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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

NXP Semiconductors MC33910G5ACR2

Name: MC33910G5ACR2
Brand: NXP Semiconductors
SKU: MC33910G5ACR2
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MC33910G5ACR2

Manufacturer:: NXP Semiconductors

Category:: Power Management - Specialized

Package:: 32-LQFP

Datasheet:: MC33910G5ACR2.pdf

Description:: IC SYSTEM BASIS CHIP 32LQFP

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Product details

Overview

MC33910G5ACR2 from NXP Semiconductors is a LIN System Basis Chip (SBC) integrating a LIN 2.0/2.1 transceiver, dual 60 mA high-side drivers, 5.0 V/50 mA LDO regulator, configurable window watchdog, and high-voltage analog input for contact monitoring - designed for automotive body electronics control in 12 V systems.

For engineers reviewing the MC33910G5ACR2 datasheet, MC33910G5ACR2 pinout, MC33910G5ACR2 application, or MC33910G5ACR2 equivalent, key selection criteria include LIN conformance to SAE J2602-2, ESD robustness (±6.0 kV on LIN), thermal shutdown at 150 °C, and support for cyclic wake-up sensing in Stop/Sleep modes.

Technical Context

The MC33910G5ACR2 implements a SPI-controlled architecture with three operating modes: Normal (full functionality), Sleep (VDD off, wake-up via LIN/L1/cyclic sense), and Stop (VDD on, low-current, multi-source wake-up). Its LIN physical layer supports up to 100 kbps with selectable waveshaping and meets ISO 17987-4 and SAE J2602-2 conformance requirements.

Internal diagnostics include full SPI-readable status registers for overtemperature prewarning (90–140 °C), HSx open-load/short-circuit detection, battery voltage sensing (VSENSE), and analog multiplexing of L1 input with selectable divider ratios (1:1 or 1:3.6). The device uses external REXT (20–200 kΩ) to configure watchdog timeout from 8.5 ms to 205 ms.

Key Specifications

Parameter	Value and Actual Design Meaning
LIN Compliance	SAE J2602-2, LIN 2.0/2.1; supports 100 kbps with programmable waveshaping
High-side Outputs	HS1/HS2: 60 mA current limit, R_DS(on) ≤ 7.0 Ω @ 25 °C; short-circuit & open-load detection
VDD Regulator	5.0 V ±2.5%, 60 mA output; dropout ≤ 250 mV @ 50 mA; line/load regulation ≤ 25/80 mV
Operating Temp	-40 °C to +125 °C ambient; junction shutdown at 150 °C with 13 °C hysteresis
SPI Interface	Full-duplex up to 4.0 MHz; CS-active timing validated to 4.0 μs minimum CS pulse width
ESD Robustness	±6.0 kV HBM on LIN pin per IEC 61000-4-2 (150 pF/330 Ω); ±8.0 kV on other pins
Wake-up Inputs	L1 digital/analog input (33 kΩ series resistor required); LIN bus wake-up threshold 5.3–5.8 V

Pinout & Package

MC33910G5ACR2 is housed in a 32-pin LQFP package (7 mm × 7 mm, 0.8 mm pitch) with exposed thermal pad. Pin functions are electrically isolated across AGND, LGND, and PGND domains; NC pins (11, 15–17, 19–22, 28, 30) must remain unconnected or grounded per datasheet guidance.

Pin/Terminal	Circuit Role	Design Meaning
1 RXD	LIN Receiver Output	Reports LIN bus voltage state to MCU; active-low logic referenced to VDD
2 TXD	LIN Transmitter Input	Controls LIN driver output; requires pull-up for recessive state
3 MISO	SPI Data Output	Tri-state when CS high; drives SPI master with 40 ns rise/fall time (CL = 220 pF)
4 MOSI	SPI Data Input	Accepts SPI commands with 40 ns setup/hold relative to SCLK falling edge
5 SCLK	SPI Clock Input	Supports up to 4.0 MHz; min high/low time 110 ns
6 CS	SPI Chip Select	Active-low enable; wake-up source in Stop mode; min pulse width 4.0 μs
7 ADOUT0	Analog Multiplexer Output	Delivers scaled L1 or VSENSE voltage; max output swing 0.0–VDD–0.35 V
8 PWMIN	PWM Control Input	Enables PWM modulation of HS1/HS2; VIH ≥ 0.7×VDD, pull-up 10–30 µA
9 LIN	LIN Bus Interface	Single-wire bidirectional transceiver; ±100 V transient immunity per ISO 7637-2
10 LGND	LIN Ground Reference	Internally tied to PGND; separates LIN noise from power ground
12 WDCONF	Watchdog Configuration	External resistor (20–200 kΩ) sets timeout; open = 110 ms default
13 IRQ	Interrupt Output	Active-low wake-up indicator; asserts on Stop→Normal transition or fault events
14 NC	No Connect	Must not be connected; floating or grounded per layout guidelines
18 PGND	Power Ground	Main return path for HS drivers and VS1/VS2 supplies; internal tie to LGND
23 L1	Wake-up / Analog Input	Digital wake-up (2.0–4.0 V thresholds) or analog-sensed via ADOUT0 with 1:1 or 1:3.6 ratio
24 HS2	High-side Switch 2	60 mA load switch; R_DS(on) ≤ 7.0 Ω @ 25 °C; thermal shutdown at 140–180 °C
25 HS1	High-side Switch 1	Identical to HS2; independent SPI control and fault reporting
26 VS2	HS Driver Supply	Connects to battery via reverse-battery protection diode; powers HS1/HS2 only
27 VS1	Main Power Supply	Battery input for regulator, LIN, SPI, and logic blocks; supports 5.5–27 V operation
29 VSENSE	Battery Voltage Sense	Direct connection to battery line; internal 5.25× divider; ±27 V tolerant
30 HVDD	Hall Sensor Supply	Switched 5.0 V output; 35 mA typical limit; requires 1–10 µF capacitor (ESR 0.1–5 Ω)
31 VDD	Main Regulator Output	5.0 V system supply; 110 mA typical current limit; requires 2–100 µF capacitor (ESR 0.1–10 Ω)
32 AGND	Analog Ground	Reference for ADOUT0, VSENSE, temperature sensor; separate from PGND/LGND

Key Features

Feature	Design Value
LIN Conformance	Fully compliant with SAE J2602-2 and LIN 2.0/2.1; includes J2602 deglitcher (50 µs) and ±100 V transient immunity
Dual High-side Drivers	Independent HS1/HS2 with real-time open-load (5–7.5 mA) and short-circuit (VSUP−2 V) detection reported via SPI
Configurable Watchdog	Window watchdog with externally adjustable timeout (8.5–205 ms) and deglitch filtering (480 ns typical)
Multi-domain Grounding	Separate AGND, LGND, and PGND pins prevent noise coupling between analog, LIN, and power circuits
Integrated Diagnostics	SPI-accessible registers report VDD undervoltage (5.55–6.6 V), overvoltage (18–20.5 V), and junction temperature prewarning (90–140 °C)
Automotive-Grade Protection	Reverse-battery protected inputs; ±6 kV LIN ESD; load-dump tolerance to 40 V; cyclic sense for ultra-low-power wake-up

Applications

Window Lift Control	Mirror Adjustment
Use Scenario: Bidirectional motor control for power windows with anti-pinch detection and position feedback. IC Role / Device Role / Timing Role: MC33910G5ACR2 provides LIN interface to body controller, drives window motor via HS1/HS2, monitors battery voltage (VSENSE), and enables wake-on-LIN for ignition-off operation. Use Value: Eliminates need for discrete LIN transceiver and high-side switches; reduces BOM count by 4+ components while meeting ISO 16750-2 pulse test requirements.	Use Scenario: Motorized mirror folding/unfolding and tilt adjustment in response to door lock/unlock commands. IC Role / Device Role / Timing Role: MC33910G5ACR2 receives LIN commands, drives mirror motors via HS1/HS2, senses contact closure (L1), and reports faults (HSxOP/HSxCL flags) over SPI. Use Value: Enables single-chip solution for Class A mirror modules; supports cyclic wake-up sensing to maintain <100 µA sleep current during vehicle standby.
Door Lock Actuation	Sunroof Control
Use Scenario: Solenoid-based central locking with feedback confirmation and tamper detection. IC Role / Device Role / Timing Role: MC33910G5ACR2 interfaces to LIN network, energizes lock/unlock solenoids via HS1/HS2, monitors L1 for door ajar switch, and detects open-load faults. Use Value: Integrates solenoid drive, LIN communication, and diagnostic reporting - reducing PCB area by >30% versus discrete solutions.	Use Scenario: Bidirectional sunroof motor control with obstacle detection and auto-reverse logic. IC Role / Device Role / Timing Role: MC33910G5ACR2 executes LIN commands, drives sunroof motor using PWMIN-modulated HS outputs, senses battery voltage (VSENSE), and triggers overtemperature shutdown if motor stalls. Use Value: Provides real-time thermal protection (140–180 °C HS shutdown) and eliminates need for external current-sense resistors.

Window Lift Control

Mirror Adjustment

Use Scenario: Bidirectional motor control for power windows with anti-pinch detection and position feedback.

IC Role / Device Role / Timing Role: MC33910G5ACR2 provides LIN interface to body controller, drives window motor via HS1/HS2, monitors battery voltage (VSENSE), and enables wake-on-LIN for ignition-off operation.

Use Value: Eliminates need for discrete LIN transceiver and high-side switches; reduces BOM count by 4+ components while meeting ISO 16750-2 pulse test requirements.

Use Scenario: Motorized mirror folding/unfolding and tilt adjustment in response to door lock/unlock commands.

IC Role / Device Role / Timing Role: MC33910G5ACR2 receives LIN commands, drives mirror motors via HS1/HS2, senses contact closure (L1), and reports faults (HSxOP/HSxCL flags) over SPI.

Use Value: Enables single-chip solution for Class A mirror modules; supports cyclic wake-up sensing to maintain <100 µA sleep current during vehicle standby.

Door Lock Actuation

Sunroof Control

Use Scenario: Solenoid-based central locking with feedback confirmation and tamper detection.

IC Role / Device Role / Timing Role: MC33910G5ACR2 interfaces to LIN network, energizes lock/unlock solenoids via HS1/HS2, monitors L1 for door ajar switch, and detects open-load faults.

Use Value: Integrates solenoid drive, LIN communication, and diagnostic reporting - reducing PCB area by >30% versus discrete solutions.

Use Scenario: Bidirectional sunroof motor control with obstacle detection and auto-reverse logic.

IC Role / Device Role / Timing Role: MC33910G5ACR2 executes LIN commands, drives sunroof motor using PWMIN-modulated HS outputs, senses battery voltage (VSENSE), and triggers overtemperature shutdown if motor stalls.

Use Value: Provides real-time thermal protection (140–180 °C HS shutdown) and eliminates need for external current-sense resistors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LIN SBC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MC33912G5ACR2	Includes integrated 3.3 V LDO (vs. 5.0 V only in MC33910G5ACR2); adds CAN transceiver; same pinout but different SPI register map	Required where 3.3 V MCU core supply or CAN bus coexistence is needed; not drop-in for pure LIN-only designs	Select MC33912G5ACR2 only when dual-bus (LIN+CAN) or mixed-voltage (3.3 V/5.0 V) support is mandatory
TLIN1029DR	Dedicated LIN transceiver (no regulators, no HS drivers); supports 20 kbps–200 kbps; smaller 8-pin SOIC package	Used with external MCU and discrete high-side switches; lacks integrated diagnostics and power management	Choose TLIN1029DR for cost-sensitive, space-constrained LIN nodes without power delivery needs

Compared with MC33912G5ACR2 and TLIN1029DR, the MC33910G5ACR2 uniquely combines LIN 2.1 compliance, dual 60 mA high-side drivers, and 5.0 V regulation in a single 32-pin LQFP - making it optimal for self-contained body-control modules requiring minimal external components and full diagnostic visibility.

Availability

MC33910G5ACR2 is available at Aetrix Electronics and suitable for automotive window lift, mirror adjustment, door lock, and sunroof control applications requiring stable component supply across extended temperature ranges and rigorous EMC environments.

Supply support for MC33910G5ACR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communication infrastructure solutions, with deep expertise in automotive-grade mixed-signal ICs.

The MC33910G5ACR2 belongs to NXP's SMARTMOS System Basis Chip family, engineered specifically for automotive body electronics to consolidate LIN communication, power switching, and system supervision into one AEC-Q100 qualified device.

FAQ

What LIN protocol versions does the MC33910G5ACR2 support?

The MC33910G5ACR2 supports LIN Protocol Specification 2.0 and 2.1, and is fully compliant with SAE J2602-2 conformance testing. It operates at data rates up to 100 kbps with configurable waveshaping, and includes J2602-specific deglitching (50 µs) and undervoltage detection (5.0–6.0 V thresholds).

Does the MC33910G5ACR2 integrate high-side drivers, and what are their current limits?

Yes, the MC33910G5ACR2 integrates two independent high-side drivers (HS1 and HS2) with a guaranteed current limit of 60 mA each. At 25 °C, R_DS(on) is ≤ 7.0 Ω; thermal shutdown activates at 140–180 °C. Each driver supports open-load detection (5–7.5 mA) and short-circuit flagging via SPI-accessible status registers.

How is watchdog timeout configured on the MC33910G5ACR2?

Watchdog timeout on the MC33910G5ACR2 is set using an external resistor on the WDCONF pin: t_PWD [ms] = [0.466 × (R_EXT − 20)] + 10, where R_EXT ranges from 20 kΩ to 200 kΩ. With no resistor (open), timeout defaults to 110 ms. The window watchdog also includes a deglitch filter (480 ns typical) to reject noise-induced resets.

What are the key differences between MC33910G5ACR2 and MC33912G5ACR2?

The MC33912G5ACR2 adds a 3.3 V LDO regulator and a CAN transceiver, but shares the same 32-pin LQFP package and core LIN/SBC functionality. Its SPI register map differs, and it lacks the MC33910G5ACR2's dedicated HVDD output. MC33912G5ACR2 is suited for dual-bus (LIN+CAN) systems, while MC33910G5ACR2 targets LIN-only body control with Hall sensor support.

Is the MC33910G5ACR2 qualified for automotive use, and what temperature range does it support?

Yes, the MC33910G5ACR2 is AEC-Q100 qualified for automotive applications and operates across -40 °C to +125 °C ambient temperature. Its junction shutdown threshold is 150 °C with 13 °C hysteresis, and it meets ISO 16750-2 electrical load dump (40 V) and pulse test requirements for passenger vehicles.

MC33910G5ACR2 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 32-LQFP

Packaging:: Tape & Reel (TR)

Product Status:: Active

Applications:: System Basis Chip

Current - Supply:: 4.5mA

Voltage - Supply:: 5.5V ~ 27V

Operating Temperature:: -40°C ~ 125°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 32-LQFP (7x7)

MC33910G5ACR2 FAQ

1.How can I place an order for MC33910G5ACR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33910G5ACR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33910G5ACR2 reliable?

The price and inventory of MC33910G5ACR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33910G5ACR2 is usually 5 days.

3.What payment methods are accepted for MC33910G5ACR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33910G5ACR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MC33910G5ACR2?

MC33910G5ACR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33910G5ACR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33910G5ACR2?

For technical support, including MC33910G5ACR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33910G5ACR2 requirements.

6.How does Aetrix verify that MC33910G5ACR2 is sourced from the original manufacturer or authorized distributors?

All MC33910G5ACR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33910G5ACR2 meets industry standards.

7.What is the process for return or replacement of MC33910G5ACR2?

All MC33910G5ACR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33910G5ACR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33910G5ACR2 part is unused and in its original packaging.

Return procedure for MC33910G5ACR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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