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NXP Semiconductors MC33FS8400G0KS

Part No.:
MC33FS8400G0KS
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMC33FS8400G0KS.pdf
Description:
SAFETY POWER MANAGEMENT IC, QFN5
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,172

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Product details

Overview

MC33FS8400G0KS from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one low-voltage integrated synchronous BUCK1 converter (1.35 V/3.6 A), two LDOs (LDO1: 5.0 V/400 mA; LDO2: 5.0 V/400 mA), BOOST converter, and comprehensive safety monitoring. It supports radar and vision ECUs requiring functional safety, EMC-optimized power sequencing, and SPI/I²C control.

For engineers reviewing the MC33FS8400G0KS datasheet, MC33FS8400G0KS pinout, MC33FS8400G0KS application, or MC33FS8400G0KS equivalent, key selection criteria include its ASIL B safety certification, single-BUCK1 configuration (no BUCK2/BUCK3), OTP-programmed 1.35 V core supply, 60 V input tolerance, and HVQFN56 wettable flank package for automotive thermal and reliability requirements.

Technical Context

The MC33FS8400G0KS implements a hierarchical safety architecture with dedicated fail-safe state machine, challenger watchdog, PGOOD/RSTB outputs, and ABIST/LBIST self-test. Its power management includes independent sequencing slots, thermal shutdown (TSD) response per regulator, and deep fail-safe autoretry (infinite cycles).

It features external frequency synchronization (FIN/FOUT), spread-spectrum modulation, slew-rate control, and manual frequency tuning to meet stringent automotive EMC requirements. The device uses OTP-configured regulators-BUCK1 fixed at 1.35 V, LDO1/LDO2 at 5.0 V-and supports wake-up via dual analog/digital WAKE1/WAKE2 inputs with configurable thresholds.

Key Specifications

ParameterValue and Actual Design Meaning
ASIL LevelASIL B compliant per ISO 26262; enables safety partitioning in radar/vision ECUs without full ASIL D overhead
Input Voltage Range4.9 V to 60 V DC; supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes on VSUP1/VSUP2
BUCK1 Output1.35 V @ 3.6 A peak; dedicated MCU core supply with SVS capability and soft-start slope of 7.81 mV/µs
LDO OutputsLDO1: 5.0 V/400 mA; LDO2: 5.0 V/400 mA; supplies MCU I/Os, ADC reference, and external PHYs
Communication InterfaceSPI or I²C (address 0x20); includes CRC for command integrity and configurable interrupt (INTB) and fail-safe (FS0B) outputs
PackageHVQFN56 (8 mm × 8 mm × 0.85 mm); thermally enhanced wettable flank (KS suffix) for automated optical inspection and solder joint reliability
QualificationAEC-Q100 Grade 1 (−40 °C to +125 °C ambient), MSL3; qualified for under-hood and ADAS ECU deployment

Pinout & Package

HVQFN56 plastic thermal enhanced very thin quad flat package with 0.5 mm pitch, 8 mm × 8 mm body, and exposed pad (EP) connected to GNDFS/GND. KS suffix denotes dimple wettable flank for improved solder paste release and AOI compatibility.

Pin/TerminalCircuit RoleDesign Meaning
VSUP1 / VSUP2Main power inputsDual 60 V-tolerant supply rails; require external reverse-battery diodes; feed internal bias and regulators
BUCK1_IN / BUCK1_SW / BUCK1_FBCore SMPS interfaceInput, switching node, and feedback for 1.35 V/3.6 A MCU core supply; supports external compensation
LDO1 / LDO2Linear regulator outputs5.0 V/400 mA each; low-noise supplies for MCU I/O banks and analog subsystems
VCOREMON / VMON1–VMON4Voltage supervision inputsMonitor BUCK1 output and up to four external rails; configurable OV/UV thresholds and delay times
PGOOD / RSTB / FS0BSafety status outputsActive-low open-drain signals: PGOOD indicates all regulated outputs in spec; RSTB resets MCU; FS0B asserts fail-safe state
SPI (MISO/MOSI/SCLK/CSB) / I²C (SCL/SDA)Digital control interfacesConfigurable communication paths; I²C address 0x20; SPI supports CRC-protected commands
WAKE1 / WAKE2Wake-up inputsAnalog/digital-capable pins with external resistor option; initiate power-up from OFF mode (10 µA quiescent)
FIN / FOUT / PSYNCFrequency synchronizationEnable system-level EMC optimization by aligning switching frequencies across multiple PMICs or domains

Key Features

FeatureDesign Value
Fail-safe state machineIndependent hardware monitor with infinite deep fail-safe autoretry, enabling safe degradation without MCU intervention
EMC optimization suiteIntegrated FIN/FOUT sync, spread spectrum, slew-rate control, and manual frequency tuning reduce radiated emissions in radar bands
OTP-configured power treeFactory-programmed BUCK1 (1.35 V), LDO1/LDO2 (5.0 V), eliminating external resistor networks and reducing BOM count
Functional safety supportChallenger watchdog, FCCU inputs, ABIST/LBIST, and dedicated safety interrupt (INTB) simplify ISO 26262 FMEDA and diagnostic coverage
Thermal robustnessThermal shutdown per regulator (TSD) with configurable behavior (e.g., BUCK1 shutdown + DFS assertion) and exposed pad for 1.5 W dissipation

Applications

Radar Sensor ModuleVision ECU (Mono Camera)

Use Scenario: Powering NXP S32R274-based corner radar module with CAN PHY and RF front-end.

IC Role / Device Role / Timing Role: Primary SBC providing VPRE-controlled 12 V rail, BUCK1-supplied 1.35 V core voltage, and dual 5.0 V LDOs for CAN transceiver and ADC reference.

Use Value: Enables ASIL B compliance, eliminates need for discrete supervisors, and synchronizes switching frequency with radar clock to suppress beat interference.

Use Scenario: Supplying NXP S32V234 vision processor in driver-monitoring camera with MIPI CSI-2 interface.

IC Role / Device Role / Timing Role: Single-chip power manager delivering MCU core (1.35 V), I/O (5.0 V), and sensor interface (5.0 V) rails with precise sequencing and fault reporting.

Use Value: Reduces board space by 40% vs. discrete PMIC + supervisor solution; PGOOD/RSTB signals ensure deterministic boot and safe shutdown during voltage faults.

ADAS Domain ControllerInfotainment Head Unit

Use Scenario: Supporting mid-tier ADAS domain controller with dual-core MCU and Ethernet AVB connectivity.

IC Role / Device Role / Timing Role: Centralized power hub managing core logic supply, PHY voltages, and wake-up detection for low-power sleep modes.

Use Value: OFF-mode quiescent current of 10 µA extends battery life during vehicle park; WAKE1/WAKE2 enable selective subsystem wake-up without MCU polling.

Use Scenario: Powering audio DSP, display controller, and Bluetooth/Wi-Fi modules in premium infotainment head unit.

IC Role / Device Role / Timing Role: Fail-safe power source for critical subsystems including touch controller, audio codec, and secure boot circuitry.

Use Value: Fail-safe output (FS0B) triggers hardware reset of security enclave upon detected overvoltage, preventing unauthorized firmware execution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MC33FS8405G0KSIncludes FCCU (functional safety monitoring unit) and supports up to 4 voltage monitors vs. 2 on MC33FS8400G0KSRequired for designs needing MCU error monitoring (FCCU1/FCCU2 inputs) and extended VMON coverageSelect when ASIL B system requires challenger watchdog + external MCU health monitoring beyond basic PGOOD/RSTB
MC33FS8410G0KSAdds BUCK3 (1.8 V/3.6 A) and supports static voltage scaling; no FCCUSuitable for multi-rail processors requiring auxiliary core or memory voltage beyond BUCK1+LDOsChoose when vision/radar SoC demands three independent low-voltage rails with coordinated sequencing

Compared with MC33FS8405G0KS and MC33FS8410G0KS, the MC33FS8400G0KS offers minimal footprint and cost for ASIL B radar/vision ECUs needing only one integrated BUCK and dual LDOs-ideal for cost-sensitive, single-processor modules where FCCU or third SMPS is unnecessary.

Availability

MC33FS8400G0KS is available at Aetrix Electronics and suitable for radar sensor modules, vision ECUs, and ADAS domain controllers requiring stable component supply, automotive-grade qualification, and fail-safe power management.

Supply support for MC33FS8400G0KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The FS84 product line delivers ASIL B–certified system basis chips optimized for radar, vision, and domain controller power architectures-designed to replace discrete power + safety IC combinations with integrated, AEC-Q100 qualified solutions.

FAQ

What safety certifications does the MC33FS8400G0KS hold?

The MC33FS8400G0KS is developed in compliance with ISO 26262 for ASIL B applications and qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C). It includes built-in self-test (ABIST/LBIST), challenger watchdog, fail-safe output (FS0B), and dedicated safety monitoring circuits-all verified in the FS84 family data sheet Rev. 12.0.

Does the MC33FS8400G0KS support both SPI and I²C interfaces simultaneously?

No-the MC33FS8400G0KS supports either SPI or I²C, not both concurrently. The interface is selected at power-up via hardware strapping or OTP configuration. Its I²C address is fixed at 0x20, and SPI uses standard four-wire protocol with CSB, SCLK, MOSI, and MISO. Both interfaces include CRC for command integrity in MC33FS8400G0KS operation.

What is the function of the PSYNC pin on the MC33FS8400G0KS?

The PSYNC pin on the MC33FS8400G0KS serves as a bidirectional power synchronization signal to coordinate switching frequencies across multiple FS84/FS85 devices or between the MC33FS8400G0KS and an external PMIC. This reduces beat frequencies and improves system-level EMC performance-critical in radar and high-speed vision applications where spectral purity is mandatory.

Can the MC33FS8400G0KS be used in 24 V commercial vehicle applications?

Yes-the MC33FS8400G0KS accepts up to 60 V DC input and is qualified for AEC-Q100 Grade 1, making it suitable for 24 V commercial vehicle systems. External reverse-battery protection diodes are required on VSUP1 and VSUP2 pins, and thermal design must accommodate higher power dissipation at elevated input voltages. Its 1.35 V BUCK1 and dual 5.0 V LDOs remain fully functional across the full 4.9 V–60 V range.

How does the MC33FS8400G0KS handle thermal shutdown events?

Upon thermal shutdown (TSD), the MC33FS8400G0KS disables BUCK1 and asserts the fail-safe output (FS0B) while maintaining LDO1/LDO2 operation if within safe temperature limits. The device enters deep fail-safe mode with infinite autoretry-restarting BUCK1 after cooldown unless persistent fault conditions persist. This behavior is OTP-configured and documented in the FS84_FS85C datasheet Section 4.1.

MC33FS8400G0KS Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Applications:
System Basis Chip
Current - Supply:
15mA
Voltage - Supply:
60V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-HVQFN (8x8)

MC33FS8400G0KS FAQ

1.How can I place an order for MC33FS8400G0KS through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33FS8400G0KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33FS8400G0KS reliable?

The price and inventory of MC33FS8400G0KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8400G0KS is usually 5 days.

3.What payment methods are accepted for MC33FS8400G0KS?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8400G0KS transactions.

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4.How is shipping managed for MC33FS8400G0KS?

MC33FS8400G0KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33FS8400G0KS order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33FS8400G0KS?

For technical support, including MC33FS8400G0KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8400G0KS requirements.

6.How does Aetrix verify that MC33FS8400G0KS is sourced from the original manufacturer or authorized distributors?

All MC33FS8400G0KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8400G0KS meets industry standards.

7.What is the process for return or replacement of MC33FS8400G0KS?

All MC33FS8400G0KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8400G0KS, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33FS8400G0KS part is unused and in its original packaging.

Return procedure for MC33FS8400G0KS:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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