NXP Semiconductors MC32PF4210A3ES
- Part No.:
- MC32PF4210A3ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC32PF4210A3ES.pdf
- Description:
- PF4210
- Quantity:
- Payment:

- Shipping:

Inventory:3,112
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC32PF4210A3ES from NXP Semiconductors is a 14-channel programmable PMIC optimized for i.MX 8M-based audio/video systems, integrating six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–VGEN6), a 5.0 V boost regulator (SWBST), coin cell charger, and DDR reference (VREFDDR). It delivers up to 4.5 A on SW1A/B/C and supports dynamic voltage scaling, I²C configuration, and OTP-programmable power sequencing for OTT STBs and sound bars.
For engineers reviewing the MC32PF4210A3ES datasheet, MC32PF4210A3ES pinout, MC32PF4210A3ES application, or MC32PF4210A3ES equivalent, key selection criteria include its 56-pin QFN 8×8 mm wettable flank package, −40 °C to 85 °C operating range (consumer grade), preprogrammed A3 OTP configuration, and compatibility with i.MX 8M processor power architecture including DDR termination tracking and SNVS rail support.
Technical Context
The MC32PF4210A3ES implements a fully configurable multi-rail power architecture with independent control of six buck regulators-SW1A/B/C (0.3–1.875 V, up to 4.5 A combined), SW2 (0.4–3.3 V, 2.5 A), SW3A/B (0.4–3.3 V, 3.0 A combined), and SW4 (0.4–3.3 V, 1.0 A with DDR VTT tracking)-plus a 5.0–5.15 V/600 mA boost regulator for USB OTG. All switching regulators support PWM, PFM, and APS modes with programmable soft-start, current limit, and OCP fault interrupts.
Its control logic centers on an I²C interface (SDA/SCL, 3.6 V tolerant) with OTP memory defining startup sequence, timing, and voltage levels; dedicated signals include open-drain INTB (fault interrupt), SDWNB (imminent shutdown), RESETBMCU (processor reset), and STANDBY (mode control). The device integrates VSNVS (1.0–3.0 V, 1.5 mA) for always-on SNVS/SRTC supply, VREFDDR (0.6–0.9 V, 10 mA), and LICELL (coin cell charge/discharge) with thermal protection thresholds at 110–130 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.8 V to 4.5 V main supply (VIN); enables direct Li-ion/Li-poly battery or DC-DC pre-regulator interfacing without external level shifting |
| Buck Regulator Count | Up to six independent outputs (SW1A/B/C, SW2, SW3A/B, SW4); allows full system power delivery to i.MX 8M cores, DDR, GPU, and peripherals |
| Max Buck Output Current | 4.5 A on SW1A/B/C (combined single/dual-phase); supports high-current CPU core rails with thermal-aware phasing |
| Boost Output | 5.0 V to 5.15 V at 600 mA (SWBST); provides regulated USB OTG VBUS with OCP fault reporting |
| LDO Count & Capacity | Six programmable LDOs (VGEN1–VGEN6): 100–350 mA output; supplies low-noise analog/audio/IO rails with independent voltage setting |
| VREFDDR Accuracy | 0.6 V to 0.9 V, ±1% typical; ensures precise DDR4/LPDDR4 termination reference for signal integrity in memory subsystems |
| OTP Configuration | Preprogrammed A3 variant; defines fixed startup sequence, voltage levels, and timing-no runtime I²C reconfiguration required for production use |
| Thermal Protection | Four programmable thresholds (110/120/125/130 °C) with 2–4 °C hysteresis; triggers interrupt before shutdown to enable system-level thermal management |
Pinout & Package
MC32PF4210A3ES uses a 56-pin QFN 8×8 mm package with 0.5 mm pitch and wettable flank (WF-type) for enhanced solder joint inspection and reliability in automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1AIN / SW1BIN / SW1CIN | Buck input supply pins | Accept 4.8 V max input for SW1A/B/C regulators; require local 4.7 µF + 0.1 µF ceramic decoupling per pin |
| SW1ALX / SW1BLX / SW1CLX | Buck switch node outputs | High-frequency switching nodes for SW1A/B/C; connect directly to external inductors with minimal trace length |
| SW1FB / SW2FB / SW3AFB / SW3BFB / SW4FB / SWBSTFB | Voltage feedback inputs | Analog-sense points for closed-loop regulation; must be routed separately from power paths and terminated at output capacitors |
| VGEN1–VGEN6 | LDO output terminals | Provide 0.8–3.3 V programmable analog rails; each requires specified output capacitance (e.g., VGEN2: 4.7 µF) |
| INTB / SDWNB / RESETBMCU | Open-drain digital outputs | 3.6 V tolerant; drive processor interrupt/reset/shutdown signals with external pull-up; require no level translation |
| SDA / SCL / VDDIO | I²C interface | Support standard/fast-mode I²C (up to 400 kHz); VDDIO powers bus logic and sets voltage threshold for SDA/SCL |
| LICELL / VSNVS | Coin cell interface & always-on supply | LICELL accepts 1.8–3.3 V coin cell; VSNVS delivers 1.0–3.0 V at 1.5 mA for i.MX SNVS domain during main power loss |
| EP | Exposed thermal pad | Ground-connected thermal interface; must be tied to internal/external ground planes via multiple vias for RΘJB = 10 °C/W performance |
Key Features
| Feature | Design Value |
|---|---|
| Configurable buck topology | SW1 and SW3 support single/dual-phase or independent operation-enables flexible trade-off between current capacity (4.5 A) and rail count (6 outputs) |
| DDR termination tracking | SW4 operates in VTT mode, sourcing 50% of SW3A output voltage-eliminates need for external DDR termination IC in LPDDR4 designs |
| Low-quiescent standby mode | 297–450 µA consumption with all rails active except boost-extends battery life in always-on voice assistant and OTT STB standby states |
| OTP-defined startup sequence | A3-programmed configuration fixes voltage ramp order, timing delays, and enable/disable logic-ensures deterministic boot for i.MX 8M without host firmware dependency |
| Integrated coin cell management | LICELL pin handles charging, discharging, and switchover to VSNVS-maintains RTC and secure non-volatile state during main power interruption |
| Thermal fault interrupt granularity | Four independent thresholds (110/120/125/130 °C) with status bits in INTSENSE0 register-allows tiered thermal response (e.g., throttle CPU before shutdown) |
Applications
| OTT Streaming Media Box | Wireless Audio System |
|---|---|
|
Use Scenario: Powering i.MX 8M Nano/Mini SoC, LPDDR4 memory, HDMI PHY, and Wi-Fi/BT combo module in compact set-top box enclosure. IC Role / Device Role / Timing Role: Primary PMIC delivering 12 regulated rails-including core (SW1A/B/C), DDR (SW3A/B + VREFDDR), I/O (VGEN3/VGEN4), and OTG (SWBST)-with synchronized startup sequence. Use Value: Eliminates discrete DC-DC + LDO solution; reduces BOM count by >15 components while meeting tight thermal limits (<65 °C ambient) in fanless design. |
Use Scenario: Supplying dual-core Cortex-A53, audio codec, Class-D amplifier, and Bluetooth LE radio in portable speaker with 18650 battery. IC Role / Device Role / Timing Role: Central power hub managing battery-to-rail conversion, dynamic voltage scaling for CPU load states, and low-noise analog supply for DAC/ADC paths. Use Value: VGEN2 (250 mA, 0.8–1.55 V) powers sensitive audio circuitry with <10 µV ripple; SW4 VTT tracking ensures clean DDR interface for real-time audio buffering. |
| Voice Recognition Assistant | Sound Bar with HDMI ARC |
|
Use Scenario: Enabling always-listening wake word detection using i.MX 8M Plus NPU, microphone array, and far-field processing firmware. IC Role / Device Role / Timing Role: Provides SNVS domain power (VSNVS) from coin cell during deep sleep; wakes i.MX via PWRON upon voice trigger detection. Use Value: Coin cell backup sustains RTC and cryptographic keys for 5+ years; 4.0 µA coin cell mode current extends maintenance-free operation. |
Use Scenario: Supporting HDMI 2.0 ARC receiver, Dolby Atmos decoding, and multi-channel Class-D amplification in space-constrained sound bar. IC Role / Device Role / Timing Role: Delivers high-current rails (SW2 @ 2.5 A, SW3A/B @ 3.0 A) to GPU and audio DSP; VREFDDR ensures stable DDR4 interface for video frame buffering. Use Value: Integrated DDR termination eliminates external resistor network; reduces layout complexity and improves signal integrity on 4-layer PCB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF4210A3ES | Identical architecture and pinout; rated for −40 °C to 105 °C industrial temperature range vs. MC32PF4210A3ES's 0–85 °C consumer range | Required for extended-temperature deployments (e.g., automotive infotainment head units, industrial A/V encoders) | Select MC34PF4210A3ES when operating ambient exceeds 85 °C or when industrial-grade qualification (AEC-Q100 not claimed but temp-rated) is mandated |
| PF8100A0ES | Lower channel count (6 buck + 4 LDO); lacks DDR VTT tracking, coin cell charger, and VSNVS; supports i.MX 8M but with reduced peripheral coverage | Suitable for cost-sensitive, lower-complexity i.MX 8M designs without DDR memory or always-on RTC requirements | Choose PF8100A0ES only if system omits LPDDR4, coin cell backup, and SNVS functionality-otherwise MC32PF4210A3ES provides full feature parity |
Compared with MC34PF4210A3ES, the MC32PF4210A3ES offers identical functionality at lower cost and smaller thermal footprint for consumer-grade audio/video products, while PF8100A0ES sacrifices DDR termination, battery backup, and rail count to reduce BOM cost-making it unsuitable as a drop-in replacement.
Availability
MC32PF4210A3ES is available at Aetrix Electronics and suitable for OTT STB, wireless audio, and voice recognition assistant applications requiring stable component supply, preprogrammed power sequencing, and i.MX 8M ecosystem compatibility.
Supply support for MC32PF4210A3ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with over 30 years of power management IP development.
The PF4210 product line was engineered specifically to address the complex, multi-rail, low-noise, and thermally constrained power needs of NXP's i.MX 8M family of multimedia applications processors in cost-sensitive audio/video endpoints.
FAQ
What is the operating temperature range for MC32PF4210A3ES?
The MC32PF4210A3ES is rated for 0 °C to 85 °C ambient operation, making it suitable for consumer-grade audio/video equipment such as OTT STBs and sound bars. Its thermal protection activates at 110–130 °C junction temperature, and it features RΘJA = 28 °C/W (natural convection, 4-layer board) to maintain safe operation within this range. This specification is defined in Table 4 of the PF4210 datasheet Rev. 2.0.
Does MC32PF4210A3ES support DDR memory termination?
Yes, MC32PF4210A3ES supports DDR termination through its SW4 buck regulator operating in VTT tracking mode, which sources 50% of the SW3A output voltage as a precise DDR reference. It also integrates a dedicated VREFDDR LDO (0.6–0.9 V, ±1% typical accuracy) for DDR4/LPDDR4 memory interfaces. These features eliminate the need for external termination ICs in i.MX 8M-based designs.
How is the MC32PF4210A3ES configured for power sequencing?
The MC32PF4210A3ES uses factory-programmed OTP memory (A3 configuration) to define fixed startup voltage levels, timing delays, and enable/disable order-no runtime I²C programming is needed. This ensures deterministic, repeatable boot behavior for i.MX 8M processors. Sequence parameters are immutable post-shipment unless using nonprogrammed variants like MC32PF4210A0ES.
Can MC32PF4210A3ES operate from a coin cell battery?
Yes, MC32PF4210A3ES includes integrated coin cell management: the LICELL pin accepts 1.8–3.3 V coin cells and charges them from VIN, while VSNVS delivers 1.0–3.0 V at 1.5 mA to sustain i.MX 8M's SNVS domain. In coin cell mode, quiescent current drops to 4.0–7.0 µA, enabling multi-year RTC operation without main power.
What package type and pin count does MC32PF4210A3ES use?
MC32PF4210A3ES uses a 56-pin QFN package measuring 8 mm × 8 mm with 0.5 mm pitch and wettable flank (WF-type) construction. This package supports automated optical inspection (AOI) of solder joints and achieves RΘJB = 10 °C/W for effective thermal dissipation in compact audio/video enclosures.
MC32PF4210A3ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- Audio, Video
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 4.5V
- Operating Temperature:
- 0°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MC32PF4210A3ES FAQ
1.How can I place an order for MC32PF4210A3ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF4210A3ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF4210A3ES reliable?
The price and inventory of MC32PF4210A3ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF4210A3ES is usually 5 days.
3.What payment methods are accepted for MC32PF4210A3ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF4210A3ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF4210A3ES?
MC32PF4210A3ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF4210A3ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF4210A3ES?
For technical support, including MC32PF4210A3ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF4210A3ES requirements.
6.How does Aetrix verify that MC32PF4210A3ES is sourced from the original manufacturer or authorized distributors?
All MC32PF4210A3ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF4210A3ES meets industry standards.
7.What is the process for return or replacement of MC32PF4210A3ES?
All MC32PF4210A3ES units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF4210A3ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF4210A3ES part is unused and in its original packaging.
Return procedure for MC32PF4210A3ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC32PF4210A3ES Tags

-
TPS2511DGNR
Texas Instruments

-
UTC2000/MG
Microchip Technology

-
TUSB320HAIRWBR
Texas Instruments

-
TPS61252DSGR
Texas Instruments

-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments

-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments

-
STUSB1600AQTR
STMicroelectronics

-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments

-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

