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NXP Semiconductors MC33FS8400G0ESR2
- Part No.:
- MC33FS8400G0ESR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8400G0ESR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,862
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Product details
Overview
MC33FS8400G0ESR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one integrated low-voltage synchronous BUCK1 converter (1.35 V / 2.6 A), two LDOs (LDO1: 5.0 V / 400 mA; LDO2: 5.0 V / 400 mA), and safety monitoring circuitry. It supports radar and vision ECUs requiring functional safety, EMC-optimized power sequencing, and SPI/I²C configuration in 12 V/24 V vehicle architectures.
For engineers reviewing the MC33FS8400G0ESR2 datasheet, MC33FS8400G0ESR2 pinout, MC33FS8400G0ESR2 application, or MC33FS8400G0ESR2 equivalent, this device delivers deterministic power-up sequencing, fail-safe output (FS0B), voltage supervision across six rails (VCOREMON, VDDIOMON, VMON1–VMON4), and ISO 26262-compliant safety features including challenger watchdog, ABIST, and fault recovery - all in HVQFN56 package with wettable flanks.
Technical Context
The MC33FS8400G0ESR2 implements a dual-domain safety architecture: a main power management state machine and a dedicated fail-safe state machine with independent monitoring paths. It supports external frequency synchronization (FIN/FOUT) and power synchronization (PSYNC) for multi-device timing alignment, and integrates analog multiplexing (AMUX) for MCU ADC monitoring of internal voltages and temperatures.
Its power topology includes a high-side/low-side gate driver pair (PRE_GHS/PRE_GLS) for external VPRE MOSFETs, a BOOST converter with integrated low-side switch (VBOS feedback), and configurable soft-start (DVS) slopes (7.81 mV/µs for BUCK1). All regulators support thermal shutdown (TSD) response with configurable DFS behavior and programmable over/under-voltage detection windows (e.g., VCOREMON UVTH = 88%, OVTH = 112%).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports direct connection to 12 V/24 V battery rails with reverse-battery protection diodes on VSUP1/VSUP2. |
| VPRE Controller | External synchronous buck controller with PRE_GHS/PRE_GLS drivers - enables scalable high-current pre-regulation up to 10 A peak via external MOSFETs. |
| BUCK1 Output | 1.35 V / 2.6 A - dedicated MCU core supply with SVS capability and VCOREMON monitoring input tied directly to its output. |
| LDO Outputs | LDO1: 5.0 V / 400 mA; LDO2: 5.0 V / 400 mA - supplies MCU I/Os and physical layer interfaces with independent over/under-voltage detection. |
| Safety Certification | ASIL B compliant per ISO 26262 - includes challenger watchdog, ABIST, PGOOD/RSTB assertion, fail-safe output (FS0B), and diagnostic fault coverage for critical rails. |
| Interface & Control | SPI or I²C (0x20 address) with CRC - enables full OTP configuration, real-time register access, and fault reporting via INTB and ERRMON pins. |
| Package | HVQFN56 (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank) - optimized for automotive thermal and solder-joint reliability per AEC-Q100 Grade 1. |
Pinout & Package
HVQFN56 plastic thermal enhanced very thin quad flat package with exposed pad (EP), 0.5 mm pitch, 8 mm × 8 mm body, and wettable flank (ES suffix). Exposed pad (Pin 57) connects BUCK1/BUCK2/BUCK3 low-side grounds and must be soldered to PCB GND for thermal and electrical integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 (Pins 50, 51) | Main power inputs | Accept 60 V DC input; require external reverse-battery protection diodes in series for automotive robustness. |
| PRE_GHS / PRE_GLS (Pins 45, 43) | VPRE gate drivers | Drive external high-side and low-side MOSFETs for VPRE buck stage - enables flexible current scaling beyond integrated regulators. |
| BUCK1_FB / BUCK1_SW (Pins 39, 37) | Core regulator feedback & switching node | BUCK1_FB closes regulation loop for 1.35 V output; BUCK1_SW connects to external inductor - requires proper layout for EMI control. |
| VCOREMON (Pin 17) | Core voltage monitor input | Must be connected directly to BUCK1 output to enable SVS and fault detection - not optional for ASIL B compliance. |
| FS0B (Pin 14) | Fail-safe output | Active-low open-drain signal indicating safety state - asserts during TSD, UV/OV faults, or watchdog timeout to trigger system-level fail-safe action. |
| INTB (Pin 33) | Interrupt output | Active-low interrupt signaling regulator faults, safety events, or status changes - requires external pull-up to VDDIO. |
| PGOOD / RSTB (Pins 18, 19) | Power-good & reset outputs | PGOOD indicates stable regulation across monitored rails; RSTB provides MCU reset with external reset detection - both require VDDIO pull-ups. |
| FIN / FOUT (Pins 20, 24) | Frequency sync I/O | Enables synchronized switching across multiple FS84/FS85 devices or external PMICs to reduce system-level conducted EMI peaks. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B Safety Architecture | Dedicated fail-safe state machine with independent monitoring, challenger watchdog, ABIST, and fail-safe output (FS0B) for end-to-end fault containment. |
| Configurable Power Sequencing | Per-rail start/stop slots (e.g., BUCK1 in Slot 1, LDO1 in Slot 1) enable precise timing control across 6 regulated outputs without external timers. |
| EMC Optimization | Integrated spread spectrum, slew rate control, manual frequency tuning, and FIN/FOUT synchronization reduce peak emissions in radar/vision ECU designs. |
| OTP Programmability | Factory-programmed configuration (voltage, current limits, sequencing, safety thresholds) eliminates external configuration components and supports engineering-mode emulation. |
| Thermal & Fault Response | Per-regulator thermal shutdown (TSD) with configurable DFS behavior (e.g., BUCK1 shutdown + DFS) ensures graceful degradation instead of hard failure. |
| Diagnostic Coverage | Real-time monitoring of 6 voltage domains (VCOREMON, VDDIOMON, VMON1–VMON4) with programmable OV/UV thresholds and deglitch times (e.g., 25 µs OV_DGLT). |
Applications
| Radar Sensor Module | Vision Processing ECU |
|---|---|
|
Use Scenario: Powering NXP S32R274-based corner radar module with 12 V battery input and strict EMC requirements. IC Role / Device Role / Timing Role: MC33FS8400G0ESR2 serves as primary SBC - regulating VPRE, BUCK1 (core), LDO1/LDO2 (I/O & PHY), and enabling synchronized switching with TEF810x RF transceiver. Use Value: Integrated FIN/FOUT synchronization reduces system-level radiated emissions by aligning switching edges across radar SoC and RF front-end. |
Use Scenario: Supplying NXP S32V234 vision processor in mono/stereo camera ECU with functional safety and thermal resilience. IC Role / Device Role / Timing Role: MC33FS8400G0ESR2 delivers core (1.35 V), I/O (5.0 V), and analog (5.0 V) rails while monitoring VCOREMON and VDDIOMON for ASIL B compliance. Use Value: Challenger watchdog and ABIST provide diagnostic coverage >90% for ISO 26262 Part 5, eliminating need for external safety monitors. |
| ADAS Domain Controller | Infotainment Head Unit |
|
Use Scenario: Consolidating power delivery for multi-SoC ADAS domain controller (e.g., S32G + S32R) with centralized safety management. IC Role / Device Role / Timing Role: MC33FS8400G0ESR2 acts as master SBC - coordinating PSYNC with secondary FS85 devices and managing fail-safe state propagation via FS0B. Use Value: Pin-to-pin compatibility with FS85 family allows seamless upgrade path to ASIL D without PCB redesign when system safety goals evolve. |
Use Scenario: Powering infotainment head unit with display, audio, and connectivity modules requiring stable 5.0 V I/O and low-noise analog supplies. IC Role / Device Role / Timing Role: MC33FS8400G0ESR2 supplies LDO1/LDO2 for MCU I/O and ADC reference while using AMUX to feed rail telemetry to host MCU ADC. Use Value: Integrated AMUX eliminates external voltage dividers and op-amps, reducing BOM count and improving measurement accuracy of rail health. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8410G0ESR2 | Includes BUCK3 (1.8 V / 2.6 A) and additional VMON3/VMON4 monitoring - adds third SMPS rail and extended voltage supervision. | Required for systems needing three independent low-voltage SMPS outputs (e.g., radar + camera + companion MCU). | Select when BUCK3 is needed for auxiliary processing or sensor biasing; otherwise MC33FS8400G0ESR2 minimizes cost and complexity. |
| MC33FS8500A0ESR2 | ASIL D certified, adds FCCU (functional safety control unit), ERRMON, and enhanced diagnostic coverage - higher FMEDA score and deeper fault isolation. | Mandatory for ASIL D domain controllers or safety-critical gateway applications where single-point failure must be avoided. | Choose only if ISO 26262 ASIL D compliance is required; MC33FS8400G0ESR2 meets ASIL B with lower validation overhead. |
Compared with MC33FS8410G0ESR2, MC33FS8400G0ESR2 reduces component count and layout area by omitting BUCK3 and associated passives, while retaining identical ASIL B safety architecture and core power capability. Against MC33FS8500A0ESR2, it trades ASIL D certification and FCCU for lower cost and simpler qualification - ideal for radar/vision ECUs where ASIL B suffices.
Availability
MC33FS8400G0ESR2 is available at Aetrix Electronics and suitable for radar sensor modules, vision processing ECUs, and ADAS domain controllers requiring stable component supply, AEC-Q100 Grade 1 qualification, and ISO 26262 ASIL B compliance.
Supply support for MC33FS8400G0ESR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in automotive processors and power management ICs.
The FS84 product line delivers ASIL B–certified system basis chips for radar, vision, and infotainment ECUs - designed to replace discrete power + safety monitor combinations with integrated, configurable, and standards-compliant power subsystems.
FAQ
What is the maximum input voltage supported by MC33FS8400G0ESR2?
MC33FS8400G0ESR2 supports a maximum input voltage of 60 V DC on VSUP1 and VSUP2 pins. This rating enables direct connection to 12 V and 24 V automotive battery rails, provided external reverse-battery protection diodes are used in series as specified in the datasheet. The device remains operational down to the VSUP power-up threshold of 4.9 V.
Does MC33FS8400G0ESR2 include integrated MOSFETs for all its switching regulators?
No. MC33FS8400G0ESR2 integrates synchronous MOSFETs only for BUCK1 (1.35 V / 2.6 A). The VPRE controller requires external high-side and low-side MOSFETs driven by PRE_GHS and PRE_GLS pins. BUCK2 and BUCK3 are not present in this variant (FS8400 configuration), so no related integrated switches exist. The BOOST converter includes an integrated low-side switch only.
How does the fail-safe output (FS0B) behave during a thermal shutdown event?
During thermal shutdown (TSD), MC33FS8400G0ESR2 asserts the FS0B pin (Pin 14) as an active-low open-drain signal. This behavior is part of the fail-safe state machine's deterministic response - it occurs simultaneously with BUCK1 shutdown and DFS activation, providing immediate hardware-level notification to downstream safety controllers without software intervention.
Can MC33FS8400G0ESR2 be configured via I²C, and what is its default address?
Yes, MC33FS8400G0ESR2 supports configuration and monitoring via I²C interface using SCL (Pin 10) and SDA (Pin 11). Its default I²C address is 0x20, as confirmed in the OTP flavor table. The interface includes CRC protection for command integrity and supports read/write access to all safety and power registers, including voltage thresholds and sequencing slots.
What safety certifications apply to MC33FS8400G0ESR2, and what documentation supports them?
MC33FS8400G0ESR2 is developed in compliance with ISO 26262:2018 for ASIL B applications and qualified per AEC-Q100 Rev H Grade 1. Supporting documentation includes the FS84_FS85C product data sheet (Rev. 12.0), FMEDA reports, and safety manual - all available from NXP's official website. The device implements challenger watchdog, ABIST, and fail-safe output (FS0B) as core ASIL B mechanisms.
MC33FS8400G0ESR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8400G0ESR2 FAQ
1.How can I place an order for MC33FS8400G0ESR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8400G0ESR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8400G0ESR2 reliable?
The price and inventory of MC33FS8400G0ESR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8400G0ESR2 is usually 5 days.
3.What payment methods are accepted for MC33FS8400G0ESR2?
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4.How is shipping managed for MC33FS8400G0ESR2?
MC33FS8400G0ESR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8400G0ESR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8400G0ESR2?
For technical support, including MC33FS8400G0ESR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8400G0ESR2 requirements.
6.How does Aetrix verify that MC33FS8400G0ESR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8400G0ESR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8400G0ESR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8400G0ESR2?
All MC33FS8400G0ESR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8400G0ESR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8400G0ESR2 part is unused and in its original packaging.
Return procedure for MC33FS8400G0ESR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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