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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Management - Specialized

NXP Semiconductors MC33FS5502Y0KS

Name: MC33FS5502Y0KS
Brand: NXP Semiconductors
SKU: MC33FS5502Y0KS
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MC33FS5502Y0KS

Manufacturer:: NXP Semiconductors

Category:: Power Management - Specialized

Package:: 56-VFQFN Exposed Pad

Datasheet:: MC33FS5502Y0KS.pdf

Description:: HIGH VOLTAGE POWER MANAGEMENT IC

Quantity:: RFQ Add To RFQ list

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Product details

Overview

MC33FS5502Y0KS from NXP Semiconductors is an automotive-grade high-voltage PMIC designed for radio and radar power management, integrating a VPRE synchronous buck controller (up to 10 A peak), two low-voltage synchronous buck converters (BUCK1 and BUCK3, each up to 3.6 A peak), and one linear regulator (LDO1, up to 400 mA DC). It supports I²C configuration, frequency synchronization (FIN/FOUT), and AEC-Q100 Grade 1 qualification for 12 V/24 V vehicle systems.

For engineers reviewing the MC33FS5502Y0KS datasheet, MC33FS5502Y0KS pinout, MC33FS5502Y0KS application, or MC33FS5502Y0KS equivalent, key selection considerations include its 60 V max input voltage, OTP-programmable power-up sequencing across seven slots, dual wake-up inputs (WAKE1/WAKE2), integrated voltage monitoring (VMON1, VCOREMON), and fail-safe state machine with PGOOD/RSTB assertion logic.

Technical Context

The MC33FS5502Y0KS implements a dual-state-machine architecture: a main state machine managing power sequencing (VPRE → BUCK1/BUCK3/LDO1) and standby transitions, and a fail-safe state machine independently supervising VBOS, VPRE, and regulator outputs to assert RSTB and PGOOD on fault detection. Power-up sequencing is fully configurable via OTP, with slot delays set to 250 µs or 1 ms.

It features hardware-level EMC optimization including spread-spectrum modulation, slew-rate control, and external frequency synchronization (FIN input, FOUT output), enabling synchronized switching across multiple PMICs or with external clock sources. The device supports debug mode entry via DBG pin (4.5–5.5 V threshold) with dedicated I²C addresses (0x20/0x21) for engineering OTP emulation.

Key Specifications

Parameter	Value and Actual Design Meaning
Max Input Voltage	60 V DC - supports direct connection to 12 V and 24 V automotive battery rails with reverse-battery protection diode required on VSUP1/VSUP2.
VPRE Output Current	Up to 10 A peak - enables high-power RF front-end supply (e.g., MMIC bias) using external high-side/low-side MOSFETs.
BUCK1/BUCK3 Current	Each up to 3.6 A peak - delivers core and I/O rail power for automotive MCUs with SVS capability on BUCK1.
LDO1 Output Current	400 mA DC - supplies MCU I/Os and ADC reference with configurable output voltage.
Standby Current	10 µA typical - ensures ultra-low quiescent consumption in OFF mode for always-on vehicle subsystems.
AEC-Q100 Grade	Grade 1 (−40 °C to +125 °C ambient) - qualified for under-hood and infotainment module deployment.
I²C Interface	With CRC error detection - provides robust register access for real-time status monitoring (M_FLAG, M_STATES) and dynamic control (M_REG_CTRL1).

Pinout & Package

HVQFN56 package (SOT684-23), thermally enhanced, wettable flanks (dimple type for KS suffix), 8 mm × 8 mm, 0.5 mm pitch, exposed thermal pad (EP) connected to GND.

Pin/Terminal	Circuit Role	Design Meaning
1 WAKE2	Wake-up input 2	Asynchronous interrupt source; requires external series resistor if used as global wake pin.
3 BUCK3_INQ	BUCK3 quiet input	Low-noise input path for BUCK3 to reduce EMI coupling into sensitive analog sections.
6 BUCK3_IN	BUCK3 input voltage	Primary input for low-voltage BUCK3 converter; must be externally decoupled.
7 BUCK3_SW	BUCK3 switching node	Connects to external inductor; requires careful layout to minimize switching loop area.
9 BUCK3_FB	BUCK3 feedback	Resistive divider input for precise output voltage regulation (OTP-configurable).
10 SCL	I²C clock	Open-drain input; requires external pull-down to GND when unused.
11 SDA	I²C data	Open-drain bidirectional line; requires external pull-down to GND when unused.
16 VMON1	Voltage monitor input 1	Analog input for system-level rail supervision; 2 MΩ internal pull-down when disabled.
17 VCOREMON	VCORE monitoring input	Mandatory connection to BUCK1 output for core voltage validation and SVS function.
18 PGOOD	Power good output	Active-low open-drain signal; requires external pull-up to VDDIO to indicate stable regulation.
19 RSTB	Reset output	Active-low reset for MCU; monitors external reset and internal fault conditions; pull-up to VDDIO mandatory.
20 FIN	Frequency sync input	Accepts external clock (e.g., from master PMIC or crystal oscillator) to synchronize SMPS switching.
23 VDDIO	I²C buffer supply	Input voltage for I²C interface logic; sets voltage compatibility with MCU I/O levels.
24 FOUT	Frequency sync output	Push-pull output providing synchronized clock to downstream devices (e.g., second FS5502 or sensor).
33 INTB	Interrupt output	Active-low open-drain interrupt; 10 kΩ internal pull-up to VDDIO; signals fault or status events.
36 BUCK1_IN	BUCK1 input voltage	Primary input for MCU core supply; requires local ceramic decoupling near pin.
37 BUCK1_SW	BUCK1 switching node	High-current switching node; connects directly to inductor and low-side MOSFET source.
38 PSYNC	Power sync I/O	Configurable as input (to wait for external PMIC) or output (to trigger companion device); pull-up to VBOS required.
39 BUCK1_FB	BUCK1 feedback	Feedback input for core rail regulation; tied to VCOREMON for SVS monitoring.
47 VBOS	Best-of-supply output	Regulated output derived from VSUP1/VSUP2; powers internal bias and serves as PSYNC reference.
48 PRE_FB	VPRE feedback	Combined voltage feedback and negative current sense input for VPRE controller loop stability.
49 WAKE1	Wake-up input 1	Primary asynchronous wake source; requires external series resistor if used globally.
50 VSUP1	Power supply 1	Main high-voltage input; reverse-battery protection diode mandatory in series.
51 VSUP2	Power supply 2	Redundant high-voltage input; reverse-battery protection diode mandatory in series.
55 LDO1	LDO1 output	Linear regulator output for MCU I/Os and ADC; configurable voltage, 400 mA max DC load.
56 LDO1_IN	LDO1 input	Input for LDO1; typically connected to BUCK3 output or dedicated low-noise rail.
57 EP	Exposed pad	Thermal and electrical GND connection; must be soldered to PCB thermal plane for thermal performance.

Key Features

Feature	Design Value
OTP-based power sequencing	Seven programmable startup slots with 250 µs or 1 ms inter-slot delay - enables precise timing control for multi-rail MCU and RF subsystems.
Fail-safe state machine	Dedicated hardware supervisor asserting PGOOD/RSTB on VBOS, VPRE, or regulator faults - operates independently of main state machine for ASIL-compliant safety.
EMC-optimized switching	Integrated spread spectrum, slew rate control, and FIN/FOUT synchronization - reduces peak EMI by >10 dB in critical 150 kHz–108 MHz bands.
Debug-mode OTP emulation	DBG pin-triggered mode (4.5–5.5 V) with fixed I²C addresses (0x20/0x21) - allows full register access and OTP reconfiguration during engineering development.
Multi-source wake-up	Two independent wake inputs (WAKE1/WAKE2) with configurable enable/disable and internal flag reporting - supports redundant CAN/LIN/switch wake strategies.
Configurable protection	Per-regulator overcurrent (OC), overtemperature (TSD), and undervoltage/overvoltage (UV/OV) response - configurable via OTP and runtime registers (M_REG_CTRL2, FS_I_OVUV_SAFE_REACTION1).

Applications

Automotive Radio Systems	V2X Communication Modules
Use Scenario: Powering AM/FM/DAB tuner, DSP, and audio amplifiers in head-unit designs with strict EMC requirements. IC Role / Device Role / Timing Role: Central PMIC delivering VPRE (for RF front-end), BUCK1 (DSP core), BUCK3 (audio codec), and LDO1 (I²S interface). Use Value: Frequency synchronization (FIN/FOUT) aligns switching edges across multiple ICs, reducing broadband noise in sensitive RF receive bands.	Use Scenario: Supplying DSRC or C-V2X transceivers, baseband processors, and GNSS receivers in roadside units and vehicle telematics. IC Role / Device Role / Timing Role: High-reliability power manager with dual wake inputs (WAKE1/WAKE2) enabling instant activation from CAN bus or GPS time pulse. Use Value: Fail-safe state machine asserts RSTB within 10 µs of VBOS drop, ensuring deterministic recovery during transient battery dips.
Infotainment Head Units	Radar Signal Processing Units
Use Scenario: Supporting multi-core application processors, display drivers, and touch controllers in Android Automotive head units. IC Role / Device Role / Timing Role: Sequenced power delivery (VPRE → BUCK1 → BUCK3 → LDO1) with SVS on BUCK1 to prevent processor lockup during voltage droop. Use Value: OTP-configurable soft-start and slot delays eliminate inrush current conflicts between processor core and DDR memory rails.	Use Scenario: Powering 77 GHz radar MMICs, ADCs, and FPGA-based beamforming engines in ADAS front radar modules. IC Role / Device Role / Timing Role: VPRE controller supplies 12 V @ 10 A to MMIC bias rails; BUCK3 powers FPGA I/O banks; LDO1 cleans ADC reference. Use Value: BUCK3_INQ pin isolates switching noise from ADC sampling circuitry, preserving SNR in high-resolution radar digitization.

Automotive Radio Systems

V2X Communication Modules

Use Scenario: Powering AM/FM/DAB tuner, DSP, and audio amplifiers in head-unit designs with strict EMC requirements.

IC Role / Device Role / Timing Role: Central PMIC delivering VPRE (for RF front-end), BUCK1 (DSP core), BUCK3 (audio codec), and LDO1 (I²S interface).

Use Value: Frequency synchronization (FIN/FOUT) aligns switching edges across multiple ICs, reducing broadband noise in sensitive RF receive bands.

Use Scenario: Supplying DSRC or C-V2X transceivers, baseband processors, and GNSS receivers in roadside units and vehicle telematics.

IC Role / Device Role / Timing Role: High-reliability power manager with dual wake inputs (WAKE1/WAKE2) enabling instant activation from CAN bus or GPS time pulse.

Use Value: Fail-safe state machine asserts RSTB within 10 µs of VBOS drop, ensuring deterministic recovery during transient battery dips.

Infotainment Head Units

Radar Signal Processing Units

Use Scenario: Supporting multi-core application processors, display drivers, and touch controllers in Android Automotive head units.

IC Role / Device Role / Timing Role: Sequenced power delivery (VPRE → BUCK1 → BUCK3 → LDO1) with SVS on BUCK1 to prevent processor lockup during voltage droop.

Use Value: OTP-configurable soft-start and slot delays eliminate inrush current conflicts between processor core and DDR memory rails.

Use Scenario: Powering 77 GHz radar MMICs, ADCs, and FPGA-based beamforming engines in ADAS front radar modules.

IC Role / Device Role / Timing Role: VPRE controller supplies 12 V @ 10 A to MMIC bias rails; BUCK3 powers FPGA I/O banks; LDO1 cleans ADC reference.

Use Value: BUCK3_INQ pin isolates switching noise from ADC sampling circuitry, preserving SNR in high-resolution radar digitization.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage automotive PMIC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MC33FS5502Y3KS	Pre-programmed OTP configuration (Y3) vs. unprogrammed Y0; includes factory-set VPRE/BUCk1/BUCK3 voltages and sequencing.	Suitable for production release where custom OTP programming is not required; eliminates engineering-mode setup.	Select Y3KS for volume production; use Y0KS for design-in flexibility and prototype OTP customization.
MC33FS8502Y0KS	ASIL-D qualified variant with enhanced diagnostics, dual-lockstep cores, and extended voltage monitoring (3x VMON vs. 1x in FS5502).	Required for safety-critical radar ECU functions requiring ISO 26262 ASIL-D compliance; not drop-in compatible due to different register map and OTP structure.	Choose FS8502 only when functional safety certification is mandated; FS5502 remains optimal for ASIL-B or non-safety infotainment/radio.

Compared with MC33FS5502Y3KS, the Y0KS offers full OTP programmability at the cost of initial configuration effort; compared with MC33FS8502Y0KS, it provides identical packaging and pinout but lacks ASIL-D diagnostic coverage and dual-core redundancy, making it lighter-weight for cost-sensitive radio/V2X designs.

Availability

MC33FS5502Y0KS is available at Aetrix Electronics and suitable for automotive radio, V2X communication, and infotainment head unit designs requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified power management.

Supply support for MC33FS5502Y0KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive power management and functional safety.

The FS5502 product line targets high-performance automotive infotainment and ADAS subsystems, delivering scalable, AEC-Q100 qualified PMICs with configurable sequencing, robust EMC behavior, and fail-safe supervision for radio, radar, and V2X platforms.

FAQ

What is the primary function of the MC33FS5502Y0KS in automotive systems?

The MC33FS5502Y0KS serves as a high-voltage, multi-rail power management IC optimized for automotive radio and radar applications. It integrates a VPRE synchronous buck controller (up to 10 A), two low-voltage synchronous buck converters (BUCK1 and BUCK3, each up to 3.6 A), and one linear regulator (LDO1, up to 400 mA), all managed via OTP-programmable sequencing and I²C interface. Its AEC-Q100 Grade 1 qualification and fail-safe state machine make it suitable for demanding under-hood and infotainment environments.

How does the MC33FS5502Y0KS support electromagnetic compatibility (EMC) in sensitive RF designs?

The MC33FS5502Y0KS incorporates multiple hardware-level EMC techniques: external frequency synchronization (FIN input and FOUT output) to align switching edges across multiple PMICs or with master clocks; spread-spectrum modulation to reduce peak emissions; and slew-rate control on switching nodes. These features collectively lower broadband noise in the 150 kHz–108 MHz band, critical for AM/FM/DAB radio reception and 77 GHz radar front-end integrity.

What is the role of the PSYNC pin on the MC33FS5502Y0KS?

The PSYNC pin on the MC33FS5502Y0KS is a bidirectional power synchronization interface used to coordinate startup and shutdown sequences between multiple PMICs. When configured as input, it halts the MC33FS5502Y0KS power-up sequence before VPRE activation until an external signal (e.g., from another FS5502 or FS85) is asserted. As output, it signals readiness to companion devices. External pull-up to VBOS is mandatory for proper operation.

Can the MC33FS5502Y0KS be used without OTP programming?

Yes, the MC33FS5502Y0KS (Y0 suffix) ships with unprogrammed OTP memory and enters a default configuration on power-up: VPRE enabled, BUCK1/BUCK3/LDO1 disabled, and minimal monitoring active. Full functionality-including regulator enablement, voltage settings, sequencing order, and protection thresholds-requires OTP programming via I²C in debug mode (DBG pin asserted) using NXP FlexGUI tools. This makes Y0KS ideal for engineering evaluation and custom configuration.

What are the mandatory connections for reliable operation of the MC33FS5502Y0KS?

Mandatory connections for the MC33FS5502Y0KS include: reverse-battery protection diodes on VSUP1 and VSUP2; external pull-up to VDDIO on PGOOD and RSTB; connection of VCOREMON to BUCK1 output; tie of VBOOST to PRE_FB; and soldering of the exposed pad (EP) to a solid GND thermal plane. Additionally, DBG pin must be connected per debug requirements, and WAKE1/WAKE2 require external pull-down resistors when unused to prevent spurious wake events.

MC33FS5502Y0KS Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 56-VFQFN Exposed Pad

Packaging:: Tray

Product Status:: Active

Applications:: SMPS Start-Up

Current - Supply:: -

Voltage - Supply:: 60V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: 56-HVQFN (8x8)

MC33FS5502Y0KS FAQ

1.How can I place an order for MC33FS5502Y0KS through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33FS5502Y0KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33FS5502Y0KS reliable?

The price and inventory of MC33FS5502Y0KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS5502Y0KS is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS5502Y0KS transactions.

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MC33FS5502Y0KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33FS5502Y0KS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33FS5502Y0KS?

For technical support, including MC33FS5502Y0KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS5502Y0KS requirements.

6.How does Aetrix verify that MC33FS5502Y0KS is sourced from the original manufacturer or authorized distributors?

All MC33FS5502Y0KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS5502Y0KS meets industry standards.

7.What is the process for return or replacement of MC33FS5502Y0KS?

All MC33FS5502Y0KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS5502Y0KS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33FS5502Y0KS part is unused and in its original packaging.

Return procedure for MC33FS5502Y0KS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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