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NXP Semiconductors MC32PF4210A3ESR2
- Part No.:
- MC32PF4210A3ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC32PF4210A3ESR2.pdf
- Description:
- PF4210
- Quantity:
- Payment:
- Shipping:
Inventory:2,803
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Product details
Overview
MC32PF4210A3ESR2 from NXP Semiconductors is a 14-channel programmable PMIC optimized for i.MX 8M-based audio/video systems, integrating six buck converters (including SW1A/B/C, SW2, SW3A/B, SW4), six LDOs (VGEN1–VGEN6), a 5.0 V boost regulator (SWBST), coin cell charger, and DDR reference (VREFDDR). It delivers precise power sequencing, dynamic voltage scaling, and OTP-configurable startup for OTT STBs and voice assistant devices.
For engineers reviewing the MC32PF4210A3ESR2 datasheet, MC32PF4210A3ESR2 pinout, MC32PF4210A3ESR2 application, or MC32PF4210A3ESR2 equivalent, key selection factors include its 56-pin QFN 8×8 mm wettable flank package, −40 °C to 85 °C industrial-grade temperature range, I²C programmability, and support for DDR termination tracking and coin-cell-backed SNVS supply.
Technical Context
The MC32PF4210A3ESR2 implements a fully integrated power architecture with configurable switching regulators: SW1A/B/C supports dual-phase or independent operation (0.3–1.875 V, up to 4.5 A combined); SW2 and SW3A/B deliver 2.5 A and 3.0 A respectively across 0.4–3.3 V; SW4 provides 1.0 A with optional DDR VTT tracking mode. All bucks support PWM/PPM/APS modes, programmable soft-start, OCP fault interrupt, and dynamic voltage scaling.
Control logic centers on an I²C interface with OTP memory for persistent configuration, complemented by dedicated hardware signals-PWRON (power-on trigger), STANDBY (mode control), RESETBMCU (processor reset/fault indicator), SDWNB (imminent shutdown alert), and INTB (general fault interrupt)-enabling tight coordination with i.MX 8M processors in low-power audio/video applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VIN = 2.8 V to 4.5 V - supports single-cell Li-ion or regulated 3.3 V/5 V system rails |
| Buck Regulator Count | Up to 6 independent outputs - enables full-system power delivery for i.MX 8M SoC, LPDDR4, peripherals, and display |
| Boost Output | SWBST = 5.0 V to 5.15 V, 600 mA - powers USB OTG or 5 V peripherals without external boost IC |
| LDO Count & Capacity | 6 programmable LDOs (VGEN1–VGEN6): 100–350 mA total - supplies audio codecs, sensors, GPIOs, and always-on logic |
| VREFDDR Accuracy | 0.6 V to 0.9 V, ±1 % - meets JEDEC DDR4/LPDDR4 reference voltage tolerance for stable memory interface |
| Thermal Protection | Four thresholds (110/120/125/130 °C) with 2–4 °C hysteresis - prevents thermal runaway during sustained high-load operation |
| Quiescent Current | Standby mode: 297–550 µA - enables multi-day battery backup for SNVS domain in voice assistant wake-up use cases |
Pinout & Package
MC32PF4210A3ESR2 uses a 56-pin QFN 8×8 mm package with 0.5 mm pitch and wettable flank (WF-type) for enhanced solder joint inspection and reliability in automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SW1AIN / SW1BIN / SW1CIN | Buck input supply pins | Accept main VIN (≤4.8 V); each requires ≥4.7 µF ceramic + 0.1 µF decoupling close to pin for stability |
| SW1ALX / SW1BLX / SW1CLX / SW2LX / SW3ALX / SW3BLX / SW4LX / SWBSTLX | Switch node outputs | Connect to external inductors; routing must minimize loop area to reduce EMI and switching losses |
| SW1FB / SW2FB / SW3AFB / SW3BFB / SW4FB / SWBSTFB | Voltage feedback inputs | Require Kelvin connection to output capacitors; routed separately from high-current paths to avoid noise coupling |
| VGEN1–VGEN6 | LDO outputs | Deliver 100–350 mA at user-programmable voltages (e.g., VGEN2 = 0.8–1.55 V, 250 mA for core logic) |
| VREFDDR / VINREFDDR / VHALF | DDR reference circuitry | VREFDDR = 0.6–0.9 V output; VINREFDDR and VHALF enable precision DDR termination tracking |
| PWRON / STANDBY / RESETBMCU / SDWNB / INTB | Processor interface signals | Open-drain digital I/O (≤3.6 V) for power sequencing, fault reporting, and system state coordination |
| SCL / SDA / VDDIO | I²C interface | Supports standard/fast-mode I²C (≤400 kHz); VDDIO powers bus logic independently of core supply |
| LICELL / VSNVS | Coin-cell interface | LICELL accepts 1.8–3.3 V coin cell; VSNVS outputs 1.0–3.0 V at 1.0/1.5 mA for i.MX 8M SNVS domain backup |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable startup sequence | One-time programmable memory stores voltage order, timing delays, and rail enable states-eliminates external configuration EEPROM |
| Configurable buck topology | SW1 and SW3 support single/dual-phase or independent operation-enables trade-off between current capacity (4.5 A) and rail count (6 outputs) |
| DDR VTT tracking mode | SW4 dynamically tracks 50 % of SW3A output-provides accurate, low-noise termination for LPDDR4 interfaces without discrete resistors |
| Multi-mode buck regulation | PWM, PFM, and APS modes per regulator-optimizes efficiency across load range (e.g., PFM at light loads, PWM at full load) |
| Integrated coin cell charger | Charges 1.8–3.3 V coin cells while maintaining VSNVS supply-ensures reliable RTC and secure boot during main power loss |
| Thermal fault interrupts | Four independent THERMxxxI alerts (110/120/125/130 °C) with debounced shutdown-enables firmware-controlled thermal management before catastrophic failure |
Applications
| OTT Streaming Box | Voice Recognition Assistant |
|---|---|
Use Scenario: Compact set-top box delivering 4K video decoding, HDMI output, and Wi-Fi connectivity under strict thermal and size constraints. IC Role / Device Role / Timing Role: Primary PMIC supplying i.MX 8M Nano processor cores (SW1A/B/C), DDR4 memory (SW3A/B, VREFDDR), GPU (SW2), and USB peripherals (SWBST). Use Value: Single-chip solution reduces BOM count by 7+ discrete regulators; OTP sequencing ensures deterministic boot timing for fast channel change. |
Use Scenario: Always-listening smart speaker requiring ultra-low standby current and instant wake-from-sleep response. IC Role / Device Role / Timing Role: Powers i.MX 8M Mini's SNVS domain via VSNVS (1.0 V, 1.0 mA), maintains RTC and secure boot keys during main power loss using LICELL. Use Value: 297 µA standby current extends battery backup life; PWRON/STANDBY hardware handshaking enables sub-100 ms wake latency. |
| Sound Bar System | A/V Receiver |
Use Scenario: Multi-channel audio amplifier with DSP, Bluetooth, and HDMI ARC, needing clean, isolated analog and digital supplies. IC Role / Device Role / Timing Role: Delivers low-noise analog rails (VGEN2 = 1.2 V @ 250 mA for DSP core) and digital supplies (VGEN4 = 3.3 V @ 350 mA for audio codec) with independent sequencing. Use Value: Six independent LDOs eliminate cross-talk between audio stages; VREFDDR ensures stable DDR interface for real-time audio buffering. |
Use Scenario: High-end home theater receiver supporting 8K passthrough, Dolby Atmos decoding, and multiple HDMI inputs. IC Role / Device Role / Timing Role: Manages complex power tree: processor cores (SW1A/B/C), memory (SW3A/B + VREFDDR), HDMI PHY (SW4 + SWBST), and auxiliary logic (VGEN1–VGEN6). Use Value: Configurable SW1/SW3 phasing reduces input ripple; I²C runtime reconfiguration allows firmware updates to voltage profiles without hardware change. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC34PF4210A3ES | Same silicon, −40 °C to 105 °C extended temperature grade; identical pinout, OTP map, and electrical specs | Required for industrial A/V receivers operating in uncontrolled ambient environments | Select MC34PF4210A3ES when board-level operating temperature exceeds 85 °C |
| PF8100A0ES | Lower channel count (8-channel), no coin cell charger or VREFDDR; supports i.MX 8M but lacks DDR termination tracking | Suitable for cost-sensitive wireless audio products without DDR memory or long-term RTC backup | Choose PF8100A0ES only if VREFDDR, LICELL, and 6-buck capability are not required |
Compared with MC32PF4210A3ESR2, MC34PF4210A3ES offers wider thermal margin without design changes, while PF8100A0ES reduces complexity and cost at the expense of DDR support and battery backup-making MC32PF4210A3ESR2 optimal for feature-complete i.MX 8M audio/video platforms.
Availability
MC32PF4210A3ESR2 is available at Aetrix Electronics and suitable for OTT STBs, voice recognition assistants, and sound bar systems requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.
Supply support for MC32PF4210A3ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with deep expertise in ARM-based application processors and power management.
The PF4210 product line was designed specifically to power NXP's i.MX 8M family of multimedia processors, delivering tightly integrated, OTP-configurable power delivery for cost-sensitive, high-performance audio/video edge devices.
FAQ
What is the operating temperature range for MC32PF4210A3ESR2?
MC32PF4210A3ESR2 is rated for an ambient operating temperature range of 0 °C to 85 °C, making it suitable for consumer-grade audio/video equipment such as OTT streaming boxes and sound bars. This specification is defined in Table 4 of the PF4210 datasheet Rev. 2.0 and applies specifically to the MC32 prefix variant, distinguishing it from the industrial-grade MC34PF4210 series.
Does MC32PF4210A3ESR2 support DDR memory termination?
Yes, MC32PF4210A3ESR2 supports DDR termination through its SW4 buck regulator operating in VTT tracking mode, where SW4 output equals 50 % of SW3A voltage. It also integrates a dedicated VREFDDR LDO (0.6–0.9 V, ±1 %) with VINREFDDR and VHALF inputs to meet JEDEC DDR4/LPDDR4 reference requirements-both features are confirmed in Section 9.3.1 and Table 6 of the datasheet.
How is the startup sequence configured on MC32PF4210A3ESR2?
The startup sequence of MC32PF4210A3ESR2 is stored in on-chip one-time programmable (OTP) memory and can be preconfigured at manufacturing or customized using the Try-Before-Buy (TBB) feature via I²C. Voltage order, timing delays, and rail enable states are all programmable-details are specified in Section 10.1 "Startup" and Table 8 of the PF4210 datasheet Rev. 2.0.
Can MC32PF4210A3ESR2 operate without a coin cell battery?
Yes, MC32PF4210A3ESR2 can operate without a coin cell: VSNVS may be powered from VIN instead. However, a coin cell (1.8–3.3 V) is required to maintain SNVS domain functionality-including RTC and secure boot-during main power loss. The integrated LICELL charger enables automatic top-up when VIN is present, as documented in Section 9.3.1 and Figure 4 of the datasheet.
What package type and pin count does MC32PF4210A3ESR2 use?
MC32PF4210A3ESR2 uses a 56-pin QFN package measuring 8 mm × 8 mm with 0.5 mm pitch and wettable flank (WF-type) construction. This package is explicitly listed in Table 1 of the PF4210 datasheet Rev. 2.0 for all A3 variants and supports automated optical inspection of solder joints due to its exposed flank geometry.
MC32PF4210A3ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Audio, Video
- Current - Supply:
- -
- Voltage - Supply:
- 2.8V ~ 4.5V
- Operating Temperature:
- 0°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-QFN-EP (8x8)
MC32PF4210A3ESR2 FAQ
1.How can I place an order for MC32PF4210A3ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC32PF4210A3ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC32PF4210A3ESR2 reliable?
The price and inventory of MC32PF4210A3ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC32PF4210A3ESR2 is usually 5 days.
3.What payment methods are accepted for MC32PF4210A3ESR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC32PF4210A3ESR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC32PF4210A3ESR2?
MC32PF4210A3ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC32PF4210A3ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC32PF4210A3ESR2?
For technical support, including MC32PF4210A3ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC32PF4210A3ESR2 requirements.
6.How does Aetrix verify that MC32PF4210A3ESR2 is sourced from the original manufacturer or authorized distributors?
All MC32PF4210A3ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC32PF4210A3ESR2 meets industry standards.
7.What is the process for return or replacement of MC32PF4210A3ESR2?
All MC32PF4210A3ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC32PF4210A3ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC32PF4210A3ESR2 part is unused and in its original packaging.
Return procedure for MC32PF4210A3ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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