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NXP Semiconductors MC33911BACR2
- Part No.:
- MC33911BACR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 32-LQFP
- Datasheet:
-
MC33911BACR2.pdf
- Description:
- IC SYSTEM BASIS CHIP 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,360
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Product details
Overview
MC33911BACR2 from NXP Semiconductors is a LIN System Basis Chip (SBC) with integrated DC motor pre-driver, combining SPI-controlled power management, LIN 2.0/2.1 transceiver, 5.0 V/60 mA LDO regulator, one protected high-side switch (HS1), two protected low-side switches (LS1/LS2), and dual high-voltage wake-up/analog inputs (L1/L2). It operates across -40 °C to +125 °C in 32-pin LQFP and targets automotive body electronics requiring robust fault reporting and PWM control.
For engineers reviewing the MC33911BACR2 datasheet, MC33911BACR2 pinout, MC33911BACR2 application, or MC33911BACR2 equivalent, this page delivers verified technical context, exact pin functions, real-world diagnostic capabilities (SPI-readable flags, window watchdog, overtemperature prewarning), and validated alternatives for window lift, mirror switch, door lock, and sunroof subsystems.
Technical Context
The MC33911BACR2 implements a multi-mode SBC architecture with Normal, Sleep, and Stop operating states-each with distinct wake-up sources (LIN bus, L1/L2 inputs, cyclic sense, forced wake-up, CS, RST) and current consumption profiles (IRUN ≤10 mA, ISTOP ≤400 µA, ISLEEP ≤300 µA). Its LIN transceiver complies with LIN Protocol Specification 2.0, 2.1, and SAE J2602-2, supports up to 100 kbps with configurable waveshaping, and includes J2602-compliant undervoltage detection (VTH_UNDER_VOLTAGE = 5.0–6.0 V) and deglitching (tJ2602_DEG = 35–70 µs).
Internally, it integrates a 5.0 V LDO with dropout voltage ≤0.25 V at 50 mA, line/load regulation ≤25 mV/80 mV, and full protection (BATFAIL, VSUV/VSOV flags); three independent protected drivers (HS1: RDS(on) ≤7.0 Ω @25 °C, ILIM = 60–250 mA; LS1/LS2: RDS(on) ≤2.5 Ω @25 °C, ILIM = 160–350 mA); and analog sensing via programmable divider (RATIOLX = 0.95–3.78) on L1/L2 pins feeding ADOUT0.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| LIN Compliance | LIN 2.0, 2.1, and SAE J2602-2 - ensures interoperability with automotive LIN networks and conformance-tested physical layer behavior. |
| Operating Temp Range | -40 °C to +125 °C - qualified for under-hood and body-control module environments per AEC-Q100 Grade 1. |
| VDD Regulator | 5.0 V ±2.5%, 60 mA continuous - powers MCU peripherals with <0.25 V dropout and built-in low-voltage reset (LVR) at 4.3–4.7 V. |
| HS1 Output | RDS(on) ≤7.0 Ω @25 °C, current-limited to 60–250 mA - enables direct driving of small DC motors or relays with short-circuit and open-load diagnostics. |
| LS1/LS2 Outputs | RDS(on) ≤2.5 Ω @25 °C, current-limited to 160–350 mA - supports high-current loads like solenoids or lamps with energy clamping (VSUP +2.0 to +5.0 V). |
| SPI Interface | Up to 4.0 MHz clock, tVALID ≤75 ns - allows fast configuration and real-time status reads (HSSR, LSSR, LINSR registers) without MCU timing bottlenecks. |
| Wake-up Inputs | L1/L2 support digital wake-up (VTHL = 2.0–3.0 V, VTHH = 3.0–4.0 V) and analog sensing (RLXIN = 800–2000 kΩ, RATIOLX selectable) - eliminates external ADC or comparator circuits. |
Pinout & Package
MC33911BACR2 uses a 32-pin LQFP package (7 mm × 7 mm, 0.8 mm pitch) with exposed thermal pad. Pin assignments follow NXP's standardized 33911 layout, including dedicated AGND, LGND, PGND, and VS1/VS2 supply domains for noise isolation and thermal management.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RXD / TXD | LIN Bus Interface | RXD reports bus state to MCU; TXD controls driver output - enables full-duplex LIN communication without external transceiver. |
| MISO / MOSI / SCLK / CS | SPI Control Interface | 4-wire SPI with tri-state MISO supports daisy-chaining; CS active-low enables multi-device arbitration on shared bus. |
| HS1 / LS1 / LS2 | Protected Power Outputs | HS1 drives high-side loads (e.g., motor upper rail); LS1/LS2 sink low-side loads (e.g., lamp cathodes) - all include current limiting, thermal shutdown, and diagnostic flagging. |
| L1 / L2 | Wake-up & Analog Inputs | Dual-purpose pins: digital wake-up (with 33 kΩ series resistor) or analog-sensed via internal multiplexer - simplifies contact monitoring and battery voltage scaling. |
| VSENSE / ADOUT0 | Battery Monitoring Path | VSENSE accepts direct battery connection (protected to ±27 V); ADOUT0 outputs scaled analog voltage (RATIOVSENSE = 5.0–5.5) for MCU ADC reading. |
| WDCONF | Watchdog Configuration | External resistor (20–200 kΩ) sets window watchdog period (8.5–205 ms) - provides configurable fail-safe timing without MCU intervention. |
| IRQ / RST | System Event Signaling | IRQ asserts low on wake-up or fault events; RST is bidirectional - enables hardware-triggered recovery and synchronized reset sequencing. |
Key Features
| Feature | Design Value |
|---|---|
| SPI-accessible diagnostics | Real-time register reads (HSSR, LSSR, LINSR) report HS1/LS1/LS2 open-load, short-circuit, overtemperature, and LIN bus faults - eliminates need for external fault monitoring circuitry. |
| Configurable window watchdog | Hardware-based watchdog with externally adjustable timeout (8.5–205 ms) and deglitch filtering (tRSTDF = 350–900 ns) - prevents runaway code without software overhead. |
| J2602-compliant LIN transceiver | Integrated LIN PHY with VBUSWU = 5.3–5.8 V wake-up threshold, TLINSD = 140–180 °C shutdown, and ±6.0 kV ESD on LIN pin - meets automotive EMC and reliability requirements out-of-box. |
| Dual-domain power routing | VS1 powers logic/LDO/switches; VS2 powers HS1 driver - isolates high-current switching noise from sensitive analog/digital blocks and improves thermal distribution. |
| Analog input multiplexer | Shared ADOUT0 output routes scaled L1/L2 or VSENSE signals with programmable divider ratios (0.95–3.78) and offset compensation - replaces discrete resistor dividers and op-amps. |
Applications
| Window Lift | Mirror Switch |
|---|---|
|
Use Scenario: Bidirectional DC motor control for power window glass movement with anti-pinch detection and position feedback. IC Role / Device Role / Timing Role: MC33911BACR2 acts as system basis chip - supplies 5 V to MCU, drives motor H-bridge half (HS1 + LS1/LS2), monitors L1/L2 for switch inputs, and reports faults via SPI. Use Value: Integrated diagnostics (open-load, short-circuit, overtemperature) enable safe stall detection; PWM-capable outputs allow precise speed control without external gate drivers. |
Use Scenario: Multi-axis adjustment of exterior rearview mirrors using two small DC motors (vertical/horizontal). IC Role / Device Role / Timing Role: MC33911BACR2 serves as LIN node controller - receives commands via LIN bus, executes direction/speed via HS1+LS1/LS2 PWM, and senses limit switches through L1/L2 inputs. Use Value: Single-chip solution reduces BOM count by eliminating separate LDO, transceiver, and driver ICs; J2602 compliance ensures seamless integration into OEM LIN clusters. |
| Door Lock | Sunroof |
|
Use Scenario: Electromechanical actuation of door latch solenoids with status feedback and tamper detection. IC Role / Device Role / Timing Role: MC33911BACR2 functions as protected low-side driver - sinks solenoid current via LS1/LS2, monitors coil health via current-limit flags, and wakes MCU on door handle contact (L1/L2). Use Value: Built-in energy clamping (VSUP +2.0 to +5.0 V) suppresses inductive kickback; cyclic sense mode enables ultra-low-power occupancy monitoring (<100 µA in Stop mode). |
Use Scenario: Controlled opening/closing of panoramic sunroof with obstacle detection and soft-stop functionality. IC Role / Device Role / Timing Role: MC33911BACR2 operates as motor pre-driver and sensor interface - drives sunroof motor via HS1+LS1/LS2, reads potentiometer via ADOUT0, and triggers LIN alerts on overcurrent or temperature rise. Use Value: On-chip VSENSE and analog multiplexer eliminate external voltage dividers; SPI-accessible TPRE (90–140 °C prewarning) enables predictive thermal derating before shutdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LIN system basis chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33912BACR2 | Same pinout, identical feature set, but adds enhanced ESD (±8 kV HBM on LIN) and improved EMC immunity per updated generation spec. | Preferred for new designs targeting higher automotive EMC robustness; backward compatible in existing layouts. | Select MC33912BACR2 when J2602 conformance and ISO 7637-2 pulse 3b immunity are mandatory; MC33911BACR2 remains valid for cost-sensitive legacy platforms. |
| MC33816G5ACR2 | Lower temp grade (-40 °C to +85 °C), no LIN transceiver, single 50 mA LDO, only one low-side switch - reduced integration. | Suitable for non-LIN, lower-complexity body modules (e.g., interior lighting) where LIN networking is not required. | Choose MC33816G5ACR2 only if LIN connectivity is unnecessary and ambient temperature stays below 85 °C; not a functional replacement for MC33911BACR2 in LIN nodes. |
Compared with MC33911BACR2, MC33912BACR2 offers superior ESD and EMC performance without layout changes, while MC33816G5ACR2 sacrifices LIN, temperature range, and driver count - making it unsuitable for direct substitution in safety-critical or networked body control units.
Availability
MC33911BACR2 is available at Aetrix Electronics and suitable for window lift, mirror switch, and door lock systems requiring stable component supply, AEC-Q100 qualification, and long-term automotive lifecycle support.
Supply support for MC33911BACR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, scalable silicon solutions with deep domain expertise in vehicle networking and power management.
The MC33911BACR2 belongs to NXP's SMARTMOS System Basis Chip family, engineered specifically for automotive body electronics to consolidate LIN communication, power regulation, protected switching, and analog sensing into a single AEC-Q100-qualified device.
FAQ
What is the maximum LIN data rate supported by the MC33911BACR2?
The MC33911BACR2 LIN transceiver supports up to 100 kbps with configurable waveshaping. When waveshaping is disabled, higher rates are achievable - however, the datasheet specifies guaranteed operation up to 100 kbps per LIN 2.0/2.1 and SAE J2602-2 conformance testing. The MC33911BACR2 does not support CAN or other bus protocols.
Does the MC33911BACR2 require external components for its 5.0 V regulator?
Yes, the MC33911BACR2 requires an external capacitor on the VDD pin: 2.0 µF < C < 100 µF with 0.1 Ω < ESR < 10 Ω. This capacitor stabilizes the LDO output and ensures proper transient response. No external resistors or diodes are needed for basic regulation, but reverse-battery protection diodes must be added externally on VS1/VS2 lines.
How does the MC33911BACR2 handle overtemperature conditions?
The MC33911BACR2 features dual thermal protection: overtemperature prewarning (TPRE = 90–140 °C) sets a flag and asserts IRQ, allowing controlled shutdown; overtemperature shutdown (TSD = 150–190 °C) disables HS1 and both LS outputs. Thermal hysteresis (13 °C) prevents oscillation. These thresholds apply to junction temperature and are monitored continuously in all operating modes.
Can the L1 and L2 pins of the MC33911BACR2 be used simultaneously as analog inputs?
Yes - L1 and L2 can each be configured as analog inputs via the internal analog multiplexer. The divider ratio (RATIOLX) is selectable per pin (0.95–3.78), and matching between L1/L2 is specified at 96–104%. Both pins share the same ADOUT0 output, so analog readings must be time-multiplexed via SPI register control; simultaneous sampling is not supported.
What watchdog configuration options does the MC33911BACR2 support?
The MC33911BACR2 supports a window watchdog configured via the WDCONF pin: connecting an external resistor (20–200 kΩ) sets the timeout period from 8.5 ms to 205 ms per tPWD = [0.466 × (REXT − 20)] + 10. Leaving WDCONF open yields ~110–205 ms. The watchdog includes deglitch filtering (tRSTDF = 350–900 ns) and generates IRQ on timeout - no software polling required.
MC33911BACR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 4.5mA
- Voltage - Supply:
- 5.5V ~ 27V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-LQFP (7x7)
MC33911BACR2 FAQ
1.How can I place an order for MC33911BACR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33911BACR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33911BACR2 reliable?
The price and inventory of MC33911BACR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33911BACR2 is usually 5 days.
3.What payment methods are accepted for MC33911BACR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33911BACR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33911BACR2?
MC33911BACR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33911BACR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33911BACR2?
For technical support, including MC33911BACR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33911BACR2 requirements.
6.How does Aetrix verify that MC33911BACR2 is sourced from the original manufacturer or authorized distributors?
All MC33911BACR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33911BACR2 meets industry standards.
7.What is the process for return or replacement of MC33911BACR2?
All MC33911BACR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33911BACR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33911BACR2 part is unused and in its original packaging.
Return procedure for MC33911BACR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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