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NXP Semiconductors MC33FS8400G5KSR2

Part No.:
MC33FS8400G5KSR2
Manufacturer:
NXP Semiconductors
Category:
Power Management - Specialized
Package:
56-VFQFN Exposed Pad
Datasheet:
AetrixMC33FS8400G5KSR2.pdf
Description:
SAFETY POWER MANAGEMENT IC, QFN5
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,012

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Product details

Overview

MC33FS8400G5KSR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one low-voltage integrated synchronous BUCK1 converter (1.25 V / 4.5 A peak), two LDOs (LDO1: 5.0 V / 400 mA; LDO2: 5.0 V / 400 mA), and safety monitoring circuitry. It supports radar and camera applications with 60 V DC input, OFF-mode quiescent current of 10 µA, and SPI/I²C interface with CRC.

For engineers reviewing the MC33FS8400G5KSR2 datasheet, MC33FS8400G5KSR2 pinout, MC33FS8400G5KSR2 application, or MC33FS8400G5KSR2 equivalent, this device serves as a functional safety–certified power management solution for automotive ADAS subsystems requiring precise sequencing, voltage supervision, fail-safe output activation, and EMC-optimized SMPS synchronization.

Technical Context

The MC33FS8400G5KSR2 implements a hierarchical safety architecture compliant with ISO 26262 ASIL B, featuring dedicated monitoring paths for VCOREMON, VDDIOMON, VMON1–VMON4, and integrated ABIST/LBIST. Its power management core includes a programmable VPRE controller (3.3 V output, 455 kHz forced PWM), BUCK1 with SVS capability, and dual LDOs with independent over/under-voltage detection windows (±12% OV/UV thresholds, 25–45 µs delay).

It supports deterministic power-up sequencing via OTP-configured slots, deep fail-safe autoretry (x15), and external frequency synchronization (FIN/FOUT) to reduce system-level EMI. The device uses a 32-bit SPI or I²C interface with CRC for configuration and status reporting, and includes PSYNC for coordinated operation with external PMICs or second FS85 devices.

Key Specifications

Parameter Value and Actual Design Meaning
Functional Safety Level ASIL B per ISO 26262; qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C)
Input Voltage Range 60 V DC max; supports 12 V and 24 V automotive battery rails with reverse-battery protection diodes required on VSUP1/VSUP2
VPRE Controller Output 3.3 V fixed (OTP-programmed); 455 kHz forced PWM mode; external MOSFET drive (PRE_GHS/PRE_GLS)
BUCK1 Converter 1.25 V / 4.5 A peak; 2.22 MHz switching; soft-start slope 7.81 mV/µs; TSD-triggered shutdown + DFS
LDO Outputs LDO1: 5.0 V / 400 mA; LDO2: 5.0 V / 400 mA; both support independent OV/UV monitoring and slot-based sequencing
Quiescent Current (OFF mode) 10 µA typical; enables ultra-low-power wake-up readiness in vehicle sleep states
Interface & Diagnostics SPI/I²C with CRC; 32-bit register map; PGOOD, RSTB, INTB, FS0B outputs; AMUX analog multiplexer for ADC monitoring

Pinout & Package

MC33FS8400G5KSR2 is housed in a HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank), with exposed thermal pad (EP) connected to GND. Pin compatibility follows the FS84 family pinout; unused pins (e.g., BUCK2/BUCK3 related) are marked N/C in FS8400 variants.

Pin/Terminal Circuit Role Design Meaning
VSUP1 / VSUP2 Main power inputs Accept 60 V DC max; require external reverse-battery diodes; supply internal bias and regulators
PRE_GHS / PRE_GLS VPRE gate drivers Drive external high-side and low-side MOSFETs for VPRE buck stage; support up to 10 A peak
BUCK1_SW / BUCK1_FB BUCK1 switching node & feedback Switching node connects to external inductor; FB pin enables precision 1.25 V regulation with SVS
LDO1 / LDO2 Linear regulator outputs 5.0 V outputs each rated for 400 mA DC; used for MCU I/Os and ADC reference supplies
FS0B Fail-safe output Active-low open-drain signal indicating safety state; asserts during fault or deep fail-safe entry
PGOOD / RSTB Power-good & reset outputs PGOOD confirms all regulated rails in spec; RSTB provides MCU reset with external fault detection capability
SPI/I²C pins (MISO/MOSI/SCLK/CSB, SCL/SDA) Digital control interface Support 32-bit register access with CRC; enable real-time configuration, monitoring, and error logging
VCOREMON / VMON1–VMON4 Analog monitoring inputs Monitor BUCK1 output and up to four external voltages; configurable OV/UV thresholds and deglitch timing

Key Features

Feature Design Value
ASIL B safety architecture Dedicated monitoring circuitry, challenger watchdog, built-in self-test (ABIST/LBIST), and fail-safe output driver meeting ISO 26262 requirements
Multi-rail power sequencing OTP-programmable start/stop slots for VPRE, BUCK1, LDO1, LDO2, enabling deterministic boot order for radar/camera MCUs
EMC optimization SMPS frequency synchronization (FIN/FOUT), spread spectrum, slew rate control, and manual tuning to meet automotive CISPR 25 Class 5
Low-power OFF mode 10 µA typical quiescent current with wake-up detection on WAKE1/WAKE2 pins; supports ISO 11898-2 CAN bus wake capability
Configurable voltage supervision Independent OV/UV monitoring on six channels (VCOREMON, VDDIOMON, VMON1–VMON4) with programmable thresholds and deglitch delays
OTP programmability Factory-programmed configuration (VPRE voltage, BUCK1 output, LDO settings, sequencing slots); engineering-mode emulation supported via GUI

Applications

Radar Sensor Power Management Automotive Camera Module

Use Scenario: Powers NXP S32R274/S32R294 radar SoCs with precise sequencing and safety monitoring.

IC Role / Device Role / Timing Role: System basis chip providing VPRE (3.3 V), BUCK1 (1.25 V core), LDO1/LDO2 (5.0 V I/O), and fail-safe signaling to radar MCU.

Use Value: Enables ASIL B compliance for corner/imaging radar; reduces board area vs discrete PMIC + supervisor solutions.

Use Scenario: Supplies NXP S32V vision processors in mono/stereo camera modules with low-noise, sequenced rails.

IC Role / Device Role / Timing Role: Delivers clean 1.25 V core, 5.0 V I/O, and 5.0 V ADC reference while coordinating startup with image sensor timing.

Use Value: Integrates SVS, PGOOD, and fail-safe output to meet ISO 26262 requirements without external supervisors.

ADAS Domain Controller Infotainment Head Unit

Use Scenario: Manages power for multi-core domain controllers handling sensor fusion and path planning.

IC Role / Device Role / Timing Role: Provides isolated, monitored power domains for CPU clusters, GPU, and communication interfaces (CAN FD, Ethernet).

Use Value: Supports deep fail-safe autoretry (x15) and PSYNC coordination with companion PMICs for scalable domain power architecture.

Use Scenario: Powers infotainment SoCs (e.g., i.MX 8 series) with robust voltage supervision and thermal management.

IC Role / Device Role / Timing Role: Generates stable 5.0 V I/O and 1.25 V core rails; monitors VSUP, VDDIO, and auxiliary supplies via VMON inputs.

Use Value: Eliminates need for discrete voltage supervisors and improves system-level diagnostic coverage for ASIL B compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC applications.

Alternative Part Technical Difference Application Difference Selection Advice
MC33FS8410G3KSR2 Includes BUCK3 (2.3 V / 4.5 A) and optimized for NXP S32R274 radar MCU; adds third SMPS rail and extended VMON capability Targeted at higher-complexity radar systems requiring >2 regulated rails; not pin-compatible due to BUCK3_INQ/BUCK3_FB pin usage Select when radar SoC requires dedicated 2.3 V supply and additional analog monitoring beyond MC33FS8400G5KSR2's 4-channel VMON
MC33FS8510A2KSR2 ASIL D–rated variant with FCCU monitoring, enhanced ABIST, and deeper diagnostic coverage; same pinout but different OTP and safety logic Required for ASIL D domain controllers or safety-critical ADAS functions where end-to-end fault coverage exceeds ASIL B scope Choose for systems demanding full ASIL D decomposition; note that firmware and safety manual integration differs significantly from MC33FS8400G5KSR2

Compared with MC33FS8410G3KSR2 and MC33FS8510A2KSR2, the MC33FS8400G5KSR2 delivers optimal cost-performance balance for ASIL B radar/camera modules-offering essential safety features, minimal bill-of-materials, and proven qualification without over-specifying for lower-integrity applications.

Availability

MC33FS8400G5KSR2 is available at Aetrix Electronics and suitable for automotive radar sensors, vision processing units, and ADAS domain controllers requiring stable component supply, long-term lifecycle support, and AEC-Q100–qualified performance.

Supply support for MC33FS8400G5KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in functional safety and automotive-grade power management.

The FS84 product line delivers ASIL B–certified system basis chips for radar, camera, and infotainment applications-designed to consolidate power, safety, and communication functions into a single AEC-Q100 qualified IC.

FAQ

What is the primary safety certification level of the MC33FS8400G5KSR2?

The MC33FS8400G5KSR2 is certified to ASIL B per ISO 26262 and qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C). It includes dedicated safety mechanisms such as challenger watchdog, ABIST/LBIST, fail-safe output (FS0B), and independent voltage monitoring on VCOREMON, VDDIOMON, and four VMON inputs-all verified in the FS84 family safety manual. MC33FS8400G5KSR2 does not support ASIL D functionality.

Does the MC33FS8400G5KSR2 support external frequency synchronization?

Yes, the MC33FS8400G5KSR2 supports external frequency synchronization via dedicated FIN (input) and FOUT (output) pins. This allows system-level EMI reduction by aligning switching frequencies across multiple SMPS stages-including VPRE, BUCK1, and external converters-without requiring spread-spectrum modulation. The feature is enabled by default and configurable via OTP.

What are the key differences between MC33FS8400G5KSR2 and MC33FS8410G3KSR2?

MC33FS8400G5KSR2 integrates VPRE, BUCK1, LDO1, and LDO2 only, while MC33FS8410G3KSR2 adds BUCK3 (2.3 V / 4.5 A) and is pre-configured for NXP S32R274 radar MCU. MC33FS8410G3KSR2 uses BUCK3_INQ and BUCK3_FB pins not present in MC33FS8400G5KSR2's pinout, making them non-pin-compatible despite shared HVQFN56 packaging.

Can the MC33FS8400G5KSR2 be used in 24 V commercial vehicle applications?

Yes, the MC33FS8400G5KSR2 supports up to 60 V DC input and is explicitly qualified for both 12 V and 24 V automotive applications. Its VSUP1/VSUP2 inputs require external reverse-battery protection diodes, and its thermal design accommodates ambient temperatures up to +125 °C-meeting requirements for under-hood deployment in trucks and buses.

How is the MC33FS8400G5KSR2 configured for power-up sequencing?

The MC33FS8400G5KSR2 uses OTP-programmed power sequencing slots: VPRE starts in Slot 0, BUCK1 in Slot 0, LDO1 in Slot 1, and LDO2 in Slot 1. Sequencing timing is controlled by internal timers (TSlot = 250 µs), and all regulators can be individually enabled/disabled via SPI. No external sequencing IC is needed.

MC33FS8400G5KSR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
56-VFQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
System Basis Chip
Current - Supply:
15mA
Voltage - Supply:
60V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
56-HVQFN (8x8)

MC33FS8400G5KSR2 FAQ

1.How can I place an order for MC33FS8400G5KSR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MC33FS8400G5KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MC33FS8400G5KSR2 reliable?

The price and inventory of MC33FS8400G5KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8400G5KSR2 is usually 5 days.

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MC33FS8400G5KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MC33FS8400G5KSR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MC33FS8400G5KSR2?

For technical support, including MC33FS8400G5KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8400G5KSR2 requirements.

6.How does Aetrix verify that MC33FS8400G5KSR2 is sourced from the original manufacturer or authorized distributors?

All MC33FS8400G5KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8400G5KSR2 meets industry standards.

7.What is the process for return or replacement of MC33FS8400G5KSR2?

All MC33FS8400G5KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8400G5KSR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MC33FS8400G5KSR2 part is unused and in its original packaging.

Return procedure for MC33FS8400G5KSR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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