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NXP Semiconductors MC33FS5502Y3KSR2
- Part No.:
- MC33FS5502Y3KSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS5502Y3KSR2.pdf
- Description:
- HIGH VOLTAGE POWER MANAGEMENT IC
- Quantity:
- Payment:
- Shipping:
Inventory:3,207
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Product details
Overview
MC33FS5502Y3KSR2 from NXP Semiconductors is an AEC-Q100 Grade 1 automotive high-voltage PMIC for radio and radar systems, integrating a 60 V VPRE synchronous buck controller (up to 10 A peak), two low-voltage synchronous buck converters (BUCK1 and BUCK3, each up to 3.6 A peak), and one 400 mA LDO for MCU I/O and ADC supply. It supports I²C configuration, frequency synchronization (FIN/FOUT), power sequencing via OTP, and operates across −40 °C to 125 °C.
For engineers reviewing the MC33FS5502Y3KSR2 datasheet, MC33FS5502Y3KSR2 pinout, MC33FS5502Y3KSR2 application, or MC33FS5502Y3KSR2 equivalent, key selection considerations include its HVQFN56 package with wettable flanks, ASIL-B-compatible platform alignment, VPRE external MOSFET control architecture, sleep current of 10 μA typ, and integrated voltage monitoring with PGOOD/RSTB outputs.
Technical Context
The MC33FS5502Y3KSR2 implements a dual-state-machine architecture: a main state machine managing power-up sequencing (VPRE-first, then BUCK1/BUCK3/LDO1 across seven configurable slots) and standby transitions, and a fail-safe state machine handling independent voltage supervision with dedicated RSTB and PGOOD assertion logic. Power sequencing delay per slot is configurable to 250 µs or 1 ms via OTP.
It features hardware-level EMC optimization including spread-spectrum modulation, slew-rate control, manual frequency tuning, and external clock synchronization (FIN input, FOUT output). Device control occurs over I²C with CRC protection, and OTP programming enables custom startup configurations, SVS capability for BUCK1, and wake-up detection on WAKE1/WAKE2 pins with 10 µs filtering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports 12 V and 24 V automotive battery rails with reverse-battery diode requirement on VSUP1/VSUP2. |
| VPRE Controller Output | Configurable; drives external high-side/low-side MOSFETs - enables scalable high-power pre-regulation up to 10 A peak. |
| BUCK1 Output | Up to 3.6 A peak, SVS-capable - dedicated core supply for automotive MCUs with supply voltage supervision. |
| BUCK3 Output | Up to 3.6 A peak - optimized for RF MMIC or radar front-end biasing, with quiet input (BUCK3_INQ) support. |
| LDO1 Output | 400 mA DC, configurable voltage - supplies MCU I/O banks and analog subsystems (e.g., ADC reference) with low-noise regulation. |
| Quiescent Current (OFF mode) | 10 μA typical - enables ultra-low-power standby for always-on vehicle modules like V2X transceivers. |
| AEC-Q100 Qualification | Grade 1 (−40 °C to +125 °C junction), MSL3 - certified for under-hood automotive applications requiring long-term reliability. |
Pinout & Package
HVQFN56 package (SOT684-23), thermally enhanced, wettable flanks (dimple type for KS suffix), 8 mm × 8 mm × 0.85 mm, exposed thermal pad (EP) connected to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| WAKE1 / WAKE2 | Wake-up input (A_IN/D_IN) | Dual independent wake sources with external pull-down; trigger power-up from deep sleep without MCU intervention. |
| VPRE_FB / PRE_CSP / PRE_COMP / PRE_GHS / PRE_GLS / PRE_SW / PRE_BOOT / VBOS / VBOOST | VPRE control and feedback network | Full external gate drive and sensing interface for high-efficiency, high-current pre-regulator stage using discrete MOSFETs. |
| BUCK1_FB / BUCK1_IN / BUCK1_SW / BUCK3_FB / BUCK3_IN / BUCK3_INQ / BUCK3_SW | Integrated buck regulator interfaces | Direct connection points for inductor, output capacitor, and feedback resistors - enables compact layout for core and RF supplies. |
| LDO1 / LDO1_IN | Linear regulator input/output | Low-noise, medium-current rail for sensitive analog circuitry; no external pass transistor required. |
| SCL / SDA / VDDI2C | I²C interface | Configurable digital control bus with CRC protection; fixed address 0x20 in debug mode (DBG = 5 V). |
| PGOOD / RSTB / INTB | Status and control outputs | Active-low open-drain outputs with mandatory VDDIO pull-up - provide sequenced reset, power-good signaling, and fault interrupts to MCU. |
| FIN / FOUT / PSYNC | Timing synchronization | Enables system-level EMC optimization: FIN accepts external clock, FOUT provides synchronized output, PSYNC coordinates multi-PMIC startup. |
| VMON1 / VCOREMON | Voltage monitoring inputs | Dedicated analog inputs for supervising external rails (VMON1) and BUCK1 output (VCOREMON) - feeds fail-safe state machine for autonomous fault response. |
Key Features
| Feature | Design Value |
|---|---|
| OTP-programmable power sequencing | Seven configurable startup slots with 250 µs or 1 ms inter-slot delay - ensures safe, deterministic ramp-up of mixed-voltage domains (e.g., VPRE → BUCK1 → BUCK3 → LDO1). |
| EMC-optimized switching | Integrated spread-spectrum, slew-rate control, and external frequency sync (FIN/FOUT) - reduces radiated emissions in dense RF environments like infotainment head units. |
| Fail-safe voltage supervision | Dedicated analog monitoring circuits with autonomous PGOOD/RSTB assertion - isolates safety-critical responses from main MCU control path. |
| Debug-mode OTP emulation | DBG pin entry (4.5–5.5 V) enables I²C-based OTP reconfiguration during engineering - accelerates validation of custom power-up profiles without mask respins. |
| Multi-PMIC synchronization | PSYNC pin supports daisy-chained or master-slave coordination between two FS5502 devices or FS5502 + external PMIC - eliminates timing skew in multi-rail systems. |
Applications
| Automotive Radio Systems | V2X Communication Modules |
|---|---|
|
Use Scenario: Power management for AM/FM/DAB tuners and digital signal processors in head unit designs. IC Role / Device Role / Timing Role: Primary PMIC delivering regulated rails to RF front-end, DSP core, memory, and audio codecs with precise sequencing. Use Value: Integrated VPRE controller handles 60 V transients; BUCK1's SVS protects DSP core against undervoltage; LDO1 supplies low-noise analog audio paths. |
Use Scenario: Compact, low-quiescent power supply for IEEE 802.11p DSRC or C-V2X modems operating in vehicle-to-everything networks. IC Role / Device Role / Timing Role: Single-chip solution generating isolated, sequenced rails for baseband processor, RF transceiver, and GNSS receiver. Use Value: 10 μA OFF-mode current extends battery backup runtime; FOUT synchronization minimizes channel interference in multi-node deployments. |
| Automotive Radar Front-Ends | Infotainment Application Processors |
|
Use Scenario: Power delivery to 77 GHz radar MMICs, FPGA-based beamformers, and high-speed ADCs in ADAS sensor modules. IC Role / Device Role / Timing Role: High-current BUCK3 supplies MMIC bias; quiet input (BUCK3_INQ) rejects noise from digital domains; VPRE powers intermediate-stage LNA. Use Value: BUCK3's 3.6 A peak and low-noise design meets stringent radar SNR requirements; thermal pad enables conduction cooling in sealed enclosures. |
Use Scenario: Multi-rail power for quad-core ARM-based SoCs in central display units, requiring independent core, GPU, I/O, and DDR supplies. IC Role / Device Role / Timing Role: Configurable BUCK1 (core), BUCK3 (GPU/I/O), and LDO1 (DDR termination) with OTP-defined startup order. Use Value: Seven-slot sequencing accommodates complex SoC power-up requirements; I²C runtime control allows dynamic voltage scaling during operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage automotive PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS5500Y3KSR2 | Same FS5502 family, but lacks VPRE controller - only integrates BUCK1, BUCK3, and LDO1. | Suitable for lower-input-voltage systems (<36 V) where external pre-regulation is handled by discrete circuitry or upstream DC/DC. | Select when VPRE functionality is unnecessary and cost/space optimization is prioritized over 60 V direct battery connection. |
| MPQ4332GSD-AEC1 | Monolithic 36 V input, dual 3 A buck converter with I²C interface - no VPRE, no LDO, no fail-safe monitoring. | Targets non-safety-critical infotainment peripherals; lacks AEC-Q100 Grade 1 rating and autonomous fault response. | Choose for simpler, cost-sensitive designs without radar/radio-level EMC or functional safety requirements. |
Compared with MC33FS5502Y3KSR2, MC33FS5500Y3KSR2 removes VPRE complexity while retaining identical BUCK/LDO performance and sequencing, whereas MPQ4332GSD-AEC1 trades integrated safety and high-voltage capability for smaller footprint and lower BOM count in less demanding applications.
Availability
MC33FS5502Y3KSR2 is available at Aetrix Electronics and suitable for automotive radio, V2X communication, and radar front-end applications requiring stable component supply, AEC-Q100 compliance, and long-term production continuity.
Supply support for MC33FS5502Y3KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, with deep expertise in functional safety and high-reliability power management solutions.
The FS5502 product line was designed specifically for automotive radio and radar systems, emphasizing high-voltage resilience, EMC robustness, and ASIL-B-aligned architecture within NXP's broader FS platform (including FS84/FS85).
FAQ
What is the maximum input voltage supported by the MC33FS5502Y3KSR2?
The MC33FS5502Y3KSR2 supports a maximum input voltage of 60 V DC on its VPRE controller inputs (VSUP1/VSUP2), enabling direct connection to 12 V and 24 V automotive battery rails. External reverse-battery protection diodes are mandatory on both VSUP1 and VSUP2 pins per the datasheet.
Does the MC33FS5502Y3KSR2 include integrated MOSFETs for all its regulators?
No. The MC33FS5502Y3KSR2 integrates synchronous MOSFETs only for BUCK1 and BUCK3. Its VPRE controller is external-MOSFET-based, requiring discrete high-side and low-side FETs. This architecture enables scalable current delivery up to 10 A peak while maintaining thermal flexibility in high-power automotive applications.
How does the MC33FS5502Y3KSR2 handle power sequencing during startup?
The MC33FS5502Y3KSR2 executes a seven-slot OTP-programmable power-up sequence beginning with VPRE, followed by BUCK1, BUCK3, and LDO1 in user-defined order. Slot delays are configurable to 250 µs or 1 ms. The PSYNC pin allows synchronization with other PMICs to coordinate multi-rail system startup without timing skew.
What safety features are implemented in the MC33FS5502Y3KSR2?
The MC33FS5502Y3KSR2 incorporates a dedicated fail-safe state machine with autonomous voltage monitoring (VMON1, VCOREMON), PGOOD and RSTB assertion logic, and fault-triggered DEEP-FS mode. It is qualified to AEC-Q100 Grade 1 and belongs to NXP's ASIL-B-compatible FS platform, though it is not itself ASIL-B-certified.
Can the MC33FS5502Y3KSR2 be configured without OTP programming?
Yes. The MC33FS5502Y3KSR2 supports full runtime configuration via its I²C interface (address 0x20 in normal mode), allowing register-level control of regulators, monitoring, and sequencing. OTP is used for permanent, production-ready settings; engineering prototypes can use debug mode (DBG = 5 V) for emulated OTP behavior without physical programming.
MC33FS5502Y3KSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- SMPS Start-Up
- Current - Supply:
- -
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS5502Y3KSR2 FAQ
1.How can I place an order for MC33FS5502Y3KSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS5502Y3KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS5502Y3KSR2 reliable?
The price and inventory of MC33FS5502Y3KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS5502Y3KSR2 is usually 5 days.
3.What payment methods are accepted for MC33FS5502Y3KSR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS5502Y3KSR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS5502Y3KSR2?
MC33FS5502Y3KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS5502Y3KSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS5502Y3KSR2?
For technical support, including MC33FS5502Y3KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS5502Y3KSR2 requirements.
6.How does Aetrix verify that MC33FS5502Y3KSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS5502Y3KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS5502Y3KSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS5502Y3KSR2?
All MC33FS5502Y3KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS5502Y3KSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS5502Y3KSR2 part is unused and in its original packaging.
Return procedure for MC33FS5502Y3KSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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