NXP Semiconductors MC32PF4210A1ESR2
- Part No.:
- MC32PF4210A1ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC32PF4210A1ESR2.pdf
- Description:
- PF4210
- Quantity:
- Payment:

- Shipping:

Inventory:4,858
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Product details
Overview
MC32PF4210A1ESR2 from NXP Semiconductors is a 14-channel programmable PMIC optimized for i.MX 8M-based audio/video systems, integrating six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–VGEN6), a 5.0 V boost regulator (SWBST), DDR termination reference (VREFDDR), and coin cell charger with RTC supply. It delivers up to 4.5 A on SW1A/B in combined mode and supports dynamic voltage scaling for processor core rails.
For engineers reviewing the MC32PF4210A1ESR2 datasheet, MC32PF4210A1ESR2 pinout, MC32PF4210A1ESR2 application, or MC32PF4210A1ESR2 equivalent, key selection criteria include OTP-programmable power sequencing, I²C-configurable rail voltages and timing, thermal protection thresholds (110–130 °C), and compatibility with consumer-grade i.MX 8M evaluation platforms like MCIMX8M-EVK.
Technical Context
The MC32PF4210A1ESR2 implements a fully integrated, OTP-configurable power architecture with independent control logic for each buck/LDO channel, enabling precise startup sequencing, dynamic voltage scaling (DVS), and fault-aware power state transitions. Its internal 16 MHz RC oscillator and 32 kHz clock support real-time control without external timing components.
It features dual-phase capability on SW1 and SW3 regulators, DDR tracking mode on SW4, and programmable OCP with interrupt reporting. The VSNVS output provides selectable 1.0/1.1/1.2/1.3/1.5/1.8/3.0 V SNVS supply at 1.5 mA, powered either from VIN or coin cell (LICELL), ensuring always-on system functionality during main supply interruption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V - Supports single-cell Li-ion or regulated 3.3 V/5 V input rails without external pre-regulation |
| Max Buck Output Current | 4.5 A (SW1A/B combined) - Enables high-current core supply for Cortex-A53 clusters in i.MX 8M processors |
| Boost Regulator Output | 5.0 V to 5.15 V @ 600 mA - Powers USB OTG peripherals directly; supports host-mode enumeration |
| VREFDDR Accuracy | 0.6 V to 0.9 V ±1.5% - Provides stable DDR4/LPDDR4 reference for memory termination compliance |
| Quiescent Current (Standby) | 297 µA typical - Minimizes battery drain in low-power audio/video standby states |
| OTP Memory | One-time programmable configuration storage - Enables factory-set power-up sequence, voltage levels, and timing without runtime I²C initialization |
| Thermal Protection Threshold | 130 °C (typical) - Triggers automatic shutdown to prevent die damage under sustained overload or poor PCB thermal design |
Pinout & Package
MC32PF4210A1ESR2 uses a 56-pin QFN package (8 mm × 8 mm, 0.5 mm pitch, wettable flank). The exposed pad (EP) serves as ground return for buck regulators and must be connected to inner/external ground planes via multiple vias for thermal dissipation and EMI control.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1ALX / SW1BLX / SW1CLX | Buck switch node outputs | High-frequency switching nodes for SW1A/B/C regulators; require low-inductance layout and ceramic output capacitors |
| VGEN1–VGEN6 | LDO outputs | Programmable analog/digital peripheral supplies (100–350 mA); bypassed with 2.2–4.7 µF ceramic caps per datasheet |
| INTB / SDWNB / RESETBMCU | Open-drain digital outputs | Interrupt, shutdown warning, and processor reset signaling - require external pull-ups to VSNVS or VDDIO |
| SCL / SDA / VDDIO | I²C interface | Standard 3.3 V I²C bus (400 kHz fast-mode compatible); VDDIO powers internal I²C logic and defines logic threshold |
| LICELL / VSNVS | Coin cell interface & always-on supply | LICELL accepts 1.8–3.3 V coin cells; VSNVS delivers configurable 1.0–3.0 V at 1.5 mA for SNVS domain retention |
Key Features
| Feature | Design Value |
|---|---|
| Configurable buck topology | SW1 and SW3 support single/dual-phase or independent operation - enables flexible current sharing or rail splitting for multi-core SoCs |
| DDR termination tracking | SW4 operates in VTT mode at 50% of SW3A output - eliminates need for external DDR termination IC in LPDDR4 designs |
| OTP-based startup sequence | Factory-programmed power-up order and timing - removes boot-time I²C dependency and improves system reliability |
| Thermal fault interrupts | THERM110I–THERM130I alerts at four discrete thresholds - allows firmware to throttle performance before shutdown |
| Low-quiescent coin cell mode | 4.0 µA typical current draw when powered solely from LICELL - extends backup runtime for RTC/SNVS beyond 1 year |
Applications
| OTT STB Power Management | Wireless Audio System Supply |
|---|---|
Use Scenario: Powering i.MX 8M Nano-based set-top boxes with HDMI, Wi-Fi, and audio codecs. IC Role / Device Role / Timing Role: Primary PMIC delivering core (VCOREDIG/VCORE), memory (VREFDDR), and peripheral (VGENx) rails with synchronized startup. Use Value: Eliminates discrete DC-DC + LDO combinations; reduces BOM count by ≥12 components while meeting 48-hour standby requirement. |
Use Scenario: Supplying Bluetooth speaker SoCs with DSP, Class-D amplifier, and USB-C charging. IC Role / Device Role / Timing Role: Generates 1.1 V DSP core, 1.8 V codec I/O, 3.3 V amplifier bias, and 5.0 V USB OTG from single Li-ion cell. Use Value: Enables seamless transition between battery and USB power using VSNVS and LICELL paths; supports <100 ms wake-from-sleep. |
| Voice Assistant Endpoint | A/V Receiver Subsystem |
Use Scenario: Powering far-field microphone array and wake-word engine in smart speakers. IC Role / Device Role / Timing Role: Supplies low-noise 1.5 V for ADCs, 1.8 V for DSP, and 3.0 V for RF front-end with PFM-mode optimization. Use Value: Achieves <15 µV RMS output noise on VGEN2 (250 mA LDO), preserving SNR in voice capture path. |
Use Scenario: Managing power for HDMI receiver, video processor, and audio DAC in home theater receivers. IC Role / Device Role / Timing Role: Delivers sequenced 1.0 V core, 1.8 V HDMI PHY, 3.3 V audio interface, and VREFDDR for DDR2 memory buffer. Use Value: Ensures HDMI hot-plug detection and audio sync integrity via sub-10 µs rail enable timing accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF4210A4ES | Industrial temperature grade (−40 °C to 105 °C); same pinout and OTP structure | Required for A/V receivers operating in unventilated enclosures or automotive infotainment | Select when ambient exceeds 85 °C or long-term reliability at elevated junction temperatures is mandated |
| PF8100A1ES | 12-channel PMIC with higher integration (integrated FET drivers, enhanced thermal monitoring); different pinout and register map | Targets next-gen i.MX 93-based systems requiring higher efficiency and lower quiescent current | Choose only for new designs; not drop-in compatible due to non-identical pin assignment and I²C command set |
Compared with MC32PF4210A1ESR2, MC34PF4210A4ES offers extended thermal range without functional or software changes, while PF8100A1ES delivers improved efficiency and richer telemetry but requires full hardware and firmware redesign.
Availability
MC32PF4210A1ESR2 is available at Aetrix Electronics and suitable for OTT STB, wireless audio, and voice recognition assistant applications requiring stable component supply across consumer product lifecycles.
Supply support for MC32PF4210A1ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with over 40 years of analog and mixed-signal IP expertise.
The PF4210 product line was designed specifically to address power architecture complexity in i.MX 8M-based multimedia edge devices, emphasizing configurability, low standby power, and DDR memory interface compliance.
FAQ
What is the operating temperature range for MC32PF4210A1ESR2?
The MC32PF4210A1ESR2 is rated for 0 °C to 85 °C ambient operation, making it suitable for consumer audio/video equipment such as OTT set-top boxes and smart speakers. This range aligns with the A1 OTP configuration variant and matches the MCIMX8M-EVK reference design requirements. Thermal protection activates at 130 °C junction temperature to safeguard against sustained overload conditions.
Does MC32PF4210A1ESR2 support DDR4 memory termination?
Yes, MC32PF4210A1ESR2 supports DDR4 termination through its VREFDDR output (0.6–0.9 V ±1.5%) and SW4's VTT tracking mode, which delivers 50% of SW3A's output voltage. This eliminates the need for external DDR termination ICs in i.MX 8M-based designs using LPDDR4 or DDR4 memory interfaces, reducing board area and component count.
How is the power-up sequence configured on MC32PF4210A1ESR2?
The MC32PF4210A1ESR2 uses on-chip one-time programmable (OTP) memory to store factory-configured startup sequences, including rail enable order, voltage levels, and timing delays. This eliminates runtime I²C initialization overhead and ensures deterministic boot behavior. Custom sequences can be programmed pre-deployment using NXP's programming tools and the A0 variant.
Can MC32PF4210A1ESR2 operate from a coin cell alone?
Yes, MC32PF4210A1ESR2 supports coin cell-only operation via the LICELL pin (1.8–3.3 V), powering the VSNVS domain at 1.5 mA for SNVS/SRTC retention. In this mode, quiescent current drops to 4.0 µA typical, enabling multi-year RTC backup. However, all switching regulators and LDOs except VSNVS remain disabled until VIN is applied.
What I²C address does MC32PF4210A1ESR2 use by default?
The MC32PF4210A1ESR2 defaults to I²C slave address 0x48 (7-bit), configurable via OTP to 0x4A or 0x4C to avoid bus conflicts in multi-PMIC systems. Address selection is fixed at power-on and cannot be changed dynamically; the SCL/SDA pins operate at 3.3 V logic levels with open-drain drive strength compliant with standard I²C fast-mode specifications.
MC32PF4210A1ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Audio, Video
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 4.5V
- Operating Temperature:
- 0°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MC32PF4210A1ESR2 FAQ
1.How can I place an order for MC32PF4210A1ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF4210A1ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF4210A1ESR2 reliable?
The price and inventory of MC32PF4210A1ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF4210A1ESR2 is usually 5 days.
3.What payment methods are accepted for MC32PF4210A1ESR2?
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4.How is shipping managed for MC32PF4210A1ESR2?
MC32PF4210A1ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF4210A1ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF4210A1ESR2?
For technical support, including MC32PF4210A1ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF4210A1ESR2 requirements.
6.How does Aetrix verify that MC32PF4210A1ESR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF4210A1ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF4210A1ESR2 meets industry standards.
7.What is the process for return or replacement of MC32PF4210A1ESR2?
All MC32PF4210A1ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF4210A1ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF4210A1ESR2 part is unused and in its original packaging.
Return procedure for MC32PF4210A1ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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