications.

Compared with MC32PF3001A6EP, MC33PF3001A6EP adds automotive qualification and tighter thermal specs, while MC34PF3001A6EP offers industrial-grade temperature margin-both retain identical OTP programming, regulator outputs, and I²C register maps for drop-in replacement in thermally demanding deployments.

Availability

MC32PF3001A6EP is available at Aetrix Electronics and suitable for industrial control HMI, medical patient monitors, and POS terminals requiring stable component supply with guaranteed long-term sourcing.

Supply support for MC32PF3001A6EP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in ARM-based application processors and associated power management.

The PF3001 product line was designed specifically to deliver integrated, OTP-configured power solutions for NXP's i.MX 6 and i.MX 7 processor families-reducing external component count and ensuring reliable, repeatable power sequencing in resource-constrained embedded systems.

FAQ

What is the default output voltage configuration of MC32PF3001A6EP?

The MC32PF3001A6EP is factory-programmed with OTP configuration A6: SW1 = 1.4 V, SW2 = 3.3 V, SW3 = 1.2 V, VCC_SD = 3.3 V / 1.85 V (selectable via SD_VSEL), V33 = 3.3 V, and VSNVS = 3.0 V. These values are fixed at power-on and may be adjusted dynamically via I²C if needed. All regulator sequences and timing parameters are also pre-set per Table 4 of the PF3001 datasheet Rev. 5.1.

Does MC32PF3001A6EP support dynamic voltage scaling (DVS)?

Yes, MC32PF3001A6EP supports DVS on SW1, SW2, and SW3 buck regulators through I²C register writes to SWxVOLT[4:0]. The device implements programmable slew rates (e.g., 6.25 mV/μs for A6 config) and allows real-time voltage adjustments during operation-enabling power optimization for varying i.MX 6UL workload states without hardware changes.

How does the VSNVS rail function in MC32PF3001A6EP?

The VSNVS rail in MC32PF3001A6EP provides a dedicated 3.0 V, 1.0 mA always-on supply for the i.MX 6UL's Secure Non-Volatile Storage (SNVS) domain and real-time clock. It can be powered from VIN or an external coin cell via LICELL pin, with integrated charging circuitry that regulates charge current to preserve battery life-ensuring continuous timekeeping and secure state retention during main power loss.

Can MC32PF3001A6EP operate with input voltages above 4.5 V?

Yes, MC32PF3001A6EP supports input voltages up to 5.5 V using its optional front-end LDO architecture: connect VPWR to the high-voltage source, populate an external P-MOSFET (e.g., FDMA908PZ), and drive its gate via LDOG. The internal error amplifier regulates VIN to ≤4.5 V, protecting downstream regulators. For inputs ≤4.5 V, VPWR is grounded and VIN is used directly.

What is the purpose of the SD_VSEL pin on MC32PF3001A6EP?

The SD_VSEL pin on MC32PF3001A6EP selects the output voltage range of the VCC_SD LDO: logic LOW configures 2.85–3.30 V for standard SD cards, while logic HIGH selects 1.80–1.85 V for UHS-I SDIO interfaces. This hardware-selectable dual-voltage capability eliminates software configuration overhead and ensures compliance with JEDEC SD physical layer specifications across operating modes.