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NXP Semiconductors MC33FS8410G3ES
- Part No.:
- MC33FS8410G3ES
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8410G3ES.pdf
- Description:
- SYSTEM BASIS CHIP FS8410
- Quantity:
- Payment:
- Shipping:
Inventory:260
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Product details
Overview
MC33FS8410G3ES from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) designed for radar applications with the S32R274 MCU. It integrates a VPRE synchronous buck controller (up to 10 A peak), low-voltage BUCK1 (3.6 A peak, MCU core supply with SVS), BUCK3 (3.6 A peak), BOOST converter (1.5 A peak), two LDOs (400 mA each), and failsafe output FS0B. It operates across 12 V/24 V automotive battery rails up to 60 V DC.
For engineers reviewing the MC33FS8410G3ES datasheet, MC33FS8410G3ES pinout, MC33FS8410G3ES application, or MC33FS8410G3ES equivalent, key selection criteria include ASIL B safety compliance, multi-rail power sequencing for radar SoCs, EMC-optimized frequency synchronization (FIN/FOUT), SPI/I²C configuration, and fail-safe output behavior under fault conditions.
Technical Context
The MC33FS8410G3ES implements a hierarchical power architecture: VPRE handles high-voltage pre-regulation (configurable switching frequency), while BUCK1 supplies the S32R274 MCU core with static voltage scaling (SVS) and VCOREMON monitoring. BUCK3 supports auxiliary radar subsystems, and dual LDOs deliver clean IO/ADC bias. All regulators support programmable startup sequencing via OTP.
Safety logic includes dedicated watchdog, FCCU inputs for MCU error signaling, ERRMON for external IC fault injection, and fail-safe output FS0B (open-drain, active-low) that asserts on internal fault detection or external RSTB assertion. Power state transitions (Normal/Standby/OFF) are controlled via SPI/I²C with <10 µA OFF-mode quiescent current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VSUP1/VSUP2: −0.3 V to 60 V DC - supports jump-start (48 V/15 min) and load dump (58 V) in 24 V systems without external protection. |
| VPRE Controller Output | Configurable output voltage; external MOSFETs; peak current up to 10 A - enables flexible high-efficiency pre-regulation for downstream SMPS. |
| BUCK1 Output | Low-voltage synchronous buck; 3.6 A peak; SVS-capable; VCOREMON feedback - delivers dynamically scaled core voltage to S32R274 with real-time monitoring. |
| BUCK3 Output | Integrated synchronous buck; 3.6 A peak; configurable voltage - powers radar sensor interfaces or auxiliary processing blocks in corner/imaging radar designs. |
| LDO Outputs | 2× linear regulators; 400 mA max each; configurable voltage - supply noise-sensitive MCU IO banks and ADC reference domains independently. |
| Safety Certification | ASIL B compliant per ISO 26262; AEC-Q100 Grade 1 (−40 °C to +125 °C); MSL3 - qualified for under-hood radar ECU deployment. |
| Interface | SPI or I²C (32-bit, CRC-protected); PSYNC for multi-device synchronization - enables deterministic configuration and coordinated timing across PMIC clusters. |
Pinout & Package
MC33FS8410G3ES uses HVQFN56 (SOT684-23) package: 8 mm × 8 mm × 0.85 mm body, 0.5 mm pitch, step-cut wettable flanks, exposed thermal pad (EP). Pin count: 56 terminals + EP. Compatible with automated optical inspection (AOI) and solder joint reliability verification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| WAKE1 / WAKE2 | Wake-up input | Asynchronous wake sources with ±5 mA capability; require external series resistor when used as global pins. |
| FS0B | Fail-safe output | Open-drain, active-low signal asserting on internal fault, external RSTB, or safety state transition - drives external safe-shutdown circuitry. |
| PGOOD / RSTB | Power good / reset output | Active-low outputs with mandatory VDDIO pull-up; RSTB monitors external reset and faults to initiate MCU reset sequence. |
| FIN / FOUT | Freq sync input/output | Enables synchronized switching across multiple MC33FS8410G3ES or mixed FS84/FS85 devices to reduce system-level EMI peaks. |
| PSYNC | Power sync I/O | Allows daisy-chained power sequencing between two FS84 devices or FS84 + external PMIC - ensures deterministic rail enable order. |
| AMUX | Analog multiplexed output | Connects to MCU ADC via SPI/I²C-selectable internal monitoring nodes (VMON1–4, VCOREMON, etc.) - enables centralized health telemetry. |
Key Features
| Feature | Design Value |
|---|---|
| EMC optimization | SMPS frequency synchronization (FIN/FOUT), spread spectrum, slew rate control, and manual tuning - reduces radiated emissions in radar band (76–81 GHz) adjacent bands. |
| Fail-safe partitioning | Dedicated FS0B output, independent monitoring circuitry, and challenger watchdog - fulfills ASIL B safety goals without requiring external safety monitor. |
| OTP configurability | One-time-programmable settings for rail voltages, sequencing order, fault thresholds, and interface mode - eliminates BOM variants and enables project-specific tuning. |
| Low-power OFF mode | 10 µA typical quiescent current at TA < 85 °C - meets automotive "always-on" radar ECU sleep-state requirements. |
| Multi-phase BUCK1+BUCK3 | Static voltage scaling (SVS) and current sharing capability - extends effective core rail current to 7.2 A peak for high-performance radar processing loads. |
Applications
| Radar Sensor Power Management | ADAS Domain Controller Supply |
|---|---|
Use Scenario: Powers NXP S32R274-based corner radar modules requiring precise voltage sequencing, low-noise analog rails, and fail-safe shutdown during collision events. IC Role / Device Role / Timing Role: System basis chip providing VPRE pre-regulation, BUCK1 core supply with SVS, BUCK3 for RF front-end bias, dual LDOs for ADC/IO, and FS0B-triggered safe state activation. Use Value: Enables ASIL B-compliant radar ECU design with integrated safety response, eliminating discrete safety monitor and reducing PCB area by 35% vs. discrete PMIC + monitor solutions. | Use Scenario: Supplies multi-core ADAS domain controllers integrating radar, vision, and vehicle networking, where rail coordination and fault containment are critical. IC Role / Device Role / Timing Role: Centralized power manager delivering sequenced BUCK1 (core), BUCK3 (peripheral), BOOST (CAN transceiver), and LDOs (Ethernet PHY, SerDes) with synchronized FIN/FOUT timing. Use Value: Reduces system-level EMI through synchronized SMPS operation and provides single-point fault isolation via FS0B, preventing cascade failures across sensor fusion domains. |
| Vision Processing Unit (VPU) Support | Automotive Gateway Power Architecture |
Use Scenario: Powers S32V-based mono/stereo camera ECUs needing dynamic core voltage scaling, low-noise image sensor bias, and fast wake-from-sleep response. IC Role / Device Role / Timing Role: Delivers BUCK1 with SVS for VPU core, BUCK3 for ISP voltage, LDOs for MIPI CSI-2 IO and ADC reference, and WAKE1/WAKE2 for motion-triggered activation. Use Value: Achieves <50 µs wake latency and <10 µV RMS output noise on LDO rails - preserves image SNR and enables sub-100 ms boot for driver assistance features. | Use Scenario: Used in gateway ECUs (e.g., MPC5748G-based) managing CAN FD, Ethernet, and LIN networks, requiring robust power integrity and fail-operational behavior. IC Role / Device Role / Timing Role: Provides BUCK1 for MCU core, BOOST for CAN transceivers, LDOs for PHYs, and PSYNC-linked sequencing with secondary PMICs for domain-specific power islands. Use Value: Supports fail-operational gateway operation: FS0B assertion disables non-critical domains while maintaining CAN/LIN communication paths during partial failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fail-safe power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8410G0ES | Same silicon, unprogrammed OTP; requires field programming for custom configurations. | Superset configuration covering FS8410 - lacks radar-specific OTP settings (e.g., S32R274 sequencing, VMONx thresholds). | Select when full OTP customization is needed during development; G3ES offers factory-programmed radar-optimized defaults. |
| MC33FS8510A2ES | ASIL D–rated variant with FCCU support; identical pinout and BUCK/LDO topology but enhanced monitoring circuitry. | Targeted for domain controllers requiring ASIL D decomposition; supports dual FCCU inputs and extended FMEDA coverage. | Choose for higher safety integrity needs; not drop-in due to different safety certification scope and OTP structure. |
Compared with MC33FS8410G0ES, the G3ES delivers validated radar-specific OTP settings out-of-box, reducing qualification time. Against MC33FS8510A2ES, it trades ASIL D certification for lower cost and simpler safety validation-ideal for ASIL B radar endpoints where full decomposition isn't required.
Availability
MC33FS8410G3ES is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, and automotive gateway systems requiring stable component supply, long-term automotive lifecycle support, and ASIL B–compliant power management.
Supply support for MC33FS8410G3ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with leadership in radar, vision, and safety-critical microcontrollers.
The FS84 product line delivers ASIL B–certified system basis chips optimized for radar and vision ECUs using S32R/S32V processors, emphasizing integrated safety, EMC resilience, and programmable power sequencing.
FAQ
What safety standard does MC33FS8410G3ES comply with?
MC33FS8410G3ES complies with ISO 26262 ASIL B functional safety requirements and is qualified per AEC-Q100 Grade 1 (−40 °C to +125 °C). It includes built-in self-test, fail-safe output FS0B, challenger watchdog, and dedicated FCCU inputs for MCU-level error reporting - all verified in the FS84 safety manual (FS84_FS84SMUG).
Does MC33FS8410G3ES support multi-device synchronization?
Yes, MC33FS8410G3ES supports multi-device synchronization via FIN (frequency input) and FOUT (frequency output) pins for SMPS clock alignment, plus PSYNC (power sync) for coordinated power-up sequencing across two MC33FS8410G3ES units or one MC33FS8410G3ES and an external PMIC - critical for EMI reduction in multi-ECU radar systems.
What is the purpose of the FS0B pin on MC33FS8410G3ES?
The FS0B pin on MC33FS8410G3ES is an active-low, open-drain fail-safe output that asserts during internal fault detection (e.g., overtemperature, undervoltage, watchdog timeout), external RSTB assertion, or safety state transition. It drives external safe-shutdown circuitry to isolate power domains and meet ASIL B safe state requirements.
Can MC33FS8410G3ES be used with processors other than NXP S32R274?
Yes, MC33FS8410G3ES is compatible with other automotive MCUs requiring multi-rail power with sequencing and safety features. While its OTP is pre-configured for S32R274 (e.g., VCOREMON routing, wake timing), the SPI/I²C interface allows full reconfiguration for non-NXP processors - confirmed in AN12333 application note.
What package type and mounting features does MC33FS8410G3ES use?
MC33FS8410G3ES uses the HVQFN56 (SOT684-23) package: 8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, with step-cut wettable flanks and exposed thermal pad (EP). This enables reliable AOI inspection, high thermal dissipation (RθJB = 10 °C/W on 2s6p board), and compatibility with standard automotive reflow profiles (MSL3, 260 °C peak).
MC33FS8410G3ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8410G3ES FAQ
1.How can I place an order for MC33FS8410G3ES through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8410G3ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8410G3ES reliable?
The price and inventory of MC33FS8410G3ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8410G3ES is usually 5 days.
3.What payment methods are accepted for MC33FS8410G3ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8410G3ES transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8410G3ES?
MC33FS8410G3ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8410G3ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8410G3ES?
For technical support, including MC33FS8410G3ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8410G3ES requirements.
6.How does Aetrix verify that MC33FS8410G3ES is sourced from the original manufacturer or authorized distributors?
All MC33FS8410G3ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8410G3ES meets industry standards.
7.What is the process for return or replacement of MC33FS8410G3ES?
All MC33FS8410G3ES units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8410G3ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8410G3ES part is unused and in its original packaging.
Return procedure for MC33FS8410G3ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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