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NXP Semiconductors MC33FS8410G0KS
- Part No.:
- MC33FS8410G0KS
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8410G0KS.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,314
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Product details
Overview
MC33FS8410G0KS from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating one VPRE synchronous buck controller, one low-voltage integrated synchronous BUCK1 (1.25 V / 4.5 A), one BUCK3 (2.3 V / 4.5 A), a BOOST converter (5.74 V / 1.5 A peak), and two LDOs (LDO1: 3.3 V / 150 mA; LDO2: 5.0 V / 150 mA). It serves as the primary power management and safety monitor for radar modules, particularly those based on NXP S32R274 MCU.
For engineers reviewing the MC33FS8410G0KS datasheet, MC33FS8410G0KS pinout, MC33FS8410G0KS application, or MC33FS8410G0KS equivalent, this device delivers deterministic power sequencing (slot-based startup), fail-safe output (FS0B), SPI/I²C control with CRC, and dual wake-up inputs - all within a HVQFN56 wettable flank package qualified to AEC-Q100 Grade 1.
Technical Context
The MC33FS8410G0KS implements a hierarchical safety architecture with dedicated monitoring circuitry, including VCOREMON, VMON1–VMON4, and a simple watchdog. Its power management state machine supports configurable power-up sequencing across six slots, with BUCK1 assigned to Slot 1, BUCK3 to Slot 0, LDO1 to Slot 2, and LDO2 to Slot 1 - enabling precise timing alignment with MCU boot requirements.
It integrates analog multiplexing (AMUX) for ADC monitoring of internal rails, frequency synchronization I/O (FIN/FOUT) for EMC optimization, and PSYNC for coordinated operation with external PMICs. The device operates across 4.9 V to 60 V input range and enters OFF mode with 10 µA typical quiescent current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4.9 V to 60 V - supports 12 V and 24 V automotive battery systems with reverse-battery protection diode requirement on VSUP1/VSUP2. |
| BUCK1 Output | 1.25 V / 4.5 A peak - dedicated core supply for MCU with DVS soft-start slope of 7.81 mV/µs and TSD-triggered shutdown + DFS. |
| BUCK3 Output | 2.3 V / 4.5 A peak - configurable low-voltage rail with 2.22 MHz switching, phase-shifting delay 0, and power sequencing in Slot 0. |
| LDO1/LDO2 Outputs | 3.3 V / 150 mA and 5.0 V / 150 mA - dual linear regulators for MCU I/O and analog subsystems, each with independent UV/OV monitoring. |
| Safety Certification | ASIL B compliant per ISO 26262 - includes fail-safe output (FS0B), PGOOD/RSTB signals, built-in self-test (ABIST), and dedicated FCCU monitoring inputs. |
| Interface | SPI or I²C (0x20 address) with CRC - enables secure configuration, real-time status readback, and OTP programming during engineering development. |
| Package | HVQFN56 (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, dimple wettable flank) - optimized for thermal dissipation and automated optical inspection (AOI) in automotive PCB assembly. |
Pinout & Package
HVQFN56 plastic thermal enhanced very thin quad flat package with 56 terminals, wettable flank (dimple variant for KS suffix), 0.5 mm pitch, 8 mm × 8 mm body, and exposed thermal pad (EP) connected to GNDFS/GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 WAKE2 | Wake-up input 2 | Analog/digital input with external series resistor required if used as global wake pin; triggers device exit from OFF mode. |
| 14 FS0B | Fail-safe output 0 | Active-low open-drain signal indicating safety state; asserted during fault conditions (TSD, UV, OV, watchdog timeout). |
| 17 VCOREMON | VCORE monitoring input | Must be connected directly to BUCK1 output; enables precise core voltage supervision with 88 % UVTH and 112 % OVTH thresholds. |
| 18 PGOOD | Power good output | Active-low indicator confirming all regulated outputs meet specification; requires external pull-up to VDDIO. |
| 19 RSTB | Reset output | Active-low reset signal for MCU; monitors external reset assertion and internal fault conditions; requires external pull-up to VDDIO. |
| 37 BUCK1_SW | BUCK1 switching node | High-frequency switching output driving external low-side MOSFET in VPRE stage; connects to inductor and bootstrap network. |
| 48 PRE_FB | VPRE feedback & negative current sense | Regulates VPRE output voltage and detects reverse current flow; critical for bidirectional energy management in pre-regulator stage. |
| 57 EP | Exposed thermal pad | Internally connected to BUCK1/BUCK2/BUCK3 low-side GNDs; must be soldered to PCB ground plane for thermal and EMI performance. |
Key Features
| Feature | Design Value |
|---|---|
| Multi-rail power sequencing | Slot-based startup/shutdown (Slots 0–6) ensures deterministic power-up order for MCU, peripherals, and sensors - eliminating race conditions. |
| Fail-safe state machine | Dedicated hardware FSM drives FS0B, PGOOD, and RSTB independently of MCU firmware - enabling safe degradation or shutdown during faults. |
| EMC-optimized SMPS | Frequency synchronization (FIN/FOUT), spread spectrum, and slew rate control reduce conducted/radiated emissions in radar-sensitive environments. |
| Configurable monitoring | Four independent voltage monitors (VMON1–VMON4) with programmable OV/UV thresholds and deglitch times support custom rail supervision schemes. |
| OTP programmability | Factory-programmed configuration (G0 variant) includes fixed BUCK1/BUCK3 voltages, sequencing slots, and safety settings - validated for S32R274 radar use case. |
| Low-power OFF mode | 10 µA typical quiescent current enables extended vehicle sleep-mode operation while retaining wake-up capability via WAKE1/WAKE2. |
Applications
| Radar Power Management | ADAS Domain Controller Supply |
|---|---|
|
Use Scenario: Powers NXP S32R274 radar MCU and RF front-end in corner/imaging radar modules. IC Role / Device Role / Timing Role: Primary SBC providing VPRE (3.3 V), BUCK1 (1.25 V core), BUCK3 (2.3 V), LDO1 (3.3 V), and LDO2 (5.0 V) with synchronized startup. Use Value: Enables ASIL B–compliant power delivery with fail-safe output (FS0B) assertion within 250 µs of detected overvoltage on VCOREMON. |
Use Scenario: Supplies multi-core domain controller (e.g., S32G) requiring isolated, sequenced rails for CPU, GPU, and communication subsystems. IC Role / Device Role / Timing Role: Centralized power manager coordinating BUCK1, BUCK3, LDO1, LDO2, and BOOST outputs across six sequencing slots. Use Value: Eliminates need for discrete supervisors and sequencers - reduces BOM count by ≥4 components while maintaining ISO 26262 traceability. |
| Vision System Power | Infotainment Head Unit Supply |
|
Use Scenario: Powers S32V-based camera ECU with image sensor, ISP, and DDR memory interfaces. IC Role / Device Role / Timing Role: Delivers low-noise LDO1 (3.3 V) for sensor I/O and BUCK3 (2.3 V) for ISP core, with AMUX-enabled rail telemetry. Use Value: Integrated analog mux (AMUX) allows MCU ADC to monitor up to 8 internal voltages without external dividers - saving PCB area and calibration effort. |
Use Scenario: Supplies head unit SoC, display driver, audio codec, and CAN transceiver in infotainment systems. IC Role / Device Role / Timing Role: Provides robust 5.0 V LDO2 for CAN PHY, 3.3 V LDO1 for digital I/O, and BOOST (5.74 V) for display backlight drivers. Use Value: BOOST converter's 1.5 A peak current and 2.22 MHz switching enable compact, low-profile LED driver design with minimal EMI impact on audio circuits. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8410G3KS | Same ASIL B SBC family; differs in OTP configuration: BUCK1 = 1.25 V, BUCK3 = 2.3 V, VPRE = 3.3 V, and TSD behavior (BUCK1 shutdown only). | Targeted specifically for radar with NXP S32R274 MCU - matches reference design voltage and sequencing requirements exactly. | Select G3KS for new S32R274 radar designs requiring factory-validated OTP settings and full documentation traceability. |
| MC33FS8510A2KS | ASIL D–rated variant with identical pinout and feature set; adds FCCU monitoring, ERRMON input, and challenger watchdog - higher safety integrity level. | Required for ASIL D–compliant domain controllers or safety-critical ADAS functions where dual-channel monitoring is mandated. | Choose A2KS when functional safety requirements exceed ASIL B - e.g., for integration into zonal architecture with centralized safety manager. |
Compared with MC33FS8410G0KS, the G3KS offers tighter application alignment for S32R274 radar, while the A2KS provides higher safety certification at the cost of increased complexity and qualification overhead - making G0KS optimal for cost-sensitive ASIL B radar modules.
Availability
MC33FS8410G0KS is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and infotainment head units requiring stable component supply, AEC-Q100 Grade 1 qualification, and ASIL B compliance.
Supply support for MC33FS8410G0KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in radar, vision, and safety-critical microcontrollers.
The FS84 product line delivers ASIL B–certified system basis chips for radar, vision, and domain controller applications - designed to consolidate power management, safety monitoring, and communication interfaces into a single AEC-Q100–qualified IC.
FAQ
What is the primary automotive safety rating of the MC33FS8410G0KS?
The MC33FS8410G0KS is ASIL B–capable and developed in compliance with ISO 26262 for automotive functional safety. It includes dedicated safety features such as fail-safe output (FS0B), power-good (PGOOD), reset (RSTB), voltage monitoring (VCOREMON, VMON1–VMON4), and built-in self-test (ABIST) - all verified per ASIL B requirements in the FS84 family data sheet.
Which MCU platforms is the MC33FS8410G0KS specifically validated for?
The MC33FS8410G0KS is explicitly validated for use with the NXP S32R274 radar MCU, as indicated in Table 2 of the FS84_FS85C datasheet under "Application target" for part number MC33FS8410G3ES/KS. Its OTP configuration (G0) aligns with S32R274 power requirements: BUCK1 = 1.25 V core, BUCK3 = 2.3 V, LDO1 = 3.3 V, LDO2 = 5.0 V, and sequencing slots matched to S32R274 boot timing.
Does the MC33FS8410G0KS support both SPI and I²C interfaces simultaneously?
No, the MC33FS8410G0KS supports either SPI or I²C - not both simultaneously. Interface selection is determined by hardware strapping: SCLK and CSB pins configure SPI mode, while SCL and SDA pins configure I²C mode. The default I²C address is 0x20, and CRC protection is applied to all register accesses regardless of interface selected.
What is the function of the PSYNC pin on the MC33FS8410G0KS?
The PSYNC pin on the MC33FS8410G0KS serves as a bidirectional power synchronization signal. In master mode, it outputs a clock to coordinate switching frequencies with external PMICs; in slave mode, it accepts an external clock to align MC33FS8410G0KS SMPS operation - reducing beat frequencies and improving system-level EMC performance in multi-rail automotive ECUs.
How does the MC33FS8410G0KS handle thermal shutdown events?
Upon thermal shutdown (TSD), the MC33FS8410G0KS disables BUCK1 and asserts the fail-safe output (FS0B) while maintaining LDO1 and LDO2 operation. BUCK1 enters shutdown + DFS (deep fail-safe) mode with infinite retry, and the device remains in fail-safe state until VSUP drops below 4.9 V and re-ramps - ensuring controlled recovery without MCU intervention.
MC33FS8410G0KS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8410G0KS FAQ
1.How can I place an order for MC33FS8410G0KS through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8410G0KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8410G0KS reliable?
The price and inventory of MC33FS8410G0KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8410G0KS is usually 5 days.
3.What payment methods are accepted for MC33FS8410G0KS?
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4.How is shipping managed for MC33FS8410G0KS?
MC33FS8410G0KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8410G0KS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8410G0KS?
For technical support, including MC33FS8410G0KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8410G0KS requirements.
6.How does Aetrix verify that MC33FS8410G0KS is sourced from the original manufacturer or authorized distributors?
All MC33FS8410G0KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8410G0KS meets industry standards.
7.What is the process for return or replacement of MC33FS8410G0KS?
All MC33FS8410G0KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8410G0KS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8410G0KS part is unused and in its original packaging.
Return procedure for MC33FS8410G0KS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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