NXP Semiconductors MC32PF4210A0ESR2
- Part No.:
- MC32PF4210A0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC32PF4210A0ESR2.pdf
- Description:
- PF4210
- Quantity:
- Payment:

- Shipping:

Inventory:2,181
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Product details
Overview
MC32PF4210A0ESR2 from NXP Semiconductors is a 14-channel programmable PMIC optimized for i.MX 8M-based audio/video systems, integrating six buck converters (including SW1A/B/C up to 2.5 A + 2.0 A), six LDOs (e.g., VGEN2 at 250 mA), I²C control, OTP-configurable power sequencing, and coin cell charging. It delivers core, memory, and peripheral rails-including DDR termination reference (VREFDDR) and SNVS supply-for OTT STBs and voice assistant platforms.
For engineers reviewing the MC32PF4210A0ESR2 datasheet, MC32PF4210A0ESR2 pinout, MC32PF4210A0ESR2 application, or MC32PF4210A0ESR2 equivalent, key selection criteria include its 56-pin QFN 8×8 mm wettable flank package, −40 °C to 85 °C operating range, preprogrammed A0 OTP configuration, and support for dynamic voltage scaling across multiple processor domains.
Technical Context
The MC32PF4210A0ESR2 implements a multi-rail architecture with configurable buck topology: SW1A/B can operate in single/dual-phase mode (2.5 A total) or independent mode (SW1A/B 2.5 A + SW1C 2.0 A), while SW3A/B supports 3.0 A combined or 1.5 A per rail. Its internal 16 MHz RC oscillator and 32 kHz clock enable precise timing for power sequencing and RTC functions.
Control logic integrates I²C register mapping, programmable fault detection (OCP, thermal, UVLO), and event-driven interfaces including PWRON (edge/level detect), STANDBY (active-high/low configurable), and open-drain outputs INTB, SDWNB, and RESETBMCU-each with defined timing and voltage thresholds per JEDEC-compliant interface specs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V main supply; enables direct compatibility with single-cell Li-ion or 3.3 V/5 V system rails |
| Buck Regulator Count | Configurable 4–6 outputs; SW1A/B/C, SW2, SW3A/B, SW4 provide flexible core/memory/peripheral partitioning |
| Max Output Current | SW1A/B: 2.5 A combined; SW1C: 2.0 A; SW2: 2.5 A; SW3A/B: 3.0 A combined; SW4: 1.0 A |
| LDO Count & Capacity | Six programmable LDOs: VGEN1–VGEN6 deliver 100–350 mA at user-defined voltages (e.g., VGEN2 = 250 mA) |
| DDR Reference | VREFDDR output: 0.6 V to 0.9 V, 10 mA; supplies accurate termination reference for LPDDR4 interfaces |
| OTP Memory | On-chip one-time programmable memory stores startup sequence, voltage levels, timing, and fault response behavior |
| Operating Temperature | 0 °C to 85 °C ambient; validated for consumer-grade audio/video applications per Table 4 |
Pinout & Package
MC32PF4210A0ESR2 uses a 56-pin QFN package (8 mm × 8 mm, 0.5 mm pitch, wettable flank) with exposed thermal pad (EP) tied to GND for enhanced thermal dissipation. Pin functions are fully defined per Table 2 of the Rev. 2.0 datasheet, supporting discrete feedback routing, dedicated ground references (GNDREF, GNDREF1, SW1VSSSNS), and dual-purpose I²C/SCL/SDA with 3.6 V tolerant logic.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INTB | Digital output | Open-drain interrupt signal indicating active faults (OCP, thermal, UVLO); requires external pull-up |
| SW1ALX / SW1BLX / SW1CLX | Analog switch node | High-current switching outputs for buck regulators SW1A/B/C; routed separately from feedback paths |
| SW1FB / SW1CFB / SW2FB / SW3AFB / SW3BFB / SW4FB | Analog feedback input | Voltage sense inputs for closed-loop regulation; require Kelvin trace routing to output capacitors |
| VGEN2 / VGEN4 / VGEN6 | Analog output | Programmable LDO outputs (250 mA / 350 mA / 200 mA); bypassed with ceramic capacitors per spec |
| PWRON / STANDBY / RESETBMCU | Digital I/O | Processor interface signals for power-on sequencing, low-power state control, and reset coordination |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Buck Topology | SW1 and SW3 support single/dual-phase or independent operation-enabling trade-offs between current capacity and rail count without hardware change |
| DDR Termination Support | SW4 operates in VTT tracking mode, delivering 50 % of SW3A voltage for precise LPDDR4 termination compliance |
| Low-Power Modes | Standby (297–550 µA), Sleep (122–250 µA), and Off (17–25 µA) states reduce system energy consumption during idle periods |
| Coin Cell Integration | LICELL pin provides bidirectional coin cell interface with integrated charger and VSNVS backup supply (1.0/1.1/1.2/1.3/1.5/1.8/3.0 V options) |
| I²C Programmability | Full register map access enables runtime reconfiguration of voltages, sequencing delays, fault thresholds, and mode transitions |
Applications
| OTT Streaming Box | Wireless Audio System |
|---|---|
Use Scenario: Powering i.MX 8M Mini-based set-top boxes with HDMI, USB, Wi-Fi, and audio codecs. IC Role / Device Role / Timing Role: Central PMIC managing core (VCOREDIG), memory (VREFDDR), GPU, and peripheral rails with synchronized startup. Use Value: Eliminates need for discrete DC-DCs and LDOs; reduces BOM count by consolidating 14 regulated outputs in one QFN. |
Use Scenario: Supplying multi-driver smart speakers with Bluetooth LE, far-field mic arrays, and DSP processing. IC Role / Device Role / Timing Role: Delivers low-noise analog rails (VGEN2, VGEN4) for audio DACs and mic bias, plus digital cores (VCORE, VCOREDIG). Use Value: Enables <100 µA standby current via programmable sleep modes-extending battery life in portable designs. |
| Voice Recognition Assistant | Sound Bar Platform |
Use Scenario: Powering always-on voice wake-word engines with local AI inference on i.MX 8M Nano. IC Role / Device Role / Timing Role: Provides SNVS-supplied real-time clock (VSNVS), low-leakage standby domain, and fast wake-up sequencing. Use Value: Guarantees sub-100 ms resume from deep sleep using OTP-stored sequence and internal 32 kHz oscillator. |
Use Scenario: Supporting multi-zone amplifiers, HDMI ARC, and high-resolution audio decoding in compact sound bars. IC Role / Device Role / Timing Role: Supplies DDR memory (VREFDDR), audio SoC cores (VCOREDIG), and analog front-end (VGEN1/VGEN3) with tight voltage accuracy. Use Value: Maintains ±1 % output regulation across temperature-critical for THD-sensitive audio signal chains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF4210A4ES | Industrial-grade variant: −40 °C to 105 °C operating range; identical pinout and register map | Required for extended-temperature deployments (e.g., automotive infotainment, industrial AV receivers) | Select when ambient exceeds 85 °C or long-term reliability under thermal stress is critical |
| PF8100A0ES | Lower channel count (8-channel); no DDR termination reference; lacks coin cell charger and VSNVS flexibility | Suitable for simpler i.MX 8M applications without SNVS dependency or DDR memory | Choose only if system omits RTC backup, DDR, or advanced low-power sequencing requirements |
Compared with MC32PF4210A0ESR2, MC34PF4210A4ES offers identical functionality with extended thermal rating, while PF8100A0ES reduces integration depth-making it viable only for non-SNVS, non-DDR designs where cost and footprint outweigh feature completeness.
Availability
MC32PF4210A0ESR2 is available at Aetrix Electronics and suitable for OTT STBs, wireless audio systems, and voice recognition assistants requiring stable component supply across consumer electronics production cycles.
Supply support for MC32PF4210A0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer markets, with over 40 years of analog and mixed-signal design heritage.
The PF4210 product line targets cost-sensitive, high-integration audio/video platforms based on i.MX 8M processors-delivering complete power subsystems with minimal external components and field-programmable flexibility.
FAQ
What is the operating temperature range for MC32PF4210A0ESR2?
The MC32PF4210A0ESR2 is rated for 0 °C to 85 °C ambient operation, aligning with consumer-grade audio/video applications. This range is validated per Table 4 of the Rev. 2.0 datasheet and applies to all functional blocks including buck regulators, LDOs, and I²C interface. Thermal protection thresholds (e.g., THERM130 at 130 °C) remain active within this envelope.
Does MC32PF4210A0ESR2 support DDR memory termination?
Yes, MC32PF4210A0ESR2 supports DDR termination through its VREFDDR output (0.6 V to 0.9 V, 10 mA) and SW4's VTT tracking mode, which delivers 50 % of SW3A voltage. This meets JEDEC LPDDR4 termination requirements and eliminates need for external termination ICs in i.MX 8M designs.
How is the startup sequence configured on MC32PF4210A0ESR2?
The MC32PF4210A0ESR2 uses on-chip OTP memory to store startup sequence parameters-including voltage levels, timing delays, and enable order. The A0 suffix indicates a nonprogrammed device, allowing custom OTP programming during manufacturing to match specific i.MX 8M platform requirements before deployment.
Can MC32PF4210A0ESR2 operate without a coin cell battery?
Yes, MC32PF4210A0ESR2 can operate without a coin cell when VIN is present and ≥2.85 V. However, VSNVS must be powered from VIN in that case. Coin cell (LICELL) is required only for reliable standby mode entry/exit below 2.85 V or for maintaining RTC during main power loss-per Section 9.3.2.1.3 of the datasheet.
What package type and pin count does MC32PF4210A0ESR2 use?
MC32PF4210A0ESR2 uses a 56-pin QFN package measuring 8 mm × 8 mm with 0.5 mm pitch and wettable flank features. The exposed thermal pad (EP) must be soldered to PCB ground planes via multiple vias to meet RΘJB ≤10 °C/W and ensure safe junction temperature under full load.
MC32PF4210A0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Audio, Video
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 4.5V
- Operating Temperature:
- 0°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MC32PF4210A0ESR2 FAQ
1.How can I place an order for MC32PF4210A0ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF4210A0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF4210A0ESR2 reliable?
The price and inventory of MC32PF4210A0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF4210A0ESR2 is usually 5 days.
3.What payment methods are accepted for MC32PF4210A0ESR2?
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4.How is shipping managed for MC32PF4210A0ESR2?
MC32PF4210A0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF4210A0ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF4210A0ESR2?
For technical support, including MC32PF4210A0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF4210A0ESR2 requirements.
6.How does Aetrix verify that MC32PF4210A0ESR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF4210A0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF4210A0ESR2 meets industry standards.
7.What is the process for return or replacement of MC32PF4210A0ESR2?
All MC32PF4210A0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF4210A0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF4210A0ESR2 part is unused and in its original packaging.
Return procedure for MC32PF4210A0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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