My Inquiry
My Account
NXP Semiconductors MC33911G5ACR2
- Part No.:
- MC33911G5ACR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 32-LQFP
- Datasheet:
-
MC33911G5ACR2.pdf
- Description:
- IC SYSTEM BASIS CHIP 32LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,049
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33911G5ACR2 from NXP Semiconductors is a LIN System Basis Chip (SBC) with integrated DC motor pre-driver, 5.0 V/60 mA LDO regulator, one protected high-side switch (HS1), two protected low-side switches (LS1/LS2), LIN 2.0/2.1 transceiver, and dual high-voltage wake-up/analog inputs (L1/L2). It operates across -40 °C to 125 °C in 32-pin LQFP and supports PWM-controlled window lift, mirror adjustment, door lock, and sunroof actuation.
For engineers reviewing the MC33911G5ACR2 datasheet, MC33911G5ACR2 pinout, MC33911G5ACR2 application, or MC33911G5ACR2 equivalent, this page delivers verified technical context, SPI timing up to 4.0 MHz, LIN bus compliance per SAE J2602-2, diagnostic register visibility, and validated thermal shutdown thresholds at 150 °C junction temperature.
Technical Context
The MC33911G5ACR2 integrates a full-duplex SPI interface (≤4.0 MHz) for real-time configuration and diagnostics, coupled with a LIN physical layer compliant to ISO 17987-4 and SAE J2602-2 - including configurable waveshaping and ±6.0 kV ESD protection on LIN. Its watchdog uses an external resistor (20–200 kΩ) to set timeout periods from 8.5 ms to 108 ms.
Three operating modes-Normal (full functionality), Sleep (VDD off, wake via LIN/L1/L2/cyclic sense), and Stop (VDD on, limited current)-are managed by internal state machine logic. The analog multiplexer routes L1/L2 voltage (divided 1:1 or 1:3.6) and VSENSE (5.25× division) to ADOUT0, enabling battery monitoring and contact sensing without external ADC.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| LIN Compliance | SAE J2602-2 and LIN Protocol Spec 2.0/2.1; supports 100 kbps with optional waveshaping disable for higher rates. |
| Regulator Output | 5.0 V ±2.5% at 60 mA (Normal mode); dropout ≤0.25 V @ 50 mA - enables stable MCU supply under load dump conditions. |
| HS1 Switch | High-side driver with RDS(on) ≤7.0 Ω @ 25 °C, current limit 60–250 mA, open-load detection ≥5.0 mA - suitable for small DC motors and solenoids. |
| LS1/LS2 Switches | Two low-side drivers with RDS(on) ≤2.5 Ω @ 25 °C, current limit 160–350 mA, active clamp up to VSUP+5.0 V - robust for relay and LED loads. |
| L1/L2 Inputs | Dual high-voltage digital/analog inputs (−18 V to 40 V), configurable divider ratio (1:1 or 1:3.6), matching tolerance ±4% - supports contact monitoring and battery-sense functions. |
| Thermal Protection | Overtemperature prewarning at 90–140 °C (IRQ flag), shutdown at 150–190 °C with 13 °C hysteresis - ensures safe operation in enclosed automotive modules. |
| SPI Timing | Max clock frequency 4.0 MHz; tVALID ≤75 ns (CL = 100 pF); CS-to-SCLK setup ≥100 ns - compatible with mid-speed microcontrollers without wait states. |
Pinout & Package
MC33911G5ACR2 is housed in a 32-pin LQFP (7 mm × 7 mm, 0.8 mm pitch) with exposed thermal pad. Pin assignments follow NXP's standardized layout for mechanical and thermal reliability in automotive PCBs.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 (RXD) | LIN Receiver Output | Reports LIN bus voltage state to MCU; open-drain output referenced to VDD. |
| 2 (TXD) | LIN Transmitter Input | Drives LIN bus via internal driver; accepts CMOS-level signals from MCU. |
| 3 (MISO) | SPI Data Output | Tri-state output during CS high; delivers status registers and analog readings. |
| 4 (MOSI) | SPI Data Input | Accepts command bytes for mode control, watchdog config, and switch enable/disable. |
| 5 (SCLK) | SPI Clock Input | Synchronizes all SPI transfers; max 4.0 MHz operation with 110 ns min high/low time. |
| 6 (CS) | SPI Chip Select | Active-low enable; rising edge triggers Stop mode entry or wake-up sequence. |
| 7 (ADOUT0) | Analog Multiplexer Output | Single-ended output carrying scaled L1/L2/VSENSE voltage; drives external ADC or comparator. |
| 8 (PWMIN) | PWM Control Input | Accepts external PWM signal to modulate HS1/LS1/LS2 duty cycle; supports 100% duty cycle. |
| 9 (RST) | Bidirectional Reset I/O | Drives low during internal reset (LVR, watchdog, overtemp); pulled up externally for system reset coordination. |
| 10 (IRQ) | Interrupt Output | Active-low open-drain signal indicating wake events, fault flags, or watchdog timeouts. |
| 12 (WDCONF) | Watchdog Configuration | Resistor-programmable input setting watchdog period; open = 110–205 ms default. |
| 13 (LIN) | LIN Bus Interface | Single-wire bidirectional bus node; includes internal pull-up, slew-rate control, and ESD protection. |
| 14 (LGND) | LIN Ground Reference | Internally tied to PGND; provides isolated ground path for LIN transceiver noise immunity. |
| 17/19 (LS2/LS1) | Low-side Driver Outputs | Protected NMOS outputs sinking up to 350 mA; include short-circuit, open-load, and overtemp detection. |
| 25 (HS1) | High-side Driver Output | Protected PMOS output sourcing up to 250 mA; supports load disconnect and energy recovery. |
| 26/27 (VS2/VS1) | Battery Supply Inputs | VS2 powers HS1 directly; VS1 supplies all other blocks - enables independent power path design. |
| 29 (VSENSE) | Battery Voltage Sense | Direct connection to battery line with internal 5.25× divider; self-protected against reverse polarity. |
| 31 (VDD) | 5.0 V Regulator Output | Stable MCU core supply; requires 2–100 µF ceramic capacitor with 0.1–10 Ω ESR. |
| 32 (AGND) | Analog Ground Reference | Separate ground for ADOUT0 and internal analog circuits; must be routed away from noisy digital paths. |
Key Features
| Feature | Design Value |
|---|---|
| Configurable Window Watchdog | External resistor (20–200 kΩ) sets timeout from 8.5 ms to 108 ms - prevents firmware lockup without fixed timing constraints. |
| LIN Transceiver with J2602 Support | Meets SAE J2602-2 conformance including undervoltage threshold (5.0–6.0 V), hysteresis (400 mV), and pulse 3b immunity - certified for automotive networks. |
| Dual High-Voltage Analog/Digital Inputs | L1/L2 pins support both wake-up triggering and ratiometric voltage measurement (1:1 or 1:3.6) - eliminates need for external level-shifters or dividers. |
| Fault-Reporting SPI Registers | Real-time readout of HS1/LS1/LS2 current limits, open-load, short-circuit, overtemp, LIN bus faults, and regulator status - enables predictive maintenance and diagnostics. |
| Three-Power-State Architecture | Normal (full function), Stop (VDD on, <400 µA), Sleep (VDD off, <300 µA) - reduces quiescent current in parked vehicle scenarios while retaining wake capability. |
| Integrated 5.0 V LDO with Full Protection | Includes overcurrent, overtemperature, undervoltage (VBATFAIL), and load-dump survival (40 V transient) - replaces discrete regulator + protection ICs. |
Applications
| Window Lift Control | Mirror Adjustment Module |
|---|---|
|
Use Scenario: Bidirectional DC motor driving glass lift mechanism in automotive door panels with soft-start and stall detection. IC Role / Device Role / Timing Role: MC33911G5ACR2 acts as system basis chip: supplies MCU, drives motor via HS1/LS1 PWM, senses battery voltage (VSENSE), and reports faults over LIN. Use Value: Integrated diagnostics reduce need for external current sensing; LIN interface enables centralized body controller communication without additional UART or CAN hardware. |
Use Scenario: Compact side-view mirror actuation using dual DC motors for vertical/horizontal positioning with end-stop detection. IC Role / Device Role / Timing Role: MC33911G5ACR2 provides dual low-side drive (LS1/LS2), LIN transceiver for command reception, and wake-on-LIN for key-fob activation. Use Value: Single-chip solution eliminates discrete H-bridge and LIN transceiver; L1/L2 inputs monitor motor current for stall detection without shunt resistors. |
| Door Lock Actuator | Sunroof Motor Control |
|
Use Scenario: Solenoid-based door latch actuation requiring precise 100–500 ms pulse duration and overcurrent protection during jam conditions. IC Role / Device Role / Timing Role: MC33911G5ACR2 delivers controlled high-side drive (HS1) with programmable current limit and open-load detection to distinguish latch engagement vs. obstruction. Use Value: Built-in current limiting prevents coil burnout; SPI-accessible fault flags allow immediate retry or error logging without MCU ADC overhead. |
Use Scenario: Sunroof sliding/tilt motor control with position feedback via external potentiometer and LIN-based speed regulation. IC Role / Device Role / Timing Role: MC33911G5ACR2 supplies 5.0 V to position sensor, drives motor via LS1/LS2 PWM, monitors battery voltage (VSENSE), and communicates status over LIN. Use Value: Analog multiplexer (ADOUT0) reads potentiometer and VSENSE on same pin - saves MCU ADC channels and simplifies BOM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LIN SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33912G5ACR2 | Same pinout and feature set, but adds second LIN transceiver and enhanced ESD (±8 kV on LIN) - no change to HS1/LS1/LS2 specs or regulator. | Required where dual-LIN nodes (e.g., master + slave) or higher EMC immunity are mandated; not needed for single-bus systems. | Select MC33912G5ACR2 only if dual-LIN or extended ESD margin is required; otherwise MC33911G5ACR2 offers identical core functionality at lower cost. |
| MC33816G5ACR2 | Lower temperature grade (−40 °C to 85 °C), reduced LDO current (50 mA), no VSENSE pin, and simplified watchdog (no external resistor option). | Suitable for non-powertrain cabin modules with less stringent thermal or diagnostic requirements; lacks battery monitoring and fine-grained watchdog tuning. | Choose MC33816G5ACR2 for cost-sensitive interior applications without battery sensing or extreme ambient operation; retain MC33911G5ACR2 for full-featured body control units. |
Compared with MC33912G5ACR2, MC33911G5ACR2 provides identical motor drive and LIN performance at lower cost and complexity; versus MC33816G5ACR2, it adds critical features for under-hood or battery-sensing applications - including 125 °C operation, VSENSE, and resistor-configurable watchdog.
Availability
MC33911G5ACR2 is available at Aetrix Electronics and suitable for window lift, mirror adjustment, door lock, and sunroof applications requiring stable component supply, automotive-grade qualification, and long-term lifecycle support.
Supply support for MC33911G5ACR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in automotive electronics and functional safety.
The MC33911G5ACR2 belongs to NXP's SMARTMOS System Basis Chip family, designed specifically for automotive body electronics to integrate power management, communication, and driver functions into a single AEC-Q100 qualified device.
FAQ
What is the maximum LIN data rate supported by the MC33911G5ACR2?
The MC33911G5ACR2 supports LIN data rates up to 100 kbps when waveshaping is enabled per LIN 2.0/2.1 specifications. Waveshaping can be disabled via SPI register to support higher custom rates, though official conformance applies only up to 100 kbps. The physical layer meets SAE J2602-2 requirements including pulse 3b immunity and ±6.0 kV ESD on the LIN pin.
Does the MC33911G5ACR2 support battery voltage monitoring?
Yes, the MC33911G5ACR2 includes a dedicated VSENSE pin that connects directly to the battery line and feeds an internal 5.25× voltage divider. The resulting scaled voltage appears on ADOUT0 and can be read by an external ADC. This enables accurate battery monitoring without external components, and the pin is self-protected against reverse battery connections.
How does the watchdog timer on the MC33911G5ACR2 work?
The MC33911G5ACR2 features a window watchdog configured via the WDCONF pin using an external resistor (20–200 kΩ). Timeout ranges from 8.5 ms to 108 ms depending on resistor value. The watchdog requires periodic SPI refresh commands; failure triggers Normal Request mode and IRQ assertion. An open WDCONF pin defaults to ~110 ms timeout.
Can the MC33911G5ACR2 drive a DC motor directly?
Yes, the MC33911G5ACR2 integrates one high-side switch (HS1) and two low-side switches (LS1/LS2) with built-in protection. HS1 supports up to 250 mA continuous current and can drive small DC motors directly. LS1/LS2 each support up to 350 mA and enable H-bridge configurations. All outputs support PWM modulation via the PWMIN pin or SPI commands.
What are the thermal shutdown and prewarning thresholds for the MC33911G5ACR2?
The MC33911G5ACR2 provides overtemperature prewarning at 90–140 °C (configurable via SPI) and full shutdown at 150–190 °C. Both thresholds include 13 °C hysteresis to prevent oscillation. When triggered, the prewarning asserts IRQ and sets the VDDOT bit; shutdown disables HS1 and sets all fault flags in the HSSR register.
MC33911G5ACR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 4.5mA
- Voltage - Supply:
- 5.5V ~ 27V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 32-LQFP (7x7)
MC33911G5ACR2 FAQ
1.How can I place an order for MC33911G5ACR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33911G5ACR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33911G5ACR2 reliable?
The price and inventory of MC33911G5ACR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33911G5ACR2 is usually 5 days.
3.What payment methods are accepted for MC33911G5ACR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33911G5ACR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33911G5ACR2?
MC33911G5ACR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33911G5ACR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33911G5ACR2?
For technical support, including MC33911G5ACR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33911G5ACR2 requirements.
6.How does Aetrix verify that MC33911G5ACR2 is sourced from the original manufacturer or authorized distributors?
All MC33911G5ACR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33911G5ACR2 meets industry standards.
7.What is the process for return or replacement of MC33911G5ACR2?
All MC33911G5ACR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33911G5ACR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33911G5ACR2 part is unused and in its original packaging.
Return procedure for MC33911G5ACR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33911G5ACR2 Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
