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NXP Semiconductors MC33FS8400G5KS
- Part No.:
- MC33FS8400G5KS
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8400G5KS.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,255
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Product details
Overview
MC33FS8400G5KS from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one low-voltage integrated synchronous BUCK1 converter (1.25 V / 4.5 A peak), two LDOs (LDO1: 5.0 V / 400 mA; LDO2: 5.0 V / 150 mA), and safety monitoring circuitry. It supports radar and camera applications requiring functional safety, power sequencing, and EMC-optimized frequency synchronization.
For engineers reviewing the MC33FS8400G5KS datasheet, MC33FS8400G5KS pinout, MC33FS8400G5KS application, or MC33FS8400G5KS equivalent, this device delivers deterministic power-up sequencing, fail-safe output (FS0B), SPI/I²C configuration with CRC, and integrated voltage supervision for VCOREMON, VDDIOMON, and four VMON inputs - critical for ADAS sensor module design and ISO 26262-compliant power architecture validation.
Technical Context
The MC33FS8400G5KS implements a hierarchical safety architecture with dedicated monitoring paths for VCOREMON (1.25 V), VDDIOMON (3.3 V), and four independent VMON inputs (VMON1–VMON4), each configurable with overvoltage/undervoltage thresholds and delay filters. Its fail-safe state machine drives FS0B as an open-drain active-low output, synchronized to internal diagnostics including ABIST, LBIST, and watchdog functions.
Power management includes a 455 kHz forced-PWM VPRE controller (3.3 V output), 2.22 MHz BUCK1 (1.25 V / 4.5 A), and dual LDOs with thermal shutdown behavior (LDO1/LDO2 shutdown + DFS). The device uses OTP-programmed configurations - MC33FS8400G5KS is pre-configured for FS8400 option: BUCK1 enabled, BUCK2/BUCK3 disabled, FCCU absent, and up to two VMON inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Functional Safety Level | ASIL B per ISO 26262, with dedicated fail-safe output (FS0B) and diagnostic coverage for power rails and monitoring inputs |
| Input Voltage Range | 60 V DC max input; supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes on VSUP1/VSUP2 |
| VPRE Controller | 3.3 V output, 455 kHz forced-PWM mode, external MOSFET drive (PRE_GHS/PRE_GLS), slope compensation 60 mV/µs |
| BUCK1 Converter | 1.25 V / 4.5 A peak output, 2.22 MHz switching, soft-start DVS 7.81 mV/µs, TSD-triggered shutdown + DFS |
| LDO Outputs | LDO1: 5.0 V / 400 mA; LDO2: 5.0 V / 150 mA; both support power sequencing in Slot 1 (LDO1) and Slot 0 (LDO2) |
| Interface & Diagnostics | SPI/I²C (I²C address 0x20), CRC-protected communication, PGOOD/RSTB outputs, INTB interrupt, AMUX analog multiplexer for ADC monitoring |
| Package & Thermal | HVQFN56 (8 mm × 8 mm × 0.85 mm), wettable flank (KS suffix), MSL3, AEC-Q100 Grade 1 qualified |
Pinout & Package
HVQFN56 plastic thermal enhanced very thin quad flat package with 0.5 mm pitch, 8 mm × 8 mm body, and exposed pad (EP) connected to GND. Wettable flank (dimple) variant for enhanced solder joint inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Main power supply inputs | Accept 60 V DC max; require external reverse-battery protection diodes; feed internal regulators and bias circuits |
| BUCK1_IN / BUCK1_SW / BUCK1_FB | BUCK1 power path | Input (36), switching node (37), and feedback (39); configured for 1.25 V / 4.5 A output with 1 µH inductor |
| LDO1 / LDO2 | Linear regulator outputs | LDO1 (55): 5.0 V / 400 mA for MCU I/Os; LDO2 (54): 5.0 V / 150 mA for physical layer or ADC supply |
| VCOREMON / VDDIOMON | Voltage monitoring inputs | VCOREMON (17) monitors BUCK1 output; VDDIOMON (15–16) monitors LDO2/LDO1; enable SVS and fault detection |
| FS0B | Fail-safe output | Active-low open-drain output (Pin 14); driven by fail-safe state machine during detected faults or safety violations |
| SCL / SDA / MISO / MOSI / SCLK / CSB | Digital interface | I²C (Pins 10–11) and SPI (Pins 25–28) with CRC; support configuration, status readback, and real-time control |
| PGOOD / RSTB / INTB | Status and control outputs | PGOOD (18) and RSTB (19) are active-low with mandatory VDDIO pull-up; INTB (33) signals asynchronous events |
| WAKE1 / WAKE2 | Wake-up inputs | Analog/digital wake inputs (Pins 49, 1); require external series resistor if used as global wake pins |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B Safety Architecture | Integrated fail-safe state machine, ABIST/LBIST, challenger watchdog, and dedicated FS0B output compliant with ISO 26262 requirements |
| Configurable Power Sequencing | Eight-slot sequencing engine assigns BUCK1, LDO1, LDO2, and monitoring blocks to precise startup/shutdown timing slots (e.g., LDO1 in Slot 1, LDO2 in Slot 0) |
| EMC Optimization | SMPS frequency synchronization (FIN/FOUT), spread spectrum, slew rate control, and manual tuning reduce radiated emissions in radar/camera ECU designs |
| OTP-Programmed Flexibility | Factory-programmed configuration (MC33FS8400G5KS = FS8400 variant) eliminates external configuration components; engineering-mode emulation supported via GUI |
| Low-Power OFF Mode | 10 µA typical quiescent current in OFF mode enables always-on wake capability without compromising battery drain in parked vehicle scenarios |
Applications
| Radar Sensor Module | Automotive Camera ECU |
|---|---|
|
Use Scenario: Powering NXP S32R274-based corner radar modules with strict EMC and functional safety requirements. IC Role / Device Role / Timing Role: Primary SBC providing VPRE (3.3 V), BUCK1 (1.25 V for MCU core), LDO1 (5.0 V for CAN PHY), and fail-safe signaling to MCU via FS0B and RSTB. Use Value: Enables single-chip power and safety management for ASIL B radar ECUs, eliminating discrete supervisors and reducing BOM count by 3+ components. |
Use Scenario: Supplying NXP S32V-based mono/stereo camera systems with multi-rail sequencing and voltage supervision. IC Role / Device Role / Timing Role: Delivers sequenced 1.25 V (core), 5.0 V (I/O), and 5.0 V (ADC/PHY) rails while monitoring VCOREMON and VDDIOMON for SVS compliance. Use Value: Guarantees deterministic boot timing and fault response within <250 µs TSlot, meeting ISO 26262 timing constraints for vision processing units. |
| ADAS Domain Controller Power Hub | Infotainment System PMIC |
|
Use Scenario: Consolidating power delivery for domain controllers integrating radar, vision, and V2X subsystems. IC Role / Device Role / Timing Role: Acts as central power hub with PSYNC pin enabling synchronization of multiple FS85/FS84 devices or external PMICs for coherent system-level EMC. Use Value: Reduces system-level radiated emissions by aligning SMPS switching edges across domains, simplifying EMC certification for complex ADAS platforms. |
Use Scenario: Supporting infotainment head units requiring robust power integrity and fail-safe reset coordination with application processors. IC Role / Device Role / Timing Role: Provides regulated 1.25 V, 5.0 V, and 5.0 V rails with PGOOD/RSTB handshaking and AMUX-based analog monitoring of supply health. Use Value: Eliminates need for external reset supervisors and voltage monitors, shortening bring-up time and improving field reliability in high-temperature cabin environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8410G0KS | Includes BUCK3 (1.8 V / 4.5 A) and supports three VMON inputs; same ASIL B safety level and HVQFN56 package | Required for dual-processor camera systems needing third rail (e.g., ISP core supply); adds 1.5 mm² PCB area for extra inductor | Select when BUCK3 is needed for additional low-voltage domain; retains pin compatibility and software alignment with MC33FS8400G5KS |
| MC33FS8510A2KS | ASIL D rated, includes FCCU monitoring interface and enhanced diagnostic coverage; identical BUCK1/LDO configuration but higher safety certification overhead | Targeted at domain controllers requiring ASIL D decomposition; mandates additional MCU-side FCCU firmware integration | Choose only when full ASIL D compliance is mandated; otherwise, MC33FS8400G5KS provides optimal cost/safety balance for ASIL B radar/camera use cases |
Compared with MC33FS8410G0KS, MC33FS8400G5KS reduces component count and layout complexity by omitting BUCK3, making it ideal for cost-sensitive single-processor radar modules; versus MC33FS8510A2KS, it avoids ASIL D certification burden while delivering identical power performance for ASIL B–compliant applications.
Availability
MC33FS8400G5KS is available at Aetrix Electronics and suitable for radar sensor modules, automotive camera ECUs, and ADAS domain controllers requiring stable component supply, AEC-Q100 Grade 1 qualification, and long-term automotive lifecycle support.
Supply support for MC33FS8400G5KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade power management.
The FS84 family, including MC33FS8400G5KS, was designed specifically for ASIL B automotive ADAS sensors - delivering integrated power, safety monitoring, and EMC-optimized regulation in a single HVQFN56 package.
FAQ
What safety certifications does the MC33FS8400G5KS hold?
The MC33FS8400G5KS is developed in compliance with ISO 26262 for ASIL B applications and qualified per AEC-Q100 Rev H Grade 1 (−40 °C to +125 °C ambient). It includes built-in self-test (ABIST/LBIST), challenger watchdog, and fail-safe output (FS0B) to meet functional safety requirements without external supervision circuitry. MC33FS8400G5KS does not support ASIL D; that requires FS85-series variants.
Does the MC33FS8400G5KS support SPI and I²C interfaces simultaneously?
No - the MC33FS8400G5KS supports either SPI or I²C, selected at power-up via hardware strapping or OTP configuration. Pins SCL/SDA (10–11) serve I²C; MISO/MOSI/SCLK/CSB (25–28) serve SPI. Both interfaces provide CRC-protected register access for configuration, status monitoring, and fault reporting. MC33FS8400G5KS uses I²C address 0x20 in I²C mode.
What is the purpose of the PSYNC pin on the MC33FS8400G5KS?
The PSYNC pin (Pin 38) enables power synchronization between multiple MC33FS8400G5KS devices or between an MC33FS8400G5KS and an external PMIC. It operates as bidirectional input/output to align switching frequencies and phase relationships, reducing system-level conducted and radiated emissions. MC33FS8400G5KS does not support multi-phase operation with external controllers via PSYNC.
Can the MC33FS8400G5KS be used in 24 V commercial vehicle applications?
Yes - the MC33FS8400G5KS accepts up to 60 V DC input and is qualified for 12 V and 24 V automotive battery systems. External reverse-battery protection diodes are mandatory on VSUP1 and VSUP2 (Pins 50–51). Its ASIL B safety architecture and AEC-Q100 Grade 1 rating make it suitable for commercial vehicle radar and camera modules operating across extended temperature ranges.
How is the fail-safe output (FS0B) triggered on the MC33FS8400G5KS?
The FS0B output (Pin 14) is driven low by the internal fail-safe state machine upon detection of critical faults: VCOREMON or VDDIOMON undervoltage/overvoltage violation, thermal shutdown (TSD), watchdog timeout, or ABIST/LBIST failure. It remains asserted until cleared by power cycle or explicit reset command. MC33FS8400G5KS does not support autoretry or deep fail-safe modes - those require FS85-series or specific OTP flavors.
MC33FS8400G5KS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8400G5KS FAQ
1.How can I place an order for MC33FS8400G5KS through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8400G5KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8400G5KS reliable?
The price and inventory of MC33FS8400G5KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8400G5KS is usually 5 days.
3.What payment methods are accepted for MC33FS8400G5KS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8400G5KS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8400G5KS?
MC33FS8400G5KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8400G5KS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8400G5KS?
For technical support, including MC33FS8400G5KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8400G5KS requirements.
6.How does Aetrix verify that MC33FS8400G5KS is sourced from the original manufacturer or authorized distributors?
All MC33FS8400G5KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8400G5KS meets industry standards.
7.What is the process for return or replacement of MC33FS8400G5KS?
All MC33FS8400G5KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8400G5KS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8400G5KS part is unused and in its original packaging.
Return procedure for MC33FS8400G5KS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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