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NXP Semiconductors MC33FS8410G3KSR2
- Part No.:
- MC33FS8410G3KSR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8410G3KSR2.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:2,378
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Product details
Overview
MC33FS8410G3KSR2 from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one integrated low-voltage synchronous BUCK1 (1.25 V / 4.5 A), one integrated BUCK3 (2.3 V / 4.5 A), dual LDOs (LDO1: 3.3 V / 150 mA; LDO2: 5.0 V / 150 mA), BOOST converter, and safety monitoring circuitry. It targets radar systems with NXP S32R274 MCU and supports power sequencing, voltage supervision, and fail-safe output activation.
For engineers reviewing the MC33FS8410G3KSR2 datasheet, MC33FS8410G3KSR2 pinout, MC33FS8410G3KSR2 application, or MC33FS8410G3KSR2 equivalent, this page delivers verified functional architecture, OTP-configured regulator settings, safety feature mapping, and radar-specific power management context - all aligned to FS84 family documentation Rev. 12.0 (May 2026).
Technical Context
The MC33FS8410G3KSR2 implements a multi-rail power management architecture with dedicated regulators for MCU core (BUCK1), auxiliary domain (BUCK3), I/O/ADC (LDO1/LDO2), and high-side gate drive (BOOST). Its fail-safe state machine monitors VCOREMON, VMON1–VMON4, and external fault signals via FCCU1/FCCU2, triggering FS0B assertion on violation.
OTP configuration fixes key parameters: BUCK1 = 1.25 V / 4.5 A, BUCK3 = 2.3 V / 4.5 A, LDO1 = 3.3 V / 150 mA, LDO2 = 5.0 V / 150 mA, VPRE = 3.3 V, and watchdog mode = Simple WD. Power-up sequencing assigns BUCK1 to Slot 1, BUCK3 to Slot 0, LDO1 to Slot 2, and LDO2 to Slot 1 per OTP-defined timing slots.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 60 V DC max - supports 12 V and 24 V automotive battery rails with reverse-battery protection diodes required on VSUP1/VSUP2. |
| BUCK1 Output | 1.25 V / 4.5 A peak - dedicated MCU core supply with SVS capability and soft-start slope of 7.81 mV/µs. |
| BUCK3 Output | 2.3 V / 4.5 A peak - auxiliary rail for radar signal processing subsystems, sequenced in Slot 0. |
| LDO1/LDO2 Outputs | 3.3 V / 150 mA and 5.0 V / 150 mA - low-noise supplies for MCU I/Os and analog peripherals; both monitored with OV/UV detection. |
| Safety Certification | ASIL B compliant per ISO 26262 - includes fail-safe output (FS0B), PGOOD/RSTB, built-in self-test (ABIST/LBIST), and dedicated monitoring inputs (FCCU1/FCCU2). |
| Interface & Control | SPI/I2C (I2C address 0x20) with CRC - enables real-time configuration, fault logging, and dynamic voltage scaling control. |
| Thermal & Power Management | OFF mode quiescent current = 10 µA typ; TSD response triggers BUCK1/BUCK3/LDO1/LDO2 shutdown + DFS activation. |
Pinout & Package
MC33FS8410G3KSR2 uses HVQFN56 package (8 mm × 8 mm × 0.85 mm, 0.5 mm pitch, wettable flank), thermally enhanced with exposed pad (EP) connected to GNDFS/GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (WAKE2) | Wake-up input 2 | Asynchronous wake source for low-power sleep exit; requires external series resistor if used as global wake pin. |
| 14 (FS0B) | Fail-safe output 0 | Active-low open-drain output asserting on safety violation; drives external reset or system shutdown logic. |
| 17 (VCOREMON) | MCU core voltage monitor | Direct connection to BUCK1 output for precise SVS; enables overvoltage/undervoltage detection with 45 µs/40 µs delay. |
| 37 (BUCK1_SW) | BUCK1 switching node | High-frequency switching output driving external LC filter; requires low-ESR ceramic output capacitor and proper layout for EMI control. |
| 48 (PRE_FB) | VPRE feedback & current sense | Regulates VPRE = 3.3 V via external MOSFETs; provides negative current sensing for overcurrent protection. |
| 54 (LDO2) | LDO2 output | 5.0 V / 150 mA regulated supply for CAN PHY or external analog components; monitored by VMON2 with 112 % OVTH. |
Key Features
| Feature | Design Value |
|---|---|
| ASIL B Safety Architecture | Integrated fail-safe state machine, ABIST/LBIST, dual watchdog (Simple WD), and dedicated FCCU monitoring inputs ensure compliance with ISO 26262 requirements for radar domain controllers. |
| Radar-Optimized Power Sequencing | OTP-configured slot-based startup (BUCK1 Slot 1, BUCK3 Slot 0, LDO1 Slot 2, LDO2 Slot 1) ensures deterministic power-up order critical for S32R274 MCU initialization and sensor synchronization. |
| EMC Optimization | SMPS frequency synchronization (FIN/FOUT), spread spectrum modulation, and slew rate control reduce radiated emissions in sensitive 77 GHz radar bands. |
| Multi-Rail Fail-Safe Supervision | Independent OV/UV monitoring on VCOREMON, VMON1–VMON4 with programmable thresholds and deglitch times enables granular fault isolation in complex radar subsystems. |
| Flexible Interface Support | SPI/I2C with CRC and configurable addresses (0x20) allows integration into diverse MCU ecosystems while maintaining data integrity during runtime reconfiguration. |
Applications
| Radar Sensor Module | ADAS Domain Controller |
|---|---|
|
Use Scenario: Powering NXP S32R274 MCU and RF front-end in corner radar modules. IC Role / Device Role / Timing Role: Primary SBC delivering core (BUCK1), auxiliary (BUCK3), and interface (LDO2) rails with synchronized startup and fail-safe assertion on voltage faults. Use Value: Enables deterministic boot sequence and immediate fault containment via FS0B, reducing radar false-trigger risk during voltage transients. |
Use Scenario: Supplying multiple voltage domains in centralized ADAS controllers managing camera, radar, and ultrasonic sensors. IC Role / Device Role / Timing Role: Centralized power manager providing isolated, monitored rails with sequencing control and safety-critical reset generation (RSTB/PGOOD). Use Value: Eliminates need for discrete supervisors and sequencers, reducing BOM count and PCB area while meeting ASIL B decomposition requirements. |
| Vision Processing Unit | Automotive Gateway |
|
Use Scenario: Powering image signal processors and MIPI interfaces in mono/stereo camera systems. IC Role / Device Role / Timing Role: Supplies 1.25 V core, 2.3 V I/O, and 3.3 V/5.0 V peripheral rails with independent monitoring and soft-start control. Use Value: Prevents image corruption during power-up by enforcing strict voltage ramp rates (7.81 mV/µs for BUCK1) and detecting brownouts before frame capture begins. |
Use Scenario: Supporting communication stacks (CAN FD, Ethernet) and security modules in vehicle gateway ECUs. IC Role / Device Role / Timing Role: Delivers stable 5.0 V for CAN transceivers and 3.3 V for secure element I/O, with fail-safe output tied to gateway safety state machine. Use Value: Ensures gateway remains in safe state during bus faults or MCU lockup, maintaining network integrity without requiring external safety ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive SBC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8410G6KSR2 | OTP-configured for MPC5748G gateway MCU: BUCK1 = 1.2 V, LDO1 = 1.8 V, LDO2 = 3.3 V, VPRE = 3.3 V, and RSTB enabled. | Targeted at gateway applications with different MCU I/O voltage requirements and reset signaling needs. | Select when designing for NXP MPC5748G-based gateways requiring active RSTB assertion and 1.8 V/3.3 V I/O rails. |
| MC33FS8415GJES | ASIL B SBC with FCCU enabled, VPRE = 3.3 V, BUCK1 = 0.825 V (for S32R294), and dual-phase BUCK1+BUCK2 support up to 7.2 A. | Optimized for higher-performance imaging radar using S32R294 + TEF810x, requiring ultra-low core voltage and multiphase current delivery. | Choose for next-gen 77/79 GHz radar with S32R294 where sub-1 V core supply and >4.5 A current capability are mandatory. |
Compared with MC33FS8410G3KSR2, MC33FS8410G6KSR2 offers gateway-specific OTP settings and RSTB functionality but lacks radar-optimized sequencing; MC33FS8415GJES adds multiphase support and lower core voltage for advanced radar SoCs but increases design complexity and cost.
Availability
MC33FS8410G3KSR2 is available at Aetrix Electronics and suitable for radar sensor modules, ADAS domain controllers, vision processing units, and automotive gateways requiring stable component supply, ASIL B compliance, and NXP S32R274 ecosystem integration.
Supply support for MC33FS8410G3KSR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in automotive, industrial, and IoT solutions, with leadership in secure connectivity and edge processing technologies.
The FS84 product line delivers ASIL B–certified system basis chips for radar, vision, and domain controller applications, emphasizing functional safety, EMC robustness, and seamless integration with NXP's S32R and S32K MCU families.
FAQ
What is the primary application target for the MC33FS8410G3KSR2?
The MC33FS8410G3KSR2 is specifically designed for radar sensor modules using the NXP S32R274 MCU. Its OTP configuration - including BUCK1 at 1.25 V / 4.5 A, BUCK3 at 2.3 V / 4.5 A, and fail-safe output FS0B - aligns with the power, sequencing, and safety requirements of 77 GHz corner radar systems. This makes MC33FS8410G3KSR2 distinct from generic SBCs.
Does the MC33FS8410G3KSR2 support SPI and I2C interfaces simultaneously?
No, the MC33FS8410G3KSR2 supports either SPI or I2C - not both concurrently. The interface is selected at boot via hardware strapping or OTP configuration; its I2C address is fixed at 0x20, and SPI uses standard four-wire protocol (CSB, SCLK, MOSI, MISO) with CRC validation. This single-interface design simplifies routing and reduces MCU pin count in radar ECU designs.
How does the fail-safe output (FS0B) behave under fault conditions?
Under detected faults - such as VCOREMON undervoltage, VMON1–VMON4 violations, or thermal shutdown - the MC33FS8410G3KSR2 asserts FS0B as an active-low open-drain signal. This output directly drives external reset logic or safety relay circuits, ensuring immediate system-level response without MCU intervention. FS0B remains asserted until fault clearance and manual reset or power cycle.
What are the key differences between MC33FS8410G3KSR2 and MC33FS8410G6KSR2?
MC33FS8410G3KSR2 is optimized for S32R274 radar with BUCK1 = 1.25 V and no RSTB output, while MC33FS8410G6KSR2 targets MPC5748G gateways with BUCK1 = 1.2 V, LDO1 = 1.8 V, LDO2 = 3.3 V, and enabled RSTB. Both share ASIL B certification and HVQFN56 packaging, but their OTP configurations and safety signaling differ fundamentally by application.
Is external compensation required for the BUCK1 regulator in MC33FS8410G3KSR2?
Yes, MC33FS8410G3KSR2 requires external compensation components for BUCK1: a 1 µH inductor, 65 GM gain margin network, and soft-start slope of 7.81 mV/µs. These values are fixed by OTP and validated for stability with typical 1.25 V / 4.5 A radar core loads; deviation risks loop instability or poor transient response during MCU clock transitions.
MC33FS8410G3KSR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8410G3KSR2 FAQ
1.How can I place an order for MC33FS8410G3KSR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8410G3KSR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8410G3KSR2 reliable?
The price and inventory of MC33FS8410G3KSR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8410G3KSR2 is usually 5 days.
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4.How is shipping managed for MC33FS8410G3KSR2?
MC33FS8410G3KSR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8410G3KSR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8410G3KSR2?
For technical support, including MC33FS8410G3KSR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8410G3KSR2 requirements.
6.How does Aetrix verify that MC33FS8410G3KSR2 is sourced from the original manufacturer or authorized distributors?
All MC33FS8410G3KSR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8410G3KSR2 meets industry standards.
7.What is the process for return or replacement of MC33FS8410G3KSR2?
All MC33FS8410G3KSR2 units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8410G3KSR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8410G3KSR2 part is unused and in its original packaging.
Return procedure for MC33FS8410G3KSR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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