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NXP Semiconductors MC33FS5502Y0KSR2
- Part No.:
- MC33FS5502Y0KSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS5502Y0KSR2.pdf
- Description:
- HIGH VOLTAGE POWER MANAGEMENT IC
- Quantity:
- Payment:
- Shipping:
Inventory:2,980
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Product details
Overview
MC33FS5502Y0KSR2 from NXP Semiconductors is an AEC-Q100 Grade 1 automotive high-voltage PMIC for radio and radar systems, integrating a VPRE synchronous buck controller (up to 10 A peak), two low-voltage synchronous buck converters (BUCK1 and BUCK3, each up to 3.6 A peak), and one linear regulator (LDO1, up to 400 mA DC). It supports I²C configuration, frequency synchronization (FIN/FOUT), power sequencing via OTP, and operates from 60 V DC input.
For engineers reviewing the MC33FS5502Y0KSR2 datasheet, MC33FS5502Y0KSR2 pinout, MC33FS5502Y0KSR2 application, or MC33FS5502Y0KSR2 equivalent, key selection criteria include its 60 V input capability, dual-buck + LDO + VPRE controller architecture, HVQFN56 package with wettable flanks, AEC-Q100 qualification, and support for ASIL-B–compatible system partitioning via PSYNC and fail-safe state machine.
Technical Context
The MC33FS5502Y0KSR2 implements a dual-state-machine architecture: a main state machine managing power-up sequencing (VPRE → BUCK1/BUCK3/LDO1 in seven configurable slots), standby entry/exit, and I²C control; and a fail-safe state machine independently monitoring VBOS, VPRE, VSUP, and regulators to assert PGOOD/RSTB on fault. Power sequencing delay per slot is configurable to 250 µs or 1 ms via OTP.
It features hardware-level EMC optimization including spread-spectrum modulation, slew-rate control, manual frequency tuning, and external FIN/FOUT synchronization. The device supports debug mode via DBG pin (4.5–5.5 V threshold, 7 ms filter), enabling OTP emulation/programming using NXP FlexGUI and socket EVB during engineering development.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports 12 V and 24 V automotive battery rails with reverse-battery protection diode required on VSUP1/VSUP2. |
| VPRE Controller Output | Configurable output voltage/frequency/current - drives external MOSFETs for high-power pre-regulation up to 10 A peak. |
| BUCK1 Converter | Integrated synchronous buck for MCU core supply - SVS-capable, configurable output voltage, up to 3.6 A peak. |
| BUCK3 Converter | Integrated synchronous buck for MMIC/radio RF supply - configurable output voltage, up to 3.6 A peak. |
| LDO1 Regulator | Linear regulator for MCU I/Os and ADC - configurable output voltage, up to 400 mA DC output. |
| Standby Current | 10 µA typical - enables ultra-low-power sleep mode for always-on wake-up applications. |
| AEC-Q100 Qualification | Grade 1 (−40 °C to +125 °C ambient), MSL3 - qualified for under-hood automotive environments. |
Pinout & Package
HVQFN56 package (SOT684-23), plastic thermally enhanced very thin quad flat no-lead with wettable flanks (dimple type for KS suffix); exposed pad (EP) connected to BUCK1/BUCK3 low-side GNDs and mandatory for thermal and electrical performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | High-voltage input supplies | Main 60 V DC inputs requiring external reverse-battery protection diodes. |
| VPRE_FB / PRE_CSP / PRE_COMP / PRE_GHS / PRE_GLS / PRE_SW / PRE_BOOT / VBOS / VBOOST | VPRE controller interface | Supports external high-side/low-side gate drive, feedback, current sense, bootstrap, and best-of-supply output. |
| BUCK1_IN / BUCK1_SW / BUCK1_FB / VCOREMON | Core supply regulation | Inputs, switching node, feedback, and monitoring for MCU core rail (BUCK1). |
| BUCK3_IN / BUCK3_SW / BUCK3_FB / BUCK3_INQ | RF/MMIC supply regulation | Inputs, switching node, feedback, and quiet-input for low-noise radar/radio supply (BUCK3). |
| LDO1_IN / LDO1 | Linear regulator interface | Input and output for MCU I/O and ADC supply rail with 400 mA capability. |
| SCL / SDA / VDDI2C | I²C communication interface | Standard bidirectional I²C bus with dedicated 3.3 V-compatible I/O supply. |
| WAKE1 / WAKE2 | Wake-up detection inputs | Analog/digital wake sources with internal pull-down; require external series resistor if used as global pins. |
| PGOOD / RSTB / INTB | Fault and status outputs | Active-low power-good, reset, and interrupt signals with mandatory VDDIO pull-up. |
| FIN / FOUT / PSYNC | Timing synchronization | Frequency sync input/output and power-sync I/O for multi-PMIC coordination and EMC optimization. |
| GND / EP | Ground reference | Multiple GND pins and exposed thermal pad tied to BUCK1/BUCK3 low-side switches. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmable power sequencing | Seven configurable startup slots with 250 µs or 1 ms inter-slot delay - enables precise ramp timing for mixed-core/radio systems. |
| Dual independent state machines | Main state machine handles sequencing and I²C control; fail-safe state machine autonomously monitors voltages and asserts RSTB/PGOOD without software dependency. |
| EMC-optimized switching | Integrated spread-spectrum, slew-rate control, and external FIN/FOUT sync - reduces radiated emissions in sensitive RF modules. |
| Debug-mode OTP emulation | DBG pin entry (4.5–5.5 V, 7 ms filter) enables real-time OTP configuration testing via I²C address 0x20/0x21 - accelerates engineering validation. |
| Fail-safe voltage supervision | Three dedicated monitoring circuits (VMON1, VCOREMON, VBOS) with programmable thresholds - provides hardware-level fault response for ASIL-B systems. |
| Low-power standby operation | 10 µA typical sleep current with wake-on-WAKE1/WAKE2 - supports always-on infotainment and V2X telematics. |
Applications
| Automotive Radio Systems | V2X Communication Modules |
|---|---|
Use Scenario: Power management for AM/FM/DAB receivers and digital signal processors in head units. IC Role / Device Role / Timing Role: Primary PMIC supplying VPRE (for tuner front-end), BUCK1 (for DSP core), BUCK3 (for RF transceiver), and LDO1 (for audio codec I/O). Use Value: Integrated multi-rail architecture eliminates discrete regulators, reducing BOM count and PCB area while meeting CISPR-25 Class 5 EMC requirements via synchronized switching. |
Use Scenario: Power delivery for DSRC/WAVE or C-V2X modems in roadside units and vehicle telematics gateways. IC Role / Device Role / Timing Role: High-reliability power source with fail-safe monitoring for modem SoCs, GNSS receivers, and secure boot peripherals. Use Value: AEC-Q100 Grade 1 qualification and autonomous RSTB assertion on VSUP undervoltage ensure continuous network availability during cold-cranking events. |
| Automotive Infotainment ECUs | Radar Signal Processing Units |
Use Scenario: Centralized power solution for multi-core application processors, display controllers, and touch interfaces. IC Role / Device Role / Timing Role: Configurable BUCK1 (core), BUCK3 (GPU/memory), LDO1 (interface I/O), and VPRE (system-level pre-regulation). Use Value: OTP-based sequencing ensures deterministic power-up order across heterogeneous subsystems, preventing lockup during boot. |
Use Scenario: Powering 77 GHz radar MMICs, ADCs, and FPGA-based beamforming engines in ADAS front/rear radar modules. IC Role / Device Role / Timing Role: Low-noise BUCK3 with BUCK3_INQ quiet input and LDO1 for analog sensor interfaces; VPRE for high-current bias rails. Use Value: Dedicated quiet input and spread-spectrum control minimize switching noise coupling into sensitive RF receive paths, preserving SNR. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage automotive PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS5502Y3KSR2 | Pre-programmed OTP configuration (Y3) vs. blank OTP (Y0); identical pinout, package, and electrical specs. | Y3 variant ships with factory-configured sequencing and default voltage settings; Y0 requires customer OTP programming. | Select Y0 for full customization during development; choose Y3 for faster time-to-test with validated defaults. |
| MC33FS8402Y0KSR2 | ASIL-B–qualified variant of FS5502 family; same architecture but with enhanced diagnostic coverage and FIT rate reporting. | Required where ISO 26262 ASIL-B compliance must be formally documented; not needed for non-safety-critical radio/V2X functions. | Use FS8402 when functional safety certification is mandated; retain FS5502Y0KSR2 for cost-optimized, non-ASIL designs. |
Compared with MC33FS5502Y3KSR2, the Y0 version offers full OTP flexibility at the cost of added programming effort; versus MC33FS8402Y0KSR2, it provides identical functionality without ASIL-B diagnostics overhead-making it optimal for cost-sensitive, high-volume automotive infotainment and radar power systems.
Availability
MC33FS5502Y0KSR2 is available at Aetrix Electronics and suitable for automotive radio, V2X communication, and infotainment ECUs requiring stable component supply, AEC-Q100-compliant sourcing, and long-term production continuity.
Supply support for MC33FS5502Y0KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive power management and functional safety.
The FS5502 product line delivers high-voltage, multi-rail PMICs optimized for automotive radio, radar, and infotainment systems-designed to simplify power architecture, reduce EMI, and accelerate ASIL-B system integration.
FAQ
What is the primary function of the MC33FS5502Y0KSR2 in automotive systems?
The MC33FS5502Y0KSR2 serves as a high-voltage, multi-output power management IC for automotive radio, radar, and infotainment systems. It integrates a VPRE buck controller, two synchronous buck converters (BUCK1 and BUCK3), and one LDO to deliver tightly regulated rails from a 60 V DC input. Its dual-state-machine architecture ensures robust power sequencing and fail-safe monitoring, making it ideal for demanding under-hood applications.
How does the MC33FS5502Y0KSR2 support electromagnetic compatibility (EMC) in RF-sensitive designs?
The MC33FS5502Y0KSR2 supports EMC through multiple hardware features: external FIN/FOUT synchronization for multi-PMIC phase alignment, integrated spread-spectrum modulation, adjustable slew-rate control on switching nodes, and manual frequency tuning. These capabilities collectively reduce peak radiated emissions-critical for coexistence with 77 GHz radar and DAB/HD Radio receivers.
What is the role of the PSYNC pin on the MC33FS5502Y0KSR2?
The PSYNC pin on the MC33FS5502Y0KSR2 enables hardware-coordinated power sequencing between multiple PMICs. When pulled up to VBOS, it allows the device to pause its power-up sequence before or after VPRE activation and wait for an external PMIC's readiness signal. This prevents voltage rail contention and ensures deterministic startup across complex multi-PMIC power domains.
Can the MC33FS5502Y0KSR2 operate in low-power standby mode, and how is wake-up managed?
Yes, the MC33FS5502Y0KSR2 supports ultra-low-power standby mode with 10 µA typical sleep current. Wake-up is managed via two dedicated inputs-WAKE1 and WAKE2-which accept analog or digital signals. Each requires an external series resistor if configured as a global wake pin, and both support programmable enable/disable via I²C register M_MODE.
What packaging and thermal considerations apply to the MC33FS5502Y0KSR2?
The MC33FS5502Y0KSR2 uses the HVQFN56 (SOT684-23) package with dimple-type wettable flanks-recommended for new designs per NXP documentation. Its exposed pad (EP) is electrically and thermally connected to BUCK1/BUCK3 low-side GNDs and must be soldered to a large PCB copper pour for effective heat dissipation and EMI suppression.
MC33FS5502Y0KSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- SMPS Start-Up
- Current - Supply:
- -
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS5502Y0KSR2 FAQ
1.How can I place an order for MC33FS5502Y0KSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS5502Y0KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS5502Y0KSR2 reliable?
The price and inventory of MC33FS5502Y0KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS5502Y0KSR2 is usually 5 days.
3.What payment methods are accepted for MC33FS5502Y0KSR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS5502Y0KSR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS5502Y0KSR2?
MC33FS5502Y0KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS5502Y0KSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS5502Y0KSR2?
For technical support, including MC33FS5502Y0KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS5502Y0KSR2 requirements.
6.How does Aetrix verify that MC33FS5502Y0KSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS5502Y0KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS5502Y0KSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS5502Y0KSR2?
All MC33FS5502Y0KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS5502Y0KSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS5502Y0KSR2 part is unused and in its original packaging.
Return procedure for MC33FS5502Y0KSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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