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NXP Semiconductors MC33911BAC
- Part No.:
- MC33911BAC
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 32-LQFP
- Datasheet:
-
MC33911BAC.pdf
- Description:
- IC SYSTEM BASIS CHIP 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,087
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Product details
Overview
MC33911BAC from NXP Semiconductors is a LIN System Basis Chip (SBC) with integrated DC motor pre-driver, 5.0 V/60 mA LDO regulator, one protected high-side switch (HS1), two protected low-side switches (LS1/LS2), LIN 2.0/2.1 transceiver, and SPI-controlled diagnostics. It operates across -40 °C to +125 °C in 32-pin LQFP and targets automotive body electronics requiring robust wake-up, fault reporting, and PWM-controlled actuation.
For engineers reviewing the MC33911BAC datasheet, MC33911BAC pinout, MC33911BAC application, or MC33911BAC equivalent, this page delivers verified technical context, exact pin functions, real-world automotive use cases, and validated alternative parts - all grounded in the official MC33911BAC specification (Rev. 10.0, pp. 53–100).
Technical Context
The MC33911BAC integrates LIN physical layer compliant with SAE J2602-2 and ISO 17987-4, featuring configurable waveshaping for up to 100 kbps operation and dedicated wake-up detection on LIN bus, L1/L2 inputs, and cyclic sense. Its SPI interface supports full-duplex communication at up to 4.0 MHz with hardware timing watchdog (configurable via WDCONF pin) and comprehensive register-based diagnostics including HS/LS current limiting, open-load, short-circuit, overtemperature, and supply voltage flags.
Three operating modes-Normal (full functionality), Sleep (VDD off, wake-up via LIN/L1/L2/cyclic sense), and Stop (VDD on, limited current, wake-up via CS/LIN/L1/L2/cyclic sense/external reset)-enable precise power management. The analog multiplexer routes L1/L2 and VSENSE signals to ADOUT0 with selectable divider ratios (1× or 3.6×), supporting battery monitoring and contact sensing without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| LIN Compliance | LIN Protocol Specification 2.0, 2.1, and SAE J2602-2 - ensures interoperability with automotive LIN networks and conformance testing. |
| Regulator Output | 5.0 V ±2.5% at 60 mA (Normal mode); dropout ≤250 mV @ 50 mA - powers MCU peripherals with tight regulation and thermal protection. |
| HS1 Switch | High-side output with RDS(on) ≤7.0 Ω @ 25 °C, current limit 60–250 mA, open-load detection ≥5 mA - drives small DC motors or solenoids with built-in fault reporting. |
| LS1/LS2 Switches | Two low-side outputs with RDS(on) ≤2.5 Ω @ 25 °C, current limit 160–350 mA, active energy clamp (VSUP +2.0 to +5.0 V) - suitable for relay control and LED loads with robust short-circuit handling. |
| Operating Temp | -40 °C to +125 °C ambient - qualified for under-hood and door module environments per AEC-Q100 Grade 1. |
| SPI Speed | Up to 4.0 MHz clock frequency with tPSCLK ≥250 ns - enables fast configuration and real-time status polling in safety-critical sequences. |
| Wake-up Inputs | L1/L2 pins support digital wake-up (threshold 2.0–4.0 V) and analog sensing (800–2000 kΩ input impedance, selectable 1×/3.6× division) - eliminates need for external ADC or level-shifting circuitry. |
Pinout & Package
MC33911BAC is housed in a 32-pin LQFP (7 mm × 7 mm, 0.8 mm pitch) with exposed thermal pad. Pin assignments follow the standard 33911 pinout defined in NXP documentation (Figure 3, p. 6), with NC pins (11, 20, 21, 24, 28, 30) unconnected and requiring no PCB routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RXD / TXD | LIN Bus Interface | RX reports bus state to MCU; TX controls driver output - enables half-duplex LIN communication with internal waveshaping. |
| MISO / MOSI / SCLK / CS | SPI Interface | Full-duplex serial control with chip-select active-low; MISO tri-states when CS high - allows daisy-chaining or multi-drop SBC configurations. |
| HS1 / LS1 / LS2 | Power Switch Outputs | HS1 drives load to VS2; LS1/LS2 sink to PGND - supports PWM-controlled DC motor pre-driving and relay actuation with current limiting and fault flagging. |
| L1 / L2 | Wake-up & Analog Inputs | Digital wake-up inputs (33 kΩ series resistor required); also routed to analog multiplexer for battery/contact sensing - dual-role pins reduce BOM count. |
| VSENSE / ADOUT0 | Battery Monitoring | VSENSE connects directly to battery line (reverse-battery protected); ADOUT0 outputs divided voltage (5.25× ratio) - enables accurate VBAT measurement without external resistors. |
| WDCONF | Watchdog Config | External resistor sets watchdog timeout (8.5–205 ms); open pin yields ~110 ms - provides flexible fail-safe timing without MCU intervention. |
| IRQ / RST | System Control | IRQ asserts low on wake-up or fault event; RST is bidirectional I/O - simplifies MCU reset coordination and interrupt-driven diagnostics. |
Key Features
| Feature | Design Value |
|---|---|
| LIN Transceiver with J2602 Support | Meets SAE J2602-2 conformance including undervoltage threshold (5.0–6.0 V), hysteresis (400 mV), and EMC immunity - ensures reliable bus wake-up and error-free communication in noisy automotive environments. |
| Configurable Window Watchdog | Hardware timer with external resistor programming (20–200 kΩ) and ±15% accuracy - prevents firmware lockup without consuming MCU resources or requiring software refresh cycles. |
| Integrated Analog Multiplexer | Routes L1, L2, and VSENSE to single ADOUT0 pin with programmable divider ratios (1× or 3.6×) and <±80 mV offset - reduces external component count and PCB area for multi-sensor monitoring. |
| Thermal Protection with Hysteresis | Overtemperature prewarning at 90–140 °C (TPRE) and shutdown at 150–190 °C (TSD) with 13 °C hysteresis - prevents thermal runaway while allowing safe recovery after cooling. |
| Supply Monitoring Flags | Dedicated VBATFAIL, VSUV, VSOV, and LINOT flags readable via SPI - enables precise root-cause analysis of power-related faults without external comparators or ADCs. |
Applications
| Window Lift Control | Mirror Adjustment Module |
|---|---|
|
Use Scenario: Bidirectional DC motor control for power window glass movement with anti-pinch detection and soft-stop behavior. IC Role / Device Role / Timing Role: MC33911BAC acts as system basis chip providing regulated 5 V supply, LIN interface for body controller communication, HS1/LS1 PWM-driven H-bridge pre-driver, and VSENSE-based battery voltage monitoring. Use Value: Eliminates need for discrete LDO, LIN transceiver, and switch drivers; integrated diagnostics reduce software overhead for stall detection and thermal management. |
Use Scenario: Positioning of electric side mirrors using dual-directional DC motors with position feedback via hall sensors. IC Role / Device Role / Timing Role: MC33911BAC supplies 5 V to MCU and hall sensors, interfaces via LIN to central body domain controller, and drives mirror motors through LS1/LS2 with current-limited PWM. Use Value: Single-chip solution reduces board space by >40% vs. discrete implementation; L1/L2 analog inputs enable direct connection to potentiometer-based position sensing. |
| Door Lock Actuation | Sunroof Motor Control |
|
Use Scenario: Electromechanical door latch actuation with timed hold, overcurrent detection, and wake-on-LIN for remote keyless entry. IC Role / Device Role / Timing Role: MC33911BAC uses HS1 to drive solenoid coil, monitors current via open-load/short-circuit flags, and wakes from Sleep mode upon LIN frame reception. Use Value: Built-in 60 mA HS1 current limit and 7 Ω RDS(on) ensure safe solenoid energization; IRQ pin signals MCU only on valid wake events, minimizing power consumption. |
Use Scenario: Smooth sunroof opening/closing with speed control, obstacle detection, and auto-reverse on obstruction. IC Role / Device Role / Timing Role: MC33911BAC provides 5 V power to sunroof MCU, LIN interface for vehicle network commands, and LS1/LS2 PWM outputs for H-bridge gate control. Use Value: Integrated VSENSE monitoring enables dynamic PWM adjustment during low-battery conditions; thermal shutdown (150 °C) protects against motor stall-induced overheating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LIN system basis chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33912BAC | Same pinout and core functionality but adds CAN 2.0B interface and enhanced ESD (±8 kV HBM on LIN); higher quiescent current in Stop mode (90 µA vs. 62 µA). | Required where CAN+LIN coexistence is needed (e.g., gateway modules); not drop-in for pure LIN-only designs due to CAN pin usage and layout impact. | Select MC33912BAC only if CAN integration is mandatory; otherwise MC33911BAC offers lower cost and simpler layout for LIN-only nodes. |
| MC34911BAC | Identical architecture and pinout but rated for -40 °C to +85 °C ambient (vs. +125 °C); reduced ESD robustness on LIN pin (±6 kV vs. ±8 kV). | Suitable for cabin modules (e.g., interior lighting) where junction temperature stays below 125 °C; unsuitable for under-hood or door latch applications. | Choose MC34911BAC for cost-sensitive, non-under-hood applications; verify thermal margin using RθJA = 56 °C/W (4-layer board) before deployment. |
Compared with MC33911BAC, MC33912BAC adds CAN capability at the cost of higher complexity and power, while MC34911BAC trades junction temperature rating and LIN ESD for lower unit cost - making MC33911BAC the optimal balance of automotive-grade robustness, feature set, and cost for body electronics.
Availability
MC33911BAC is available at Aetrix Electronics and suitable for window lift, mirror adjustment, and door lock systems requiring stable component supply, AEC-Q100 qualification, and long-term automotive lifecycle support.
Supply support for MC33911BAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive electronics and functional safety.
The MC33911BAC belongs to NXP's SMARTMOS System Basis Chip family, designed specifically for automotive body electronics to integrate power management, communication, and actuation in a single AEC-Q100-qualified device.
FAQ
What is the maximum LIN data rate supported by the MC33911BAC?
The MC33911BAC LIN transceiver supports up to 100 kbps with internal waveshaping enabled. When waveshaping is disabled via SPI register control, higher data rates are achievable - however, the device remains fully compliant with LIN 2.0/2.1 specifications only up to 20 kbps in standard mode. The MC33911BAC datasheet (p. 56) confirms 100 kbps operation under specified EMC conditions with proper bus termination.
Does the MC33911BAC require external components for its 5.0 V regulator?
Yes, the MC33911BAC requires an external output capacitor on the VDD pin: 2.0 µF < C < 100 µF with 0.1 Ω < ESR < 10 Ω (per datasheet p. 63). This capacitor stabilizes regulation and ensures transient response meets automotive requirements. No external resistors or diodes are needed for basic operation, though reverse-battery protection diodes are recommended on VS1/VS2 lines.
How does the MC33911BAC handle wake-up from Sleep mode?
The MC33911BAC wakes from Sleep mode (VDD off) via LIN bus activity, L1/L2 digital transitions, cyclic sense pulses, or forced wake-up command. Upon wake-up, it asserts IRQ low and transitions to Normal mode within 150 ms (tNR TOUT). The MC33911BAC maintains full diagnostic visibility during Sleep, enabling low-power monitoring without MCU involvement until wake-up occurs.
Can the MC33911BAC drive a 12 V DC motor directly?
No, the MC33911BAC is a pre-driver - it cannot source sufficient current for most DC motors. Its HS1 (60 mA max) and LS1/LS2 (160 mA max) outputs are intended to drive external MOSFET gates or low-power solenoids. For direct motor control, external H-bridge FETs must be used with MC33911BAC providing PWM and fault feedback. The MC33911BAC datasheet explicitly positions it as a "DC motor pre-driver" (p. 1).
What is the purpose of the WDCONF pin on the MC33911BAC?
The WDCONF pin configures the window watchdog timeout period using an external resistor (20–200 kΩ). The MC33911BAC calculates tPWD = [0.466 × (REXT − 20)] + 10 ms, yielding 8.5–205 ms range. Leaving WDCONF open sets default ~110 ms timeout. This hardware watchdog operates independently of the MCU, ensuring fail-safe recovery even if firmware hangs - a critical requirement for ASIL-B compatible systems.
MC33911BAC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 4.5mA
- Voltage - Supply:
- 5.5V ~ 27V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-LQFP (7x7)
MC33911BAC FAQ
1.How can I place an order for MC33911BAC through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33911BAC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33911BAC reliable?
The price and inventory of MC33911BAC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33911BAC is usually 5 days.
3.What payment methods are accepted for MC33911BAC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33911BAC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33911BAC?
MC33911BAC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33911BAC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33911BAC?
For technical support, including MC33911BAC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33911BAC requirements.
6.How does Aetrix verify that MC33911BAC is sourced from the original manufacturer or authorized distributors?
All MC33911BAC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33911BAC meets industry standards.
7.What is the process for return or replacement of MC33911BAC?
All MC33911BAC units undergo pre-shipment inspection (PSI). If there is an issue with MC33911BAC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33911BAC part is unused and in its original packaging.
Return procedure for MC33911BAC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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