NXP Semiconductors MC32PF4210A1ES
- Part No.:
- MC32PF4210A1ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC32PF4210A1ES.pdf
- Description:
- PF4210
- Quantity:
- Payment:

- Shipping:

Inventory:266
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC32PF4210A1ES from NXP Semiconductors is a 14-channel programmable PMIC optimized for i.MX 8M-based audio/video systems, integrating six buck converters (including SW1A/B/C up to 2.5 A + 2.0 A), six LDOs (e.g., VGEN2 at 250 mA, VGEN4 at 350 mA), I²C control, OTP-configurable power sequencing, and coin cell charging. It delivers core, memory, and peripheral rails-including DDR termination reference (VREFDDR) and SNVS supply-for OTT STBs and voice assistant platforms.
For engineers reviewing the MC32PF4210A1ES datasheet, MC32PF4210A1ES pinout, MC32PF4210A1ES application, or MC32PF4210A1ES equivalent, key selection criteria include its 56-pin QFN 8×8 mm wettable flank package, preprogrammed A1 OTP configuration for MCIMX8M-EVK compatibility, thermal protection thresholds (110–130 °C), and support for dynamic voltage scaling across multiple buck outputs.
Technical Context
The MC32PF4210A1ES implements a fully configurable multi-rail architecture with independent control of six switching regulators-SW1A/B/C (0.3–1.875 V), SW2 (0.4–3.3 V), SW3A/B (0.4–3.3 V), and SW4 (0.4–3.3 V, DDR tracking capable)-plus a 5.0–5.15 V/600 mA boost regulator for USB OTG. All buck regulators support PWM, PFM, and APS modes with programmable soft start, current limit, and OCP fault interrupt.
Its control logic integrates I²C register mapping, OTP-based startup sequence storage, and dedicated processor interface signals (PWRON, STANDBY, RESETBMCU, SDWNB, INTB) enabling coordinated power state transitions and fault reporting. The device uses internal 16 MHz and 32 kHz clocks, supports VSNVS output at 1.0–3.0 V (1.5 mA consumer), and includes thermal monitoring with four interrupt thresholds and 130 °C fail-safe shutdown.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V main supply - supports Li-ion, USB, or DC-DC pre-regulator inputs without external level shifting |
| Buck Regulator Count | Up to 6 independent outputs - enables full system power delivery (core, DDR, IO, peripherals) from single IC |
| Max Buck Output Current | SW1A/B combined: 2.5 A; SW1C: 2.0 A; SW2/SW3A/B: 2.5 A/3.0 A; SW4: 1.0 A - meets i.MX 8M processor rail requirements |
| LDO Count & Max Current | 6 programmable LDOs: VGEN2 = 250 mA, VGEN4 = 350 mA, others 100–200 mA - powers audio codecs, sensors, and low-noise analog circuits |
| VREFDDR Output | 0.6 V to 0.9 V, 10 mA - provides precision DDR4/LPDDR4 reference voltage with tracking capability via SW4 |
| Thermal Protection | Four interrupt thresholds (110/120/125/130 °C) + 130–150 °C shutdown - prevents die damage during sustained overload or poor PCB thermal design |
| OTP Configuration | Preprogrammed A1 version - factory-configured for MCIMX8M-EVK reference design, eliminating need for field programming |
Pinout & Package
MC32PF4210A1ES is housed in a 56-pin QFN package (8 mm × 8 mm, 0.5 mm pitch, wettable flank), optimized for thermal dissipation and automated optical inspection. The exposed pad (EP) must be connected to inner/external ground planes via multiple vias.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1ALX / SW1BLX / SW1CLX | Buck switch node outputs | High-frequency switching nodes for SW1A/B/C - require tight layout with low-inductance paths to inductors and output caps |
| VIN / VIN1 / VIN2 / VIN3 | Main and auxiliary input supplies | Dedicated inputs per regulator group - decoupling capacitors must be placed <1 mm from each pin |
| VGEN1–VGEN6 | LDO output rails | Programmable analog/digital peripheral supplies - bypassed with 2.2–4.7 µF ceramic caps per datasheet spec |
| SDA / SCL / VDDIO | I²C interface | Open-drain digital bus (3.6 V tolerant) - requires pull-ups to VDDIO; VDDIO powers internal I²C logic |
| RESETBMCU / INTB / SDWNB | Fault and control signaling | Open-drain active-low outputs - drive processor reset, interrupt, and shutdown warning with 0.4 V max VOL at −2 mA |
| PWRON / STANDBY | Processor-to-PMIC control | Level- or edge-triggered inputs - define power-on initiation and low-power entry/exit behavior |
Key Features
| Feature | Design Value |
|---|---|
| Configurable buck topology | SW1 and SW3 support single/dual-phase or independent operation - enables trade-off between current capacity and rail count |
| DDR termination tracking | SW4 operates in VTT mode at 50 % of SW3A output - eliminates external resistor network for LPDDR4 termination |
| Low-quiescent-current modes | Standby mode draws 297–550 µA - sustains SNVS domain and critical logic while minimizing battery drain |
| OTP-based startup sequence | A1 variant stores fixed power-up timing, voltage, and enable order - ensures repeatable boot across production units |
| Coin cell integration | LICELL pin supports charging and backup supply for VSNVS - maintains RTC and secure non-volatile state during main power loss |
| Thermal interrupt granularity | Four independent THERMxxxI interrupts - allows firmware to implement progressive throttling before shutdown |
Applications
| OTT Streaming Set-Top Box | Voice Recognition Assistant |
|---|---|
|
Use Scenario: Compact, fanless media player requiring simultaneous core, GPU, DDR, and HDMI PHY power with minimal BOM count. IC Role / Device Role / Timing Role: Primary system PMIC delivering 14 regulated rails including VCOREDIG (1.5 V), VGEN4 (3.3 V @ 350 mA), and VREFDDR (0.75 V) with synchronized sequencing. Use Value: Eliminates discrete DC-DC + LDO combinations; reduces board area by >40% vs. multi-chip solution while meeting i.MX 8M power integrity specs. |
Use Scenario: Always-on smart speaker with wake-word detection, requiring ultra-low standby current and reliable RTC backup. IC Role / Device Role / Timing Role: System power manager providing VSNVS (1.5 V @ 1.5 mA) from coin cell, low-noise VGEN2 (0.9 V @ 250 mA) for audio ADC, and fast wake-up via PWRON edge detection. Use Value: Achieves <25 µA off-mode and <550 µA standby current - extends battery life in portable variants and ensures instant wake from deep sleep. |
| Wireless Audio Transmitter | A/V Receiver with HDMI Processing |
|
Use Scenario: Bluetooth/Wi-Fi audio dongle needing clean 1.8 V for codec, 3.3 V for RF front-end, and 5.0 V for USB OTG host port. IC Role / Device Role / Timing Role: Integrated power hub supplying VGEN3 (1.8 V), VGEN5 (3.3 V), and SWBST (5.0–5.15 V @ 600 mA) with I²C-adjustable voltage and sequencing. Use Value: Replaces three separate regulators; SWBST's OTG support enables firmware updates via USB without external boost IC. |
Use Scenario: Multi-input home theater receiver supporting HDMI 2.0, audio DSP, and video processing with thermal constraints. IC Role / Device Role / Timing Role: Centralized power controller delivering VCORE (3.6 V), SW2 (1.1 V @ 2.5 A), and VREFDDR (0.6–0.9 V) with real-time thermal monitoring and fault reporting. Use Value: Four thermal interrupts (THERM110I–THERM130I) enable adaptive fan control and rail throttling - prevents thermal runaway during sustained 4K video decode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF4210A1ES | Industrial temperature grade (−40 °C to 105 °C); identical pinout, OTP config, and electrical specs | Suitable for automotive infotainment or industrial A/V equipment requiring extended thermal range | Select MC34PF4210A1ES when operating ambient exceeds 85 °C or lifecycle demands industrial qualification |
| PF8100 | 8-channel PMIC; lacks coin cell charger, VREFDDR, and SW4 DDR tracking; different pinout and I²C register map | Targeted at simpler i.MX 6/7 designs without DDR4/LPDDR4 or always-on RTC requirements | Choose PF8100 only if system omits SNVS backup, DDR termination, and thermal interrupt granularity - not drop-in compatible |
Compared with MC32PF4210A1ES, MC34PF4210A1ES offers identical functionality with extended temperature rating, while PF8100 reduces channel count and removes DDR-specific features - making it unsuitable for i.MX 8M-based A/V receivers or OTT STBs requiring full memory interface support.
Availability
MC32PF4210A1ES is available at Aetrix Electronics and suitable for OTT STBs, voice recognition assistants, and wireless audio transmitters requiring stable component supply, preprogrammed reference design alignment, and long-term industrial availability.
Supply support for MC32PF4210A1ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with over 40 years of analog and mixed-signal IP expertise.
The PF4210 product line was designed specifically to power NXP's i.MX 8M family of applications processors in cost-sensitive audio/video systems, emphasizing integration density, OTP configurability, and DDR memory interface support.
FAQ
What is the operating temperature range for MC32PF4210A1ES?
The MC32PF4210A1ES is rated for 0 °C to 85 °C ambient operation, targeting consumer-grade audio/video applications such as OTT STBs and smart speakers. Its thermal protection activates at 110–130 °C junction temperature, with hard shutdown above 130–150 °C. This range aligns with the MCIMX8M-EVK reference design specifications and excludes industrial use cases requiring −40 °C to 105 °C operation - for which the MC34PF4210A1ES variant is specified.
How does the OTP programming differ between MC32PF4210A1ES and nonprogrammed variants?
The MC32PF4210A1ES contains factory-programmed OTP memory defining startup sequence, voltage levels, and timing for immediate use with the MCIMX8M-EVK. In contrast, nonprogrammed variants like MC32PF4210A0ES require external programming via VDDOTP (up to 10 V) before first power-up. The A1 configuration cannot be modified post-manufacture, ensuring consistent boot behavior across production units without firmware intervention.
Can MC32PF4210A1ES support LPDDR4 memory termination without external components?
Yes. MC32PF4210A1ES supports DDR termination through its SW4 buck regulator operating in VTT tracking mode, where SW4 output equals 50 % of SW3A voltage. This eliminates discrete resistor networks and external op-amps required for traditional VTT generation. The integrated VREFDDR rail (0.6–0.9 V, 10 mA) further provides precise reference for DDR I/O buffers - both features are enabled and validated in the A1 OTP configuration.
What are the key power-saving modes supported by MC32PF4210A1ES?
MC32PF4210A1ES supports four defined low-power states: Coin Cell mode (4–7 µA), Off mode (17–25 µA), Sleep mode (122–250 µA), and Standby mode (297–550 µA). Each mode selectively disables regulators, clocks, and references while preserving VSNVS and RTC functionality. Standby mode maintains all six LDOs and VREFDDR active - enabling rapid wake-up for voice assistant applications without full re-initialization.
Is MC32PF4210A1ES pin-compatible with other PF4210 variants?
Yes. All PF4210 variants - including MC32PF4210A0ES through A4ES and MC34PF4210A0ES through A4ES - share identical 56-pin QFN 8×8 mm wettable flank packaging and pinout. Mechanical and electrical compatibility is maintained across temperature grades and OTP configurations, allowing direct PCB reuse when migrating from consumer to industrial environments or between preprogrammed and custom-programmed versions.
MC32PF4210A1ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Audio, Video
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 4.5V
- Operating Temperature:
- 0°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MC32PF4210A1ES FAQ
1.How can I place an order for MC32PF4210A1ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF4210A1ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF4210A1ES reliable?
The price and inventory of MC32PF4210A1ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF4210A1ES is usually 5 days.
3.What payment methods are accepted for MC32PF4210A1ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF4210A1ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF4210A1ES?
MC32PF4210A1ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF4210A1ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF4210A1ES?
For technical support, including MC32PF4210A1ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF4210A1ES requirements.
6.How does Aetrix verify that MC32PF4210A1ES is sourced from the original manufacturer or authorized distributors?
All MC32PF4210A1ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF4210A1ES meets industry standards.
7.What is the process for return or replacement of MC32PF4210A1ES?
All MC32PF4210A1ES units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF4210A1ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF4210A1ES part is unused and in its original packaging.
Return procedure for MC32PF4210A1ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC32PF4210A1ES Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

