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NXP Semiconductors MC33FS8410G0KSR2
- Part No.:
- MC33FS8410G0KSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8410G0KSR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:4,640
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Product details
Overview
MC33FS8410G0KSR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one low-voltage integrated synchronous BUCK1 (1.25 V/4.5 A), one BUCK3 (2.3 V/4.5 A), BOOST converter (5.0 V/1.5 A peak), and two LDOs (3.3 V/400 mA and 5.0 V/400 mA). It supports radar and ADAS domain controller power architectures with SPI/I²C control, fail-safe output, and ISO 26262-compliant safety monitoring.
For engineers reviewing the MC33FS8410G0KSR2 datasheet, MC33FS8410G0KSR2 pinout, MC33FS8410G0KSR2 application, or MC33FS8410G0KSR2 equivalent, this page delivers verified specifications, validated pin functions, automotive-grade safety features, and real-world use cases in radar sensor power management, domain controller supply sequencing, and fail-safe MCU reset coordination.
Technical Context
The MC33FS8410G0KSR2 implements a multi-rail power architecture with independent regulation paths: VPRE controls external MOSFETs for high-current pre-regulation; BUCK1 supplies MCU core (1.25 V, 4.5 A peak); BUCK3 delivers 2.3 V at up to 4.5 A; BOOST provides 5.0 V for PHY interfaces; and dual LDOs condition ADC and I/O rails. All regulators support programmable soft-start, thermal shutdown response, and configurable power-up sequencing slots.
Safety logic includes dedicated voltage monitors (VCOREMON, VMON1–VMON4), fail-safe state machine, challenger watchdog, PGOOD/RSTB assertion, and fault recovery via FLT_RECOVERY. The device uses OTP-configured safety parameters-including OV/UV thresholds (e.g., VCOREMON UVTH = 88 %, OVTH = 112 %) and deglitch timing (UV_DGLT = 15 µs)-and supports external IC monitoring via FCCU1/FCCU2 inputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes on VSUP1/VSUP2. |
| VPRE Controller | External synchronous buck controller - enables scalable high-current pre-regulation (e.g., 3.3 V/10 A) using discrete MOSFETs. |
| BUCK1 Output | 1.25 V / 4.5 A peak - dedicated MCU core rail with SVS capability and slot-1 power sequencing. |
| BUCK3 Output | 2.3 V / 4.5 A peak - configurable low-voltage rail for auxiliary processors or sensors; enabled in FS8410 variant. |
| BOOST Output | 5.0 V / 1.5 A peak - powers CAN transceivers or Ethernet PHYs; integrated low-side switch eliminates external FET. |
| LDO1/LDO2 | 3.3 V/400 mA and 5.0 V/400 mA - dual linear regulators for MCU I/O and analog subsystems with independent monitoring. |
| Safety Certification | ASIL B compliant per ISO 26262 - includes fail-safe output (FS0B), PGOOD, RSTB, ABIST, LBIST, and configurable fault recovery. |
Pinout & Package
MC33FS8410G0KSR2 is housed in HVQFN56 (SOT684-23): 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, wettable flank (KS suffix), exposed thermal pad (EP) connected to GNDFS/GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| WAKE1 / WAKE2 | Wake-up input | Dual analog/digital wake sources - enable low-power OFF mode (10 µA quiescent current) with external series resistor for global wake capability. |
| FS0B | Fail-safe output | Active-low open-drain signal - asserts during internal fault or monitored rail failure; drives external safety-critical logic or MCU interrupt. |
| PGOOD / RSTB | Power good / Reset | Active-low outputs - PGOOD indicates all regulated rails are in spec; RSTB resets MCU on supply fault or external reset detection. |
| VCOREMON / VMON1–VMON4 | Voltage monitor inputs | Analog inputs tied to regulated outputs - enable precise OV/UV supervision (e.g., VCOREMON UVTH = 88 %, deglitch = 15 µs) with configurable thresholds. |
| SPI (MISO/MOSI/SCLK/CSB) / I²C (SCL/SDA) | Configuration interface | 32-bit SPI or I²C with CRC - used for OTP programming, real-time register access, fault logging, and dynamic voltage scaling. |
| PSYNC / FIN / FOUT | Frequency sync I/O | Enables synchronized switching across multiple FS84/FS85 devices or external PMICs - reduces system-level EMI through phase alignment and spread spectrum. |
Key Features
| Feature | Design Value |
|---|---|
| Multi-rail SMPS + LDO integration | Reduces bill-of-materials by consolidating VPRE controller, BUCK1/BUCK3/BOOST, and dual LDOs into single die - eliminates discrete regulator ICs and associated passives. |
| Configurable power sequencing | Independent start/stop slots per regulator (e.g., BUCK1 in Slot 1, BUCK3 in Slot 0) - ensures correct boot order for radar SoCs like S32R274 without external sequencer. |
| Fail-safe state machine | Hardware-enforced safety response - asserts FS0B, disables regulators, and triggers RSTB on detected faults (TSD, OV, UV, watchdog timeout), meeting ASIL B requirements. |
| EMC optimization | SMPS frequency synchronization (FIN/FOUT), spread spectrum modulation, and slew rate control - lowers radiated emissions in sensitive radar bands (76–81 GHz). |
| OTP-programmable safety parameters | User-configurable OV/UV thresholds, deglitch timing, and fault recovery behavior - enables custom safety profiles without hardware change or re-spin. |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Supply |
|---|---|
Use Scenario: Powers NXP S32R274 radar MCU and TEF810x RF transceiver in corner radar modules. IC Role / Device Role / Timing Role: Provides BUCK1 (1.25 V core), BUCK3 (2.3 V I/O), BOOST (5.0 V PHY), and LDOs (3.3 V/5.0 V analog) with synchronized startup and fail-safe monitoring. Use Value: Eliminates need for external sequencer and discrete supervisors; FS0B directly disables radar RF section during fault to prevent unsafe emission. | Use Scenario: Supplies central ADAS domain controller with heterogeneous compute (ARM Cortex-A cores, accelerators, memory). IC Role / Device Role / Timing Role: Delivers tightly regulated, sequenced rails (e.g., 1.25 V core, 2.3 V DDR, 5.0 V interface) while monitoring all voltages and asserting RSTB on any rail deviation. Use Value: Enables deterministic boot and runtime safety compliance per ISO 26262 Part 5; PGOOD confirms system readiness before software initialization. |
| Automotive Camera Module | Infotainment Head Unit |
Use Scenario: Powers S32V vision processor and image sensor in mono/stereo camera systems. IC Role / Device Role / Timing Role: Generates BUCK1 (1.25 V core), LDO1 (3.3 V I/O), LDO2 (5.0 V sensor bias) with soft-start ramp rates (7.81 mV/µs) to avoid inrush-induced supply droop. Use Value: Prevents image corruption during power-on; VCOREMON and VMON1 provide real-time core voltage integrity checks for functional safety diagnostics. | Use Scenario: Supplies head unit MCU, display driver, audio codec, and USB-C PD controller. IC Role / Device Role / Timing Role: Manages BUCK1 (1.25 V MCU), BOOST (5.0 V USB-PD sink), LDO1 (3.3 V display interface), and LDO2 (5.0 V audio bias) with independent fault handling. Use Value: Isolates faults per rail - e.g., BOOST overcurrent shuts down only USB-PD path, preserving MCU operation and enabling graceful degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8415G0KSR2 | Includes FCCU (functional safety monitoring unit) and four VMON inputs vs. two in MC33FS8410G0KSR2; same BUCK1/BUCK3/BOOST/LDO configuration. | Required for designs needing MCU error monitoring (FCCU1/FCCU2) and enhanced voltage supervision coverage (VMON3/VMON4). | Select when ASIL B system requires full FCCU-based challenge-response safety checking beyond basic rail monitoring. |
| MC33FS8510A0KSR2 | ASIL D–rated version with identical regulator count and OTP-configurable parameters; adds ERRMON input and deeper fail-safe autoretry (infinite vs. x15). | Targeted at domain controllers requiring end-to-end ASIL D decomposition, not just ASIL B subsystem compliance. | Choose for safety-critical ADAS Level 3+ systems where full ASIL D traceability and fault containment are mandated. |
Compared with MC33FS8410G0KSR2, MC33FS8415G0KSR2 extends safety monitoring breadth (FCCU, extra VMONs) without increasing complexity, while MC33FS8510A0KSR2 upgrades safety integrity to ASIL D with expanded fault recovery and diagnostic depth-making it suitable for higher autonomy tiers.
Availability
MC33FS8410G0KSR2 is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, automotive camera systems, and infotainment head units requiring stable component supply, automotive qualification (AEC-Q100 Grade 1), and long-term lifecycle support.
Supply support for MC33FS8410G0KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in functional safety and automotive-grade power management.
The FS84 product line delivers ASIL B–compliant system basis chips optimized for radar, vision, and domain controller power architectures-integrating multiple SMPS, LDOs, safety monitors, and fail-safe logic in a single package to simplify automotive ECU design.
FAQ
What is the primary safety certification level of the MC33FS8410G0KSR2?
The MC33FS8410G0KSR2 is certified ASIL B per ISO 26262, developed in compliance with the ASIL B process and qualified to AEC-Q100 Grade 1. It includes fail-safe output (FS0B), PGOOD, RSTB, voltage monitors (VCOREMON, VMON1–VMON2), and watchdog functionality to meet automotive functional safety requirements for radar and ADAS subsystems. MC33FS8410G0KSR2 does not support ASIL D; that capability is reserved for the FS85 family.
Which regulators are enabled in the MC33FS8410G0KSR2 configuration?
The MC33FS8410G0KSR2 enables VPRE (external buck controller), BUCK1 (1.25 V/4.5 A core supply), BUCK3 (2.3 V/4.5 A auxiliary rail), BOOST (5.0 V/1.5 A PHY supply), LDO1 (3.3 V/400 mA), and LDO2 (5.0 V/400 mA). BUCK2 is disabled in this FS8410 variant, distinguishing it from FS8420/FS8430 configurations. All enabled regulators support programmable soft-start and power-up sequencing slots.
How does the MC33FS8410G0KSR2 support electromagnetic compatibility (EMC) in radar applications?
The MC33FS8410G0KSR2 supports EMC in radar applications through three integrated techniques: (1) frequency synchronization I/O (FIN/FOUT/PSYNC) to align switching edges across multiple power stages, (2) spread spectrum modulation to reduce peak emissions, and (3) slew rate control on gate drivers (e.g., PRE_GHS/PRE_GLS) to limit dv/dt-induced noise. These features collectively lower radiated emissions in the 76–81 GHz band critical for imaging radar coexistence.
What is the function of the FS0B pin on the MC33FS8410G0KSR2?
The FS0B pin on the MC33FS8410G0KSR2 is an active-low, open-drain fail-safe output that asserts during internal faults (e.g., thermal shutdown, OV/UV violation, watchdog timeout) or monitored rail failures. It connects directly to external safety-critical circuitry-such as radar RF front-end enable/disable logic-to enforce immediate shutdown and prevent unsafe operation. Pull-up to VDDIO is mandatory, and its behavior is controlled by the hardware fail-safe state machine, independent of firmware.
Can the MC33FS8410G0KSR2 be configured via I²C or SPI after power-up?
Yes, the MC33FS8410G0KSR2 supports full runtime configuration via both SPI (32-bit, with CSB/MOSI/MISO/SCLK) and I²C (SCL/SDA, address 0x20) interfaces, including register read/write, fault status polling, dynamic voltage scaling, and safety parameter adjustment. CRC protection is applied to all transactions. OTP programming is performed only once during manufacturing or engineering development using NXP's GUI and socketed evaluation board; customer OTP writes are prohibited for production units.
MC33FS8410G0KSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8410G0KSR2 FAQ
1.How can I place an order for MC33FS8410G0KSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8410G0KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8410G0KSR2 reliable?
The price and inventory of MC33FS8410G0KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8410G0KSR2 is usually 5 days.
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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8410G0KSR2 transactions.
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4.How is shipping managed for MC33FS8410G0KSR2?
MC33FS8410G0KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8410G0KSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8410G0KSR2?
For technical support, including MC33FS8410G0KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8410G0KSR2 requirements.
6.How does Aetrix verify that MC33FS8410G0KSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8410G0KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8410G0KSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8410G0KSR2?
All MC33FS8410G0KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8410G0KSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8410G0KSR2 part is unused and in its original packaging.
Return procedure for MC33FS8410G0KSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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