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NXP Semiconductors MC33FS8400G0KSR2
- Part No.:
- MC33FS8400G0KSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8400G0KSR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:4,272
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Product details
Overview
MC33FS8400G0KSR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one low-voltage integrated synchronous BUCK1 converter (1.25 V/4.5 A), two LDOs (LDO1: 5.0 V/400 mA; LDO2: 5.0 V/400 mA), and safety monitoring circuitry. It supports radar and vision ECUs requiring functional safety, EMC-optimized power sequencing, and SPI/I²C configuration.
For engineers reviewing the MC33FS8400G0KSR2 datasheet, MC33FS8400G0KSR2 pinout, MC33FS8400G0KSR2 application, or MC33FS8400G0KSR2 equivalent, this device delivers deterministic power-up sequencing, fail-safe output (FS0B), voltage supervision across six rails (VCOREMON, VDDIOMON, VMON1–VMON4), and deep fail-safe autoretry for automotive domain controllers operating at 12 V/24 V battery input.
Technical Context
The MC33FS8400G0KSR2 implements a dual-domain safety architecture with independent monitoring paths: one for internal regulator health (ABIST1, PGOOD, RSTB) and another for MCU-level fault detection via FCCU1/FCCU2 inputs and watchdog (Simple WD). Its power management state machine enforces strict sequencing slots-BUCK1 starts in Slot 0, LDO1/LDO2 in Slot 1 and Slot 2-and supports thermal shutdown (TSD) response with regulator-specific shutdown + DFS activation.
EMC performance is enhanced through frequency synchronization (FIN/FOUT), spread spectrum modulation, slew rate control on PRE_GHS/PRE_GLS, and manual tuning of switching frequency (455 kHz forced PWM mode). The device uses OTP-programmed configurations validated for ASIL B compliance per ISO 26262, with AEC-Q100 Grade 1 qualification and MSL3 packaging.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes on VSUP1/VSUP2. |
| VPRE Controller | Synchronous buck controller with external MOSFETs - configurable output up to 10 A peak, slope compensation 60 mV/µs, 455 kHz forced PWM operation. |
| BUCK1 Converter | Integrated synchronous buck - fixed 1.25 V output, 4.5 A peak current, 2.22 MHz switching, soft-start ramp 7.81 mV/µs, TSD response: shutdown + DFS. |
| LDO Outputs | LDO1: 5.0 V / 400 mA; LDO2: 5.0 V / 400 mA - both support voltage supervision (OV/UV thresholds ±12 %), programmable power-up slot assignment. |
| Safety Features | Fail-safe output (FS0B, open-drain active-low), Simple Watchdog, PGOOD/RSTB assertion, ABIST1 coverage for VCOREMON/VDDIOMON/VMON1–VMON4, deep fail-safe autoretry (x15). |
| Interface & Control | SPI or I²C (0x20 address), 32-bit command structure with CRC, PSYNC for multi-device synchronization, AMUX analog multiplexer for ADC monitoring. |
| Package | HVQFN56 - 8 mm × 8 mm × 0.85 mm, wettable flank (KS suffix), exposed pad for thermal dissipation and GND connection. |
Pinout & Package
HVQFN56 package with 0.5 mm pitch, 8 mm × 8 mm body, and exposed thermal pad (EP) connected to GNDFS/GND. Wettable flank (KS) enables reliable solder-joint inspection for automotive production.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power supply inputs | Accept 60 V DC max; require external reverse-battery protection diodes; feed internal regulators and bias circuits. |
| BUCK1_IN / BUCK1_SW / BUCK1_FB | Core supply path | Input, switching node, and feedback for 1.25 V/4.5 A MCU core rail; supports SVS via VCOREMON pin (Pin 17). |
| LDO1 / LDO2 | Linear regulator outputs | 5.0 V @ 400 mA each - supply MCU I/Os and ADC reference; monitored via VDDIOMON (Pin 15) and VMON1/VMON2 (Pins 16/15). |
| FS0B | Fail-safe output | Active-low open-drain signal indicating system-level fault; drives external safety-critical logic or MCU interrupt. |
| PGOOD / RSTB | Power status & reset | PGOOD (Pin 18): active-low power-good flag requiring external pull-up to VDDIO; RSTB (Pin 19): MCU reset driver with external reset detection. |
| FCCU1 / FCCU2 | MCU error monitoring inputs | Dedicated digital inputs for MCU failure signals - trigger fail-safe state machine transition and FS0B assertion. |
| FIN / FOUT | Frequency sync interface | Enable synchronized switching across multiple FS84/FS85 devices or external PMICs to reduce system-level EMI peaks. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B Functional Safety | Fully compliant with ISO 26262; includes ABIST1, dedicated watchdog, PGOOD/RSTB, fail-safe output, and diagnostic coverage for all regulated rails. |
| Multi-Rail Power Sequencing | Configurable startup/shutdown slots (Slot 0–6); BUCK1 starts first, followed by LDO1/LDO2, enabling controlled boot for radar/vision SoCs like S32R274. |
| EMC Optimization | Integrated FIN/FOUT sync, spread spectrum, slew rate control on gate drivers, and manual frequency tuning - reduces conducted/radiated emissions in ADAS modules. |
| OTP Configuration Flexibility | Factory-programmed OTP defines BUCK1/LDO voltages, sequencing order, safety thresholds, and watchdog type; engineering-mode emulation supported via GUI and socketed EVB. |
| Low-Power OFF Mode | 10 µA typical quiescent current in OFF mode - enables always-on wake-up capability via WAKE1/WAKE2 pins without draining battery. |
Applications
| Radar Sensor Module | Vision ECU (Mono/Stereo Camera) |
|---|---|
|
Use Scenario: Powers NXP S32R274-based corner radar module with real-time beamforming and object detection. IC Role / Device Role: Primary SBC providing VPRE (3.3 V), BUCK1 (1.25 V for S32R core), LDO1 (5.0 V for CAN PHY), and fail-safe signaling to MCU. Use Value: Enables ASIL B-compliant power delivery with deterministic sequencing, thermal fault containment, and synchronized SMPS clocks to meet CISPR 25 Class 5 emission limits. |
Use Scenario: Supplies NXP S32V234 vision processor in automotive camera ECU with ISP, CNN accelerator, and MIPI CSI-2 interface. IC Role / Device Role: Delivers BUCK1 (1.25 V core), LDO1 (5.0 V I/O), LDO2 (5.0 V ADC reference), and monitors VCORE/VDDIO via VCOREMON/VDDIOMON pins. Use Value: Ensures stable core voltage under dynamic CNN workload while maintaining fail-safe output (FS0B) for camera shutdown during overtemperature or undervoltage events. |
| ADAS Domain Controller | Infotainment Head Unit |
|
Use Scenario: Integrated into centralized ADAS domain controller hosting radar, vision, and ultrasonic fusion algorithms on S32Z/S32E processors. IC Role / Device Role: Manages multi-rail power tree including VPRE (for companion PMIC), BUCK1 (MCU core), LDOs (peripheral I/O), and safety monitoring via FCCU inputs. Use Value: Provides unified fail-safe state machine coordination across subsystems, reducing need for discrete safety supervisors and simplifying ISO 26262 FMEDA analysis. |
Use Scenario: Powers infotainment head unit with ARM Cortex-A72 application processor, GPU, audio codec, and display interface. IC Role / Device Role: Supplies BUCK1 (1.25 V core), LDO1 (5.0 V USB PHY), LDO2 (5.0 V audio DAC), and monitors VSUP stability via VMON1/VMON2 for brownout detection. Use Value: Delivers low-noise linear regulation for audio-sensitive rails while supporting fast wake-from-sleep via WAKE1/WAKE2 with <10 µA OFF-mode current. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8410G0KSR2 | Includes BUCK3 (1.8 V/4.5 A) and additional VMON3/VMON4 monitoring channels; same ASIL B safety scope and HVQFN56 package. | Required for designs needing three integrated buck rails (e.g., S32R294 + TEF810x radar SoC with separate DSP core supply). | Select when third buck rail is needed; retains identical pinout, software compatibility, and safety certification. |
| MC33FS8510A0KSR2 | ASIL D–rated version with FCCU monitoring, ERRMON input, and enhanced ABIST coverage; adds challenge watchdog and FLT_RECOVERY capability. | Targeted at domain controllers requiring full ASIL D decomposition (e.g., zonal ECU with safety-critical gateway functions). | Choose for ASIL D system partitioning; requires updated safety documentation but shares same footprint and basic register map. |
Compared with MC33FS8400G0KSR2, MC33FS8410G0KSR2 extends power capability with a third buck regulator while preserving ASIL B compliance and pin compatibility, whereas MC33FS8510A0KSR2 upgrades to ASIL D with expanded fault coverage and recovery features-neither is pin-to-pin interchangeable without layout or safety validation updates.
Availability
MC33FS8400G0KSR2 is available at Aetrix Electronics and suitable for radar sensor modules, vision ECUs, and ADAS domain controllers requiring stable component supply, long-term automotive lifecycle support, and AEC-Q100 qualified power management.
Supply support for MC33FS8400G0KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade power management.
The FS84 product line delivers ASIL B–certified system basis chips optimized for radar, vision, and domain controller power architectures-designed to simplify safety-critical ECU development while meeting stringent EMC and thermal requirements.
FAQ
What safety certifications does the MC33FS8400G0KSR2 hold?
The MC33FS8400G0KSR2 is developed in compliance with ISO 26262 for ASIL B applications and qualified per AEC-Q100 Rev H Grade 1 (−40 °C to +125 °C ambient). It includes built-in self-test (ABIST1), fail-safe output (FS0B), and diagnostic coverage for all regulated rails-fully documented in NXP's FS84 safety manual. MC33FS8400G0KSR2 meets these requirements out-of-the-box with no customer calibration required.
Does the MC33FS8400G0KSR2 support multi-phase operation for higher current delivery?
No, the MC33FS8400G0KSR2 does not support multi-phase operation. Its BUCK1 converter is a single-phase synchronous buck delivering up to 4.5 A peak. Multi-phase capability (e.g., BUCK1+BUCK2 interleaving) is only available in higher-variant parts like MC33FS8420G0KSR2 or MC33FS8430G0KSR2. MC33FS8400G0KSR2 is optimized for single-core MCU supply with deterministic timing and minimal external components.
Can the MC33FS8400G0KSR2 be configured via I²C only, or is SPI mandatory?
The MC33FS8400G0KSR2 supports both SPI and I²C interfaces for configuration and monitoring-no interface is mandatory. I²C address is fixed at 0x20; SPI uses standard 4-wire protocol (CSB, SCLK, MOSI, MISO) with CRC-protected 32-bit commands. Both interfaces provide full register access to sequencing, voltage settings, safety thresholds, and fault reporting. MC33FS8400G0KSR2 operates identically regardless of selected interface.
What is the purpose of the PSYNC pin on the MC33FS8400G0KSR2?
The PSYNC pin (Pin 38) serves as a bidirectional power synchronization interface that allows two MC33FS8400G0KSR2 devices-or one MC33FS8400G0KSR2 and an external PMIC-to align their switching frequencies and phase relationships. This reduces beat-frequency noise and system-level EMI peaks. When used as input, it overrides internal oscillator; as output, it mirrors the master device's clock. MC33FS8400G0KSR2 supports this feature without additional glue logic.
How does the fail-safe state machine respond to a thermal shutdown event on the MC33FS8400G0KSR2?
Upon thermal shutdown (TSD), the MC33FS8400G0KSR2 triggers regulator-specific responses: BUCK1 shuts down and asserts Deep Fail-Safe (DFS), while LDO1/LDO2 remain active unless their individual thermal limits are exceeded. The fail-safe state machine then drives FS0B low, disables non-critical outputs, and enters autoretry mode (x15 attempts). If recovery fails, MC33FS8400G0KSR2 holds FS0B asserted until VSUP reset or external intervention.
MC33FS8400G0KSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8400G0KSR2 FAQ
1.How can I place an order for MC33FS8400G0KSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8400G0KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8400G0KSR2 reliable?
The price and inventory of MC33FS8400G0KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8400G0KSR2 is usually 5 days.
3.What payment methods are accepted for MC33FS8400G0KSR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8400G0KSR2 transactions.
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4.How is shipping managed for MC33FS8400G0KSR2?
MC33FS8400G0KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8400G0KSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8400G0KSR2?
For technical support, including MC33FS8400G0KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8400G0KSR2 requirements.
6.How does Aetrix verify that MC33FS8400G0KSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8400G0KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8400G0KSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8400G0KSR2?
All MC33FS8400G0KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8400G0KSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8400G0KSR2 part is unused and in its original packaging.
Return procedure for MC33FS8400G0KSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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