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NXP Semiconductors MC33910BACR2
- Part No.:
- MC33910BACR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 32-LQFP
- Datasheet:
-
MC33910BACR2.pdf
- Description:
- IC SYSTEM BASIS CHIP 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,561
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Product details
Overview
MC33910BACR2 from NXP Semiconductors is a LIN System Basis Chip (SBC) integrating a LIN 2.0/2.1 transceiver, dual 50 mA/60 mA high-side drivers, 5.0 V low-dropout regulator (60 mA), configurable window watchdog, and high-voltage analog/logic input (L1) with selectable divider for contact monitoring or wake-up in automotive body electronics.
For engineers reviewing the MC33910BACR2 datasheet, MC33910BACR2 pinout, MC33910BACR2 application, or MC33910BACR2 equivalent, this device supports SPI-controlled diagnostics, LIN bus wake-up, cyclic sense, and Stop/Sleep/Normal mode sequencing - critical for robust, low-power automotive subsystems requiring integrated power, communication, and protection.
Technical Context
The MC33910BACR2 implements a fully SPI-managed SBC architecture with independent control of two high-side switches (HS1/HS2), real-time fault reporting via SPI registers, and LIN physical layer compliance to SAE J2602-2. Its L1 pin serves dual digital wake-up and analog-sensed input roles via internal multiplexer and programmable divider ratio (1:1 or 1:3.6).
It features three distinct operating modes: Normal (full functionality), Sleep (VDD off, wake-up via LIN/L1/cyclic sense), and Stop (VDD on at reduced current, wake-up via CS/LIN/L1). The 5.0 V regulator includes LVR, overtemperature prewarning (90–140 °C), and shutdown (150–190 °C) with hysteresis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| LIN Compliance | LIN 2.0, 2.1, and SAE J2602-2 compliant; supports up to 100 kbps with configurable waveshaping. |
| High-side Outputs | Two 50 mA/60 mA rated HS drivers (HS1/HS2); RDS(on) ≤ 7.0 Ω @ 25 °C; short-circuit and open-load detection enabled. |
| VDD Regulator | 5.0 V ±5% output (4.75–5.25 V), 60 mA continuous, dropout ≤ 250 mV @ 50 mA; line/load regulation ≤ 25/80 mV. |
| SPI Interface | Full-duplex, up to 4.0 MHz; supports CS-driven mode entry/exit, diagnostic register reads, and configuration writes. |
| Operating Temp | -40 °C to +125 °C ambient; junction temperature range -40 °C to +150 °C with thermal shutdown at 150–190 °C. |
| Package | 32-pin LQFP (7 mm × 7 mm, 0.8 mm pitch), Pb-free (AC suffix), RoHS-compliant. |
| Supply Range | VS1/VS2: 5.5–27 V DC nominal; withstands load dump up to 40 V; reverse battery protected on VSENSE. |
Pinout & Package
MC33910BACR2 is housed in a 32-pin LQFP package (7 mm × 7 mm, 0.8 mm pitch) with exposed thermal pad. Pin 1 is marked by dot; pins 11, 15–17, 19–22, and 28 are NC (not connected) and must remain unconnected or grounded per datasheet guidance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RXD / TXD | LIN Bus Interface | RXD reports bus voltage state to MCU; TXD controls LIN driver output; both support J2602-compliant thresholds and deglitching. |
| MISO / MOSI / SCLK / CS | SPI Interface | Full-duplex 4-wire SPI (CS active-low); MISO tri-states when CS high; timing supports up to 4.0 MHz operation. |
| HS1 / HS2 | High-side Switch Outputs | Drive resistive/inductive loads up to 60 mA; include current limiting, short-circuit detection, and thermal shutdown. |
| L1 | Wake-up / Analog Input | Digital wake-up input (33 kΩ series resistor required); also routed to analog multiplexer with selectable 1:1 or 1:3.6 division for voltage sensing. |
| VDD / HVDD | Regulated Outputs | VDD = main 5.0 V supply (60 mA); HVDD = switchable 5.0 V Hall sensor supply (35 mA typical), both with fault reporting. |
| VSENSE | Battery Voltage Sense | Direct connection to battery line (self-protected vs. reverse polarity); internal 5.25× divider feeds ADOUT0 for MCU ADC reading. |
| WDCONF | Watchdog Config | External resistor sets window watchdog period (8.5–205 ms); open pin disables watchdog; accuracy ±15% excluding resistor tolerance. |
| IRQ / RST | System Control | IRQ is active-low interrupt for wake-up/events; RST is bidirectional reset I/O, driven low during internal reset assertion. |
Key Features
| Feature | Design Value |
|---|---|
| LIN Transceiver with J2602 Support | Enables robust automotive network interoperability with programmable waveshaping, ±100 V transient immunity, and ISO7637-2 pulse 3b immunity. |
| Dual High-side Drivers with Diagnostics | Each HSx provides current limiting, open-load detection, short-circuit flagging, and thermal shutdown-enabling safe, self-monitoring load control. |
| Configurable Window Watchdog | Externally resistor-programmable timeout (8.5–205 ms) with deglitch filtering; prevents firmware lockup without requiring MCU intervention. |
| Multi-mode Power Management | Three distinct states: Normal (full function), Stop (VDD on, ~62 µA @ 13.5 V), Sleep (VDD off, ~33 µA); supports cyclic sense and forced wake-up. |
| Integrated Analog Sensing Path | L1 and VSENSE inputs feed shared analog multiplexer; L1 offers 1:1 or 1:3.6 division; VSENSE uses fixed 5.25× division-both output to ADOUT0 for MCU ADC. |
Applications
| Window Lift Control | Mirror Adjustment |
|---|---|
Use Scenario: Motorized window lift module requiring LIN command interface, local power regulation, and motor driver protection. IC Role / Device Role / Timing Role: MC33910BACR2 acts as system basis chip-providing LIN transceiver, 5.0 V MCU supply, dual HS drivers for H-bridge control, and wake-up via door switch (L1). Use Value: Eliminates discrete regulators, transceivers, and high-side drivers; reduces BOM count and PCB area while enabling SPI-accessible diagnostics for stall detection and thermal management. |
Use Scenario: Compact side-view mirror actuation system with position feedback, LIN-based ECU coordination, and low quiescent current in vehicle sleep mode. IC Role / Device Role / Timing Role: MC33910BACR2 supplies regulated 5.0 V to mirror MCU and sensors, drives mirror fold/unfold motors via HS1/HS2, and wakes from Sleep mode on LIN message or L1 contact closure. Use Value: Achieves <35 µA sleep current; integrates LIN physical layer with J2602 conformance and built-in ESD protection (±6 kV on LIN), reducing external protection components. |
| Door Lock Actuation | Sunroof Motor Control |
Use Scenario: Centralized door lock module with solenoid drivers, battery voltage monitoring, and LIN-based security handshake. IC Role / Device Role / Timing Role: MC33910BACR2 delivers 5.0 V to lock controller MCU, powers solenoids via HS1/HS2, monitors battery via VSENSE, and signals faults over LIN using SPI-read diagnostics. Use Value: Enables real-time VBAT monitoring (±2% accuracy via 5.25× divider), open-load detection on solenoids, and LIN bus wake-up-improving system responsiveness and fault coverage. |
Use Scenario: Sunroof control unit needing bidirectional motor drive, anti-pinch logic, and seamless integration into vehicle LIN backbone. IC Role / Device Role / Timing Role: MC33910BACR2 provides isolated 5.0 V supply (HVDD for Hall sensors), drives sunroof motor via HS1/HS2 with PWMIN support, and reports overtemperature events via IRQ. Use Value: Supports PWM-controlled motor speed; integrates overtemperature prewarning (90–140 °C) and shutdown (150–190 °C); eliminates need for external thermal sensors or discrete regulators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LIN system basis chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33912BACR2 | Same pinout and core functionality; adds enhanced ESD (±8 kV HBM) and improved EMC immunity per updated AEC-Q100 test plan. | Preferred for new designs targeting higher reliability in harsh EMC environments (e.g., premium vehicle platforms). | Select MC33912BACR2 if J2602 conformance, ±8 kV HBM, and lower radiated emissions are design-critical; otherwise MC33910BACR2 remains fully qualified. |
| TLIN1029DR | Standalone LIN transceiver only (no regulators, no HS drivers); 5 V supply required externally; supports 20 kbps–200 kbps. | Requires external 5 V LDO, high-side switches, and watchdog circuitry-increasing BOM and layout complexity. | Choose TLIN1029DR only when modular architecture is mandated or when existing power/control ICs already fulfill SBC functions. |
Compared with MC33910BACR2, MC33912BACR2 offers upgraded ESD and EMC performance without layout changes, while TLIN1029DR shifts system integration burden to external components-making MC33910BACR2 optimal for cost-sensitive, space-constrained automotive body modules requiring full SBC integration.
Availability
MC33910BACR2 is available at Aetrix Electronics and suitable for window lift, mirror adjustment, door lock, and sunroof control systems requiring stable component supply, AEC-Q100 qualification, and long-term automotive lifecycle support.
Supply support for MC33910BACR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive-grade mixed-signal ICs.
The MC33910BACR2 belongs to NXP's SMARTMOS System Basis Chip family, designed specifically for automotive body electronics to consolidate LIN communication, power regulation, high-side driving, and diagnostics into a single AEC-Q100 qualified device.
FAQ
What is the maximum LIN data rate supported by the MC33910BACR2?
The MC33910BACR2 supports LIN data rates up to 100 kbps with waveshaping enabled. When waveshaping is disabled via SPI register, higher rates are achievable-though official specification guarantees only up to 100 kbps under LIN 2.0/2.1 and SAE J2602-2 conformance testing conditions. The MC33910BACR2's physical layer meets all timing and voltage threshold requirements for reliable operation across automotive temperature and supply ranges.
Does the MC33910BACR2 support both Normal and Sleep modes simultaneously?
No-the MC33910BACR2 operates in one primary mode at a time: Normal (all functions active), Sleep (VDD off, wake-up via LIN/L1/cyclic sense), or Stop (VDD on with limited current, wake-up via CS/LIN/L1). Mode transitions are controlled via SPI commands or hardware events; it does not maintain concurrent functionality across modes. The MC33910BACR2's mode sequencing ensures deterministic power-state behavior essential for automotive ECU compliance.
How is the L1 pin used for analog sensing in the MC33910BACR2?
The L1 pin on the MC33910BACR2 serves dual purpose: as a digital wake-up input (with 33 kΩ series resistor) and as an analog input routed to the internal analog multiplexer. Its voltage is divided by a selectable ratio-1:1 or 1:3.6-via SPI-configurable L1DS bit, and output to ADOUT0 for MCU ADC sampling. This enables direct battery-switch or contact monitoring without external signal conditioning. The MC33910BACR2 specifies matching error ≤ ±4% between L1 channels when used differentially.
What external components are mandatory for stable operation of the MC33910BACR2?
Four external components are mandatory: (1) ≥2.0 µF ceramic capacitor (ESR < 10 Ω) on VDD, (2) ≥1.0 µF capacitor (ESR < 5 Ω) on HVDD, (3) 33 kΩ series resistor on L1 for digital wake-up, and (4) 10 kΩ series resistor on VSENSE for transient protection. Additional optional components include LIN bus pull-up resistor (20–60 kΩ) and external watchdog resistor on WDCONF. These ensure regulator stability, ESD robustness, and accurate analog sensing in the MC33910BACR2.
Is the MC33910BACR2 pin-compatible with the MC33912BACR2?
Yes-the MC33910BACR2 and MC33912BACR2 share identical 32-pin LQFP package, pinout, and core functional mapping. The MC33912BACR2 is a direct enhancement with improved ESD (±8 kV HBM vs. ±6 kV), tighter EMC emission limits, and updated J2602 conformance testing-but requires no PCB or firmware changes for drop-in replacement. Both devices use the same SPI register set and initialization sequence, making migration straightforward for the MC33910BACR2.
MC33910BACR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 4.5mA
- Voltage - Supply:
- 5.5V ~ 27V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-LQFP (7x7)
MC33910BACR2 FAQ
1.How can I place an order for MC33910BACR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33910BACR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33910BACR2 reliable?
The price and inventory of MC33910BACR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33910BACR2 is usually 5 days.
3.What payment methods are accepted for MC33910BACR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33910BACR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33910BACR2?
MC33910BACR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33910BACR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33910BACR2?
For technical support, including MC33910BACR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33910BACR2 requirements.
6.How does Aetrix verify that MC33910BACR2 is sourced from the original manufacturer or authorized distributors?
All MC33910BACR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33910BACR2 meets industry standards.
7.What is the process for return or replacement of MC33910BACR2?
All MC33910BACR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33910BACR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33910BACR2 part is unused and in its original packaging.
Return procedure for MC33910BACR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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