My Inquiry
My Account
NXP Semiconductors MC33FS8400G0ES
- Part No.:
- MC33FS8400G0ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8400G0ES.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:3,187
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33FS8400G0ES from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one integrated low-voltage synchronous BUCK1 converter (1.35 V / 2.6 A), two LDOs (LDO1: 5.0 V / 400 mA; LDO2: 5.0 V / 400 mA), and safety monitoring circuitry. It supports radar and vision ECUs requiring functional safety, EMC-optimized power sequencing, and SPI/I²C configuration.
For engineers reviewing the MC33FS8400G0ES datasheet, MC33FS8400G0ES pinout, MC33FS8400G0ES application, or MC33FS8400G0ES equivalent, key selection criteria include its ASIL B compliance, single-BUCK1 + dual-LDO output architecture, 60 V max input, 10 µA OFF-mode quiescent current, and HVQFN56 wettable flank package for automotive thermal and reliability requirements.
Technical Context
The MC33FS8400G0ES implements a hierarchical safety architecture with dedicated fail-safe state machine, challenger watchdog, PGOOD/RSTB outputs, and analog voltage supervision (VCOREMON, VMON1–VMON4). Its power management includes independent sequencing slots, thermal shutdown (TSD) response per regulator, and deep fail-safe autoretry (infinite cycles).
It features external frequency synchronization (FIN/FOUT), spread spectrum modulation, slew rate control, and manual tuning for EMC optimization. Device configuration is performed via OTP programming (non-programmed G0 variant) and runtime control through 32-bit SPI or I²C with CRC, supporting engineering-mode emulation and production programming only by NXP or authorized partners.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ASIL Level | ASIL B compliant per ISO 26262; qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C) |
| Input Voltage Range | 4.9 V to 60 V DC - supports 12 V/24 V automotive battery systems with reverse-battery protection diodes on VSUP1/VSUP2 |
| BUCK1 Output | 1.35 V @ 2.6 A peak; fixed OTP setting; 2.22 MHz switching; soft-start slope 7.81 mV/µs |
| LDO1 / LDO2 | 5.0 V / 400 mA each; configurable via OTP; used for MCU I/O and ADC supply |
| Quiescent Current | 10 µA typical in OFF mode - enables ultra-low-power wake-up readiness for always-on ECU functions |
| Interface | SPI or I²C (0x20 address); 32-bit command structure with CRC for robust register access and fault detection |
| Package | HVQFN56 (8 mm × 8 mm × 0.85 mm); step-cut wettable flank (ES suffix); MSL3; thermal pad (EP) tied to GND |
Pinout & Package
HVQFN56 plastic thermal enhanced very thin quad flat package with 56 terminals, 0.5 mm pitch, 8 mm × 8 mm body, and exposed thermal pad (EP) connected to GNDFS/GND. Wettable flank (ES) enables automated optical solder-joint inspection.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power inputs | Dual 60 V-rated inputs requiring external reverse-battery diodes; feed internal bias and regulators |
| BUCK1_IN / BUCK1_SW / BUCK1_FB | Core supply path | Input, switching node, and feedback for 1.35 V / 2.6 A MCU core rail; requires external inductor and compensation network |
| LDO1 / LDO2 | Linear regulator outputs | 5.0 V / 400 mA regulated outputs for MCU I/O and analog subsystems; low-noise, high-PSRR supply rails |
| VCOREMON / VMON1–VMON4 | Analog monitoring inputs | Four independent voltage supervision channels; VCOREMON monitors BUCK1 output; others monitor external rails or sensors |
| PGOOD / RSTB / FS0B | Safety outputs | Active-low open-drain signals: PGOOD indicates all regulated outputs in spec; RSTB resets MCU; FS0B asserts fail-safe state on critical fault |
| SPI (MISO/MOSI/SCLK/CSB) / I²C (SCL/SDA) | Digital interfaces | Configurable dual-interface bus; supports CRC-protected register read/write and real-time status polling |
| WAKE1 / WAKE2 | Wake-up inputs | Two analog/digital wake sources with external series resistor support; enable low-power sleep exit without MCU intervention |
| EP (exposed pad) | Thermal & ground reference | Internally connected to GNDFS and BUCK1/BUCK2/BUCK3 low-side switches; must be soldered to PCB GND plane for thermal dissipation and noise immunity |
Key Features
| Feature | Design Value |
|---|---|
| Fail-safe state machine | Independent hardware FSM with infinite-deep autoretry, dedicated fail-safe output (FS0B), and configurable fault response per monitored rail |
| EMC optimization | Integrated FIN/FOUT sync, spread spectrum, slew rate control, and manual frequency tuning - reduces radiated emissions in radar/vision bands |
| Power sequencing control | Eight programmable power-up/down slots; enables precise timing of BUCK1, LDO1, LDO2, and external regulators for complex SoC boot sequences |
| Functional safety monitoring | Challenger watchdog, FCCU inputs for MCU error signaling, ABIST/LBIST, and multi-level voltage supervision (OV/UV with adjustable delay) |
| OTP configurability | G0 variant is unprogrammed; supports custom configuration during engineering development using NXP GUI and socketed EVB - production OTP programming restricted to NXP |
Applications
| Radar Sensor Power Management | Vision ECU Core Supply |
|---|---|
Use Scenario: Powers NXP S32R274-based corner radar modules with strict ASIL B compliance and low EMI requirements. IC Role / Device Role / Timing Role: Provides BUCK1 (1.35 V) for MCU core, LDO1/LDO2 (5.0 V) for CAN PHY and ADC, and fail-safe monitoring of all rails. Use Value: Enables deterministic startup, thermal fault containment, and fail-safe assertion within 250 µs - meeting ISO 26262 diagnostic coverage targets. | Use Scenario: Supplies NXP S32V234 vision processor in mono/stereo camera modules with tight voltage accuracy and sequencing. IC Role / Device Role / Timing Role: Delivers regulated 1.35 V core and dual 5.0 V I/O rails; sequences power-up to avoid SoC latch-up during cold start. Use Value: Achieves <±1% output regulation and 7.81 mV/µs soft-start slope - preventing inrush current and ensuring clean SoC initialization. |
| ADAS Domain Controller Auxiliary Rail | Infotainment System Safety Monitor |
Use Scenario: Generates auxiliary 5.0 V rails and supervises power integrity in centralized ADAS domain controllers interfacing with multiple sensor clusters. IC Role / Device Role / Timing Role: Acts as secondary SBC alongside primary PMIC; monitors VCORE, VDDIO, and external supplies via VMON1–VMON4. Use Value: Provides redundant voltage supervision and fail-safe signaling (FS0B) - enabling safe degradation when primary power fails. | Use Scenario: Monitors power health and asserts fail-safe state in infotainment head units with display, audio, and connectivity subsystems. IC Role / Device Role / Timing Role: Supplies LDO1/LDO2 for audio codec and display interface; uses PGOOD/RSTB to coordinate system reset and safe shutdown. Use Value: Maintains 10 µA OFF-mode current and wake-on-WAKE1/WAKE2 - preserving battery life while enabling instant-on functionality. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fail-safe power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8405G0ES | Includes FCCU (functional safety communication unit) and four VMON inputs vs. two in MC33FS8400G0ES; same ASIL B rating and pinout | Required for designs needing MCU error reporting via FCCU1/FCCU2 pins and extended voltage monitoring coverage | Select MC33FS8405G0ES when full ASIL B diagnostic coverage including MCU health reporting is mandated |
| MC33FS8410G0ES | Adds BUCK3 (1.8 V / 4.5 A) and third VMON channel; retains identical package, interface, and safety architecture | Suitable for multi-rail SoCs requiring three independent low-voltage domains (e.g., CPU + GPU + memory) | Choose MC33FS8410G0ES when BUCK3 is needed for additional core or memory supply beyond BUCK1 + dual LDOs |
Compared with MC33FS8405G0ES and MC33FS8410G0ES, the MC33FS8400G0ES offers the minimal ASIL B SBC configuration - optimized for cost-sensitive radar/vision ECUs where only one BUCK and dual LDOs are required, with no need for FCCU or third buck stage.
Availability
MC33FS8400G0ES is available at Aetrix Electronics and suitable for radar sensor modules, vision ECUs, and ADAS domain controllers requiring stable component supply, automotive-grade qualification, and long-term lifecycle support.
Supply support for MC33FS8400G0ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The FS84 product line delivers ASIL B–certified system basis chips targeting radar, vision, and ADAS ECUs - designed to integrate power management, functional safety, and EMC-robust communication in a single HVQFN package.
FAQ
What safety standard compliance does the MC33FS8400G0ES meet?
The MC33FS8400G0ES is developed in compliance with ISO 26262 for ASIL B applications and qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C ambient). It includes built-in self-test (ABIST/LBIST), challenger watchdog, and fail-safe state machine - all documented in the FS84_FS85C product data sheet Rev. 12.0. The MC33FS8400G0ES implements hardware-enforced safety mechanisms without requiring software intervention for basic fault responses.
Does the MC33FS8400G0ES support both SPI and I²C interfaces simultaneously?
No, the MC33FS8400G0ES supports either SPI or I²C - not both concurrently. Interface selection is determined at power-up by the state of the DBG pin. When DBG is pulled high, SPI mode activates (MISO/MOSI/SCLK/CSB active); when DBG is low, I²C mode engages (SCL/SDA active). The MC33FS8400G0ES uses a shared 32-bit command structure and CRC protection in both modes for consistent register access and fault detection.
What is the function of the PSYNC pin on the MC33FS8400G0ES?
The PSYNC pin on the MC33FS8400G0ES serves as a bidirectional power synchronization signal. In master mode, it outputs a clock to synchronize switching frequencies across multiple MC33FS8400G0ES devices or with external PMICs. In slave mode, it accepts an external clock to align internal SMPS operation - reducing beat frequencies and improving system-level EMC performance. The MC33FS8400G0ES does not require external components for PSYNC operation and supports automatic direction detection.
Can the MC33FS8400G0ES operate with only one power supply input?
Yes, the MC33FS8400G0ES can operate using only VSUP1; VSUP2 is optional and intended for redundancy or split-battery architectures. When using a single supply, VSUP2 must be connected to VSUP1 through a 0 Ω resistor or short trace. Both inputs accept 4.9 V to 60 V and require external reverse-battery protection diodes - a design requirement explicitly stated in the FS84_FS85C datasheet Section 7.2 for VSUP1 and VSUP2.
How is OTP programming handled for the MC33FS8400G0ES?
The MC33FS8400G0ES is shipped as a non-programmed OTP variant (G0). Customers may perform OTP emulation and configuration during engineering development using NXP's official GUI and socketed evaluation board. However, production OTP programming is strictly restricted to NXP or NXP-authorized third parties - customer programming for volume production is prohibited per the FS84_FS85C datasheet Section 4.1. The MC33FS8400G0ES supports runtime configuration via SPI/I²C for all non-OTP parameters including voltage settings and sequencing slots.
MC33FS8400G0ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8400G0ES FAQ
1.How can I place an order for MC33FS8400G0ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8400G0ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8400G0ES reliable?
The price and inventory of MC33FS8400G0ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8400G0ES is usually 5 days.
3.What payment methods are accepted for MC33FS8400G0ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8400G0ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8400G0ES?
MC33FS8400G0ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8400G0ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8400G0ES?
For technical support, including MC33FS8400G0ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8400G0ES requirements.
6.How does Aetrix verify that MC33FS8400G0ES is sourced from the original manufacturer or authorized distributors?
All MC33FS8400G0ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8400G0ES meets industry standards.
7.What is the process for return or replacement of MC33FS8400G0ES?
All MC33FS8400G0ES units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8400G0ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8400G0ES part is unused and in its original packaging.
Return procedure for MC33FS8400G0ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33FS8400G0ES Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
