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NXP Semiconductors MC33FS5502Y3KS
- Part No.:
- MC33FS5502Y3KS
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS5502Y3KS.pdf
- Description:
- HIGH VOLTAGE POWER MANAGEMENT IC
- Quantity:
- Payment:
- Shipping:
Inventory:4,204
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Product details
Overview
MC33FS5502Y3KS from NXP Semiconductors is an automotive-grade high-voltage PMIC with integrated VPRE synchronous buck controller (up to 10 A peak), dual low-voltage synchronous buck converters (BUCK1 and BUCK3, each up to 3.6 A peak), and one configurable LDO (400 mA DC) - all qualified to AEC-Q100 Grade 1 for radio and radar power supply applications.
For engineers reviewing the MC33FS5502Y3KS datasheet, MC33FS5502Y3KS pinout, MC33FS5502Y3KS application, or MC33FS5502Y3KS equivalent, key selection criteria include OTP-configurable power-up sequencing across seven slots, I²C-controlled regulation with CRC, external frequency synchronization (FIN/FOUT), EMC-optimized spread-spectrum and slew-rate control, and fail-safe voltage monitoring with PGOOD/RSTB outputs.
Technical Context
The MC33FS5502Y3KS implements a dual-state-machine architecture: a main state machine managing power sequencing (VPRE → BUCK1/BUCK3/LDO1 in OTP-defined slots) and standby transitions, and a fail-safe state machine independently supervising VBOS, VPRE, VSUP, and VCOREMON with autonomous RSTB/PGOOD assertion. Power-up sequencing supports 250 µs or 1 ms slot delays, and VPRE shutdown delay is programmable from 250 µs to 32 ms via OTP.
It features hardware-level wake-up detection on WAKE1/WAKE2 pins (with external series resistors required), debug mode entry via DBG pin at 4.5–5.5 V after ≥7 ms filtering, and I²C address fixed to 0x20 (main domain) and 0x21 (fail-safe domain) in debug mode. All regulators support overcurrent, overtemperature, and undervoltage/overvoltage fault reporting via dedicated flag registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max input supports 12 V and 24 V automotive battery rails with reverse-battery protection diodes required on VSUP1/VSUP2. |
| VPRE Controller Output | External MOSFET-based synchronous buck; configurable output voltage, switching frequency, and up to 10 A peak current capability. |
| BUCK1 Output | Integrated synchronous buck for MCU core supply; SVS-capable, configurable voltage, up to 3.6 A peak, dedicated VCOREMON feedback input. |
| BUCK3 Output | Integrated synchronous buck for MMIC/radio RF stages; configurable voltage, up to 3.6 A peak, quiet-input (BUCK3_INQ) option for noise-sensitive loads. |
| LDO1 Output | Linear regulator for MCU I/Os and ADC supply; configurable output voltage, up to 400 mA DC, external physical layer interface. |
| Standby Current | 10 µA typical OFF-mode sleep current enables ultra-low-power vehicle keep-alive operation. |
| AEC-Q100 Qualification | Grade 1 (−40 °C to +125 °C ambient), MSL3, compliant with automotive reliability and thermal stress requirements. |
Pinout & Package
HVQFN56 package (SOT684-23), plastic thermally enhanced very thin quad flat no-lead with wettable flanks (dimple type for KS suffix); exposed pad (EP) serves as common GND for BUCK1 and BUCK3 low-side switches.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| WAKE1 / WAKE2 | Wake-up input (A_IN/D_IN) | Asynchronous global wake sources; require external series resistor if used as global pins; pull-down to GND when unused. |
| VPRE_FB / PRE_CSP / PRE_GHS / PRE_GLS / PRE_SW / PRE_BOOT | VPRE controller interface | Supports external high-side/low-side gate drive, bootstrap, current sense, and feedback; configuration-dependent usage per OTP mapping. |
| BUCK1_FB / BUCK1_IN / BUCK1_SW / VCOREMON | Core supply regulation loop | Enables closed-loop control of MCU core rail; VCOREMON must be connected directly to BUCK1 output for SVS monitoring. |
| BUCK3_FB / BUCK3_IN / BUCK3_INQ / BUCK3_SW | RF/low-noise supply regulation loop | BUCK3_INQ provides separate quiet input path to reduce coupling into sensitive RF loads like MMICs. |
| LDO1 / LDO1_IN | Linear regulator output/input | LDO1 supplies MCU I/Os and ADC reference; LDO1_IN accepts filtered input to minimize noise injection. |
| SCL / SDA / VDDI2C | I²C interface | Standard two-wire bus with CRC-protected commands; VDDI2C decouples I²C buffers from main supply for voltage compatibility. |
| FIN / FOUT / PSYNC | Frequency & power synchronization | FIN accepts external clock (e.g., from MCU or crystal oscillator); FOUT provides synchronized output; PSYNC enables coordinated startup/shutdown with other PMICs. |
| PGOOD / RSTB / INTB | Fault signaling outputs | Active-low open-drain outputs requiring external pull-up to VDDIO; RSTB resets MCU; INTB signals register-accessible events (OC, OT, UV/OV). |
| VMON1 / VSUP1 / VSUP2 / VBOS | Supply monitoring inputs | VMON1 monitors external rail; VSUP1/VSUP2 are primary HV inputs; VBOS is best-of-supply output used for internal bias and PSYNC pull-up. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configurable power sequencing | Seven programmable slots with 250 µs or 1 ms inter-slot delay enable precise ramp timing for mixed-signal SoCs and RF subsystems. |
| EMC-optimized switching | Integrated spread-spectrum modulation, slew-rate control, and manual frequency tuning reduce radiated emissions without external components. |
| I²C with CRC and dual-domain access | Separate main (0x20) and fail-safe (0x21) I²C addresses with CRC validation ensure robust communication and independent fault management. |
| Fail-safe voltage supervision | Dedicated analog comparators monitor VBOS, VPRE, VSUP, and VCOREMON; assert PGOOD/RSTB autonomously without MCU intervention. |
| Debug mode with OTP emulation | DBG pin entry enables engineering-mode I²C reconfiguration and OTP emulation using NXP FlexGUI, supporting rapid prototyping without mask changes. |
Applications
| Automotive Radio Power Supply | V2X Communication Module |
|---|---|
Use Scenario: High-efficiency, low-noise power delivery to multi-band AM/FM/DAB/SDARS radio SoCs with analog front-end and digital baseband sections. IC Role / Device Role / Timing Role: Primary PMIC providing sequenced VPRE (for tuner), BUCK1 (SoC core), BUCK3 (RF front-end), and LDO1 (ADC/I/O) with EMI-controlled switching. Use Value: BUCK3_INQ input isolates RF supply noise from digital domains; spread-spectrum reduces interference in adjacent FM bands. | Use Scenario: Power management for DSRC/WAVE or C-V2X modules operating in harsh automotive environments with wide battery voltage swings. IC Role / Device Role / Timing Role: High-voltage input handling (up to 60 V) with reverse-battery protection, wake-on-RF-event via WAKE1/WAKE2, and fail-safe reset during brownout. Use Value: 10 µA standby current extends battery life during vehicle sleep; AEC-Q100 Grade 1 ensures reliability across −40 °C to +125 °C. |
| Automotive Radar Power Supply | Infotainment Head Unit |
Use Scenario: Stable, low-ripple power to 77 GHz radar transceivers and DSP processors requiring tight voltage tolerance and fast transient response. IC Role / Device Role / Timing Role: Dual-buck architecture delivers independent, tightly regulated rails: BUCK1 for DSP core (SVS-enabled), BUCK3 for MMIC (quiet-input configured). Use Value: VCOREMON feedback enables real-time core voltage margining; programmable soft-start prevents inrush-induced system reset. | Use Scenario: Centralized power solution for multi-processor infotainment systems integrating application processor, GPU, audio codec, and display drivers. IC Role / Device Role / Timing Role: Multi-rail PMIC coordinating power-up/down sequencing across heterogeneous subsystems via OTP and I²C runtime control. Use Value: PSYNC pin synchronizes with companion PMICs (e.g., FS85) to eliminate simultaneous inrush currents and meet OEM EMC limits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage automotive PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS5502Y0KS | Same HVQFN56 package and pinout; unprogrammed OTP configuration requiring full custom OTP programming for production use. | Requires engineering effort to define power sequencing, voltages, and protections; not suitable for drop-in replacement without OTP customization. | Select Y0KS only for new designs where full OTP flexibility is needed and NXP FlexGUI toolchain is available. |
| MC33FS8502Y3KS | ASIL-D capable variant with additional safety mechanisms (lockstep cores, memory ECC, enhanced diagnostics); identical pinout and basic regulator architecture. | Required for ASIL-D safety-critical functions (e.g., ADAS domain controllers); higher BOM cost and qualification overhead vs. ASIL-B FS5502. | Choose FS8502 only when ISO 26262 ASIL-D compliance is mandated; otherwise FS5502Y3KS offers optimal cost/performance for radio/radar. |
Compared with MC33FS5502Y0KS, the Y3KS variant ships with pre-programmed OTP settings enabling immediate evaluation and reduced time-to-test; compared with MC33FS8502Y3KS, it omits ASIL-D safety hardware but retains identical power architecture, footprint, and feature set for non-safety-critical infotainment and V2X applications.
Availability
MC33FS5502Y3KS is available at Aetrix Electronics and suitable for automotive radio, V2X communication, and radar power supply applications requiring stable component supply, AEC-Q100-compliant sourcing, and long-term industrial lifecycle support.
Supply support for MC33FS5502Y3KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with leadership in automotive power management and functional safety.
The FS5502 product line is designed specifically for high-voltage, multi-rail automotive power delivery in radio, radar, and infotainment systems - emphasizing EMC robustness, OTP configurability, and fail-safe supervision without MCU dependency.
FAQ
What is the function of the PSYNC pin on the MC33FS5502Y3KS?
The PSYNC pin on the MC33FS5502Y3KS enables hardware-synchronized power-up and power-down sequencing between multiple PMICs. When pulled up to VBOS, it allows the MC33FS5502Y3KS to pause its OTP-defined power sequence (e.g., before or after VPRE activation) and wait for an external signal - such as from an FS85 or another FS5502 - before proceeding. This eliminates simultaneous inrush currents and improves system-level EMC performance.
How does the MC33FS5502Y3KS support fail-safe operation without MCU involvement?
The MC33FS5502Y3KS incorporates a dedicated fail-safe state machine that independently monitors VBOS, VPRE, VSUP, and VCOREMON voltages. If any monitored rail violates its UV/OV threshold, the fail-safe logic asserts RSTB and PGOOD outputs within microseconds - regardless of MCU status or I²C activity. This autonomous response ensures deterministic reset behavior during critical power faults, meeting ASIL-B requirements.
Can the MC33FS5502Y3KS be used in both 12 V and 24 V automotive systems?
Yes, the MC33FS5502Y3KS supports input voltages up to 60 V DC and is explicitly qualified for both 12 V and 24 V automotive battery architectures. Reverse-battery protection diodes must be placed in series with VSUP1 and VSUP2 inputs per the datasheet. Its wide input range and AEC-Q100 Grade 1 rating make it suitable for passenger cars, commercial vehicles, and off-road equipment.
What is the purpose of the BUCK3_INQ pin on the MC33FS5502Y3KS?
The BUCK3_INQ (BUCK3 Quiet Input) pin on the MC33FS5502Y3KS provides a separate, low-noise input path for the BUCK3 converter, decoupled from the main BUCK3_IN supply. This isolation minimizes switching noise coupling into sensitive RF loads - such as radar MMICs or radio tuners - improving signal integrity and reducing spurious emissions in high-frequency applications.
Is the MC33FS5502Y3KS pin-compatible with other devices in the FS5502/FS84/FS85 family?
Yes, the MC33FS5502Y3KS is pin-to-pin and software-compatible with the FS84 (ASIL-B) and FS85 (ASIL-D) families per the official NXP documentation. This enables scalable design reuse: the same PCB layout and firmware can be adapted across safety levels by swapping the PMIC, provided OTP configurations and safety mechanisms are updated accordingly.
MC33FS5502Y3KS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- SMPS Start-Up
- Current - Supply:
- -
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS5502Y3KS FAQ
1.How can I place an order for MC33FS5502Y3KS through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS5502Y3KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS5502Y3KS reliable?
The price and inventory of MC33FS5502Y3KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS5502Y3KS is usually 5 days.
3.What payment methods are accepted for MC33FS5502Y3KS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS5502Y3KS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS5502Y3KS?
MC33FS5502Y3KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS5502Y3KS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS5502Y3KS?
For technical support, including MC33FS5502Y3KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS5502Y3KS requirements.
6.How does Aetrix verify that MC33FS5502Y3KS is sourced from the original manufacturer or authorized distributors?
All MC33FS5502Y3KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS5502Y3KS meets industry standards.
7.What is the process for return or replacement of MC33FS5502Y3KS?
All MC33FS5502Y3KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS5502Y3KS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS5502Y3KS part is unused and in its original packaging.
Return procedure for MC33FS5502Y3KS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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