My Inquiry
My Account
NXP Semiconductors MC33FS8410G6KS
- Part No.:
- MC33FS8410G6KS
- Manufacturer:
- NXP Semiconductors
- Category:
- Power Management - Specialized
- Package:
- 56-VFQFN Exposed Pad
- Datasheet:
-
MC33FS8410G6KS.pdf
- Description:
- SAFETY POWER MANAGEMENT IC, QFN5
- Quantity:
- Payment:
- Shipping:
Inventory:1,435
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MC33FS8410G6KS from NXP Semiconductors is an ASIL B–capable automotive fail-safe system basis chip (SBC) integrating a VPRE synchronous buck controller, one low-voltage integrated synchronous BUCK1 (1.2 V @ 2.6 A), one BUCK3 (1.8 V @ 2.6 A), two LDOs (LDO1 = 1.8 V / 400 mA, LDO2 = 3.3 V / 400 mA), BOOST converter, and safety monitoring circuitry - designed for gateway ECUs using the NXP MPC5748G MCU.
For engineers reviewing the MC33FS8410G6KS datasheet, MC33FS8410G6KS pinout, MC33FS8410G6KS application, or MC33FS8410G6KS equivalent, key selection criteria include its ASIL B safety certification per ISO 26262, OTP-configured power sequencing (BUCK1/BUCK3/LDOs in Slot 0/Slot 0/Slot 2), fail-safe output (FS0B), and support for SPI/I²C with CRC-protected communication.
Technical Context
The MC33FS8410G6KS implements a hierarchical safety architecture with dedicated monitoring paths for VCOREMON (1.2 V), VDDIOMON (3.3 V), VMON1–VMON4, and integrated ABIST/LBIST. Its power management state machine enforces strict power-up sequencing across six configurable slots, with TSD-triggered shutdown + DFS (fail-safe activation) on all regulators except LDO2.
It supports external frequency synchronization via FIN/FOUT pins and includes EMC optimization features: spread spectrum modulation, slew rate control on PRE_GHS/PRE_GLS, and manual frequency tuning. The device uses OTP programming for fixed configuration - no runtime reconfiguration of regulator voltages or sequencing slots.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ASIL Level | ASIL B compliant per ISO 26262; includes challenger watchdog, PGOOD/RSTB outputs, and fail-safe state machine |
| Input Voltage Range | 60 V DC max input; supports 12 V and 24 V automotive battery systems with reverse-battery protection diodes on VSUP1/VSUP2 |
| VPRE Controller | Synchronous buck controller with external MOSFETs; supports up to 10 A peak current and configurable switching frequency |
| BUCK1 Output | 1.2 V @ 2.6 A; dedicated MCU core supply with SVS capability and soft-start slope of 7.81 mV/µs |
| BUCK3 Output | 1.8 V @ 2.6 A; configured to start/stop in Power Sequencing Slot 0; TSD response: shutdown + DFS |
| LDO1 / LDO2 | LDO1 = 1.8 V / 400 mA; LDO2 = 3.3 V / 400 mA; both assigned to VDDIO domain and sequenced in Slot 2 |
| Interface | SPI or I²C (address 0x20); CRC-protected command/data transfer; supports debug mode entry via DBG pin |
| Package | HVQFN56 (8 mm × 8 mm × 0.85 mm); wettable flank (dimple type for KS suffix); exposed thermal pad connected to GNDFS/GND |
Pinout & Package
HVQFN56 package with 56 terminals, 0.5 mm pitch, and exposed thermal pad (EP) connected to GNDFS/GND. Pin 1 = WAKE2; Pin 57 = EP. Dimple-wettable flank (KS suffix) enables reliable solder joint inspection for automotive production.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| WAKE2 (1) | Wake-up input 2 | Asynchronous wake source; requires external series resistor if used as global wake pin |
| BUCK3_INQ (3) | Buck3 quiet input voltage | Low-noise input sensing for Buck3 regulation; improves EMI performance in sensitive domains |
| VDDI2C (4) | I²C buffer supply | Independent 3.3 V supply for I²C logic; decouples I²C noise from main VDDIO rail |
| BOOST_LS (5) | Boost low-side switch | Internal N-channel MOSFET drain; drives external boost inductor to generate 5.0 V VBOOST |
| FS0B (14) | Fail-safe output 0 | Active-low open-drain output; asserts during safety violation or TSD to trigger external fail-safe action |
| PGOOD (18) | Power good indicator | Active-low signal indicating all monitored rails are within tolerance; requires external pull-up to VDDIO |
| RSTB (19) | Reset output | Active-low MCU reset signal; monitors external reset assertion and internal fault conditions |
| FIN / FOUT (20 / 24) | Freq sync input/output | Enables synchronized switching across multiple FS84/FS85 devices to reduce system-level EMI peaks |
| PSYNC (38) | Power sync I/O | Configurable as input or output to coordinate power-up timing between two FS84 devices or FS84 + external PMIC |
| VCOREMON (17) | Core voltage monitor input | Connected directly to BUCK1 output; enables precise over/under-voltage detection with 110 % OVTH / 90 % UVTH |
| LDO1 / LDO2 (55 / 54) | Linear regulator outputs | Provide low-noise 1.8 V and 3.3 V supplies for MCU I/Os and ADC reference; each rated 400 mA continuous |
| EP (57) | Exposed thermal pad | Electrically tied to GNDFS and GND; mandatory PCB connection for thermal dissipation and functional safety grounding |
Key Features
| Feature | Design Value |
|---|---|
| OTP-configured power sequencing | Fixed startup/shutdown order across six slots; eliminates firmware dependency and ensures deterministic boot behavior for ASIL B systems |
| Fail-safe state machine | Dedicated hardware FSM triggers FS0B assertion and disables regulators on detected faults (TSD, OV/UV, watchdog timeout), independent of MCU health |
| EMC-optimized SMPS | Integrated spread spectrum, slew rate control on gate drivers, and FIN/FOUT synchronization reduce conducted/radiated emissions in radar/ADAS bands |
| Dual interface support | SPI (4-wire) and I²C (7-bit address 0x20) with CRC-protected transactions enable robust communication in noisy automotive environments |
| Multi-rail voltage supervision | Monitors VCORE, VDDIO, and four external rails (VMON1–VMON4) with programmable OV/UV thresholds and deglitch times (5–45 µs) |
| Functional safety compliance | Developed per ISO 26262 ASIL B process; qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C ambient) |
Applications
| Automotive Gateway ECU | Radar Sensor Module |
|---|---|
Use Scenario: Central vehicle network gateway managing CAN FD, Ethernet, and LIN communication between domain controllers and body electronics. IC Role / Device Role / Timing Role: Primary power management SBC supplying MPC5748G MCU core (BUCK1), I/Os (LDO1/LDO2), and auxiliary functions (BUCK3); provides fail-safe signaling to chassis controller. Use Value: Enables single-chip power + safety solution for ASIL B gateway designs, reducing BOM count and eliminating discrete supervisor ICs while meeting ISO 26262 diagnostic coverage requirements. | Use Scenario: Front corner radar module using NXP S32R274 MCU requiring tightly regulated, low-noise supplies and synchronized switching to minimize RF interference. IC Role / Device Role / Timing Role: System basis chip delivering BUCK1 (1.025 V for S32R274 core), BUCK3 (1.8 V for interface logic), and LDOs (1.8 V/3.3 V for analog front-end); synchronizes SMPS clocks with adjacent radar chips via FIN/FOUT. Use Value: Reduces system-level EMI by >10 dB through synchronized switching and spread spectrum, enabling compliance with CISPR 25 Class 5 radiated emissions limits without added shielding. |
| Infotainment Head Unit | ADAS Domain Controller |
Use Scenario: High-performance infotainment head unit with multi-core application processor, display driver, and audio codec requiring isolated, sequenced power rails. IC Role / Device Role / Timing Role: Supplies MCU core (BUCK1), memory I/O (LDO1), display interface (LDO2), and auxiliary logic (BUCK3); manages wake-from-sleep via WAKE1/WAKE2 with configurable debounce. Use Value: Supports ultra-low quiescent current (10 µA typ in OFF mode) for always-on connectivity while maintaining fast wake latency (<100 µs) and deterministic power-up sequence. | Use Scenario: Zonal or central ADAS domain controller consolidating camera, radar, and ultrasonic processing with functional safety partitioning. IC Role / Device Role / Timing Role: Provides ASIL B–compliant power and monitoring for safety-critical subsystems (e.g., BUCK1 for safety MCU, LDO2 for sensor interface); feeds fault status to FCCU1/FCCU2 inputs for cross-checking with host MCU. Use Value: Enables modular safety architecture where MC33FS8410G6KS handles power integrity and basic fault detection, allowing host MCU to focus on higher-layer diagnostics and fail-operational strategies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar fail-safe power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33FS8410G3KS | Same FS8410 base; BUCK1 = 1.25 V (vs. 1.2 V), BUCK3 = 2.3 V (vs. 1.8 V); TSD response on BUCK3 is shutdown only (no DFS) | Targeted for radar modules with NXP S32R274; lacks DFS on BUCK3, reducing fail-safe coverage depth | Select MC33FS8410G6KS when full DFS activation across all regulators is required for ASIL B compliance in gateway use cases. |
| MC33FS8510A2KS | FS85 family; ASIL D capable; adds FCCU monitoring and ERRMON input; BUCK1 = 1.025 V; no BUCK3 enabled in this variant | Designed for domain controllers requiring ASIL D decomposition; supports dual-MCU monitoring but omits BUCK3 rail | Choose MC33FS8410G6KS for cost-optimized ASIL B gateway applications where BUCK3 is needed for auxiliary logic, not ASIL D partitioning. |
Compared with MC33FS8410G3KS and MC33FS8510A2KS, the MC33FS8410G6KS uniquely balances ASIL B safety rigor, three integrated SMPS outputs (VPRE + BUCK1 + BUCK3), and OTP-configured sequencing for MPC5748G-based gateways - offering optimal integration without over-specifying for non-domain-controller roles.
Availability
MC33FS8410G6KS is available at Aetrix Electronics and suitable for automotive gateway ECUs, radar sensor modules, and infotainment head units requiring stable component supply, AEC-Q100 Grade 1 qualification, and ISO 26262 ASIL B compliance.
Supply support for MC33FS8410G6KS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The FS84 product line delivers ASIL B–certified system basis chips for automotive gateway and radar applications, emphasizing integrated power management, functional safety, and EMC robustness in compact HVQFN packages.
FAQ
What is the primary safety certification level of the MC33FS8410G6KS?
The MC33FS8410G6KS is certified to ASIL B per ISO 26262, with a fail-safe state machine, challenger watchdog, PGOOD/RSTB outputs, and hardware-enforced power sequencing. It is qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C ambient) and developed using NXP's ASIL B–compliant process flow. This makes MC33FS8410G6KS suitable for automotive gateway and radar applications where ASIL B integrity is required.
Which MCU is the MC33FS8410G6KS specifically configured to support?
The MC33FS8410G6KS is explicitly designated for use with the NXP MPC5748G MCU in automotive gateway applications, as indicated in Table 2 of the datasheet. Its OTP configuration sets BUCK1 to 1.2 V (core supply), LDO1 to 1.8 V and LDO2 to 3.3 V (I/O supplies), and assigns all regulators to specific power sequencing slots compatible with MPC5748G boot requirements.
Does the MC33FS8410G6KS support both SPI and I²C interfaces simultaneously?
No, the MC33FS8410G6KS supports either SPI or I²C - not both simultaneously. Interface selection is determined at power-up by the state of the DBG pin. When DBG is low, SPI mode activates (MISO/MOSI/SCLK/CSB); when high, I²C mode activates (SCL/SDA). Both interfaces implement CRC-protected command/data transfers and share the same register map.
What is the function of the PSYNC pin on the MC33FS8410G6KS?
The PSYNC pin (Pin 38) on the MC33FS8410G6KS serves as a bidirectional power synchronization signal. It can be configured as an input to align the MC33FS8410G6KS power-up timing with another FS84 device, or as an output to drive a second FS84 or external PMIC. This ensures deterministic, jitter-free sequencing across multiple power stages in complex automotive ECUs.
How does the MC33FS8410G6KS handle thermal shutdown events?
Upon thermal shutdown (TSD), the MC33FS8410G6KS initiates a controlled response: BUCK1, BUCK3, LDO1, and LDO2 shut down and assert the fail-safe output (FS0B), while BOOST remains active. The device enters deep fail-safe mode with infinite autoretry attempts. Recovery requires VSUP voltage cycling or external reset assertion on RSTB - ensuring no autonomous restart under unsafe thermal conditions.
MC33FS8410G6KS Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 56-VFQFN Exposed Pad
- Packaging:
- Tray
- Product Status:
- Active
- Applications:
- System Basis Chip
- Current - Supply:
- 15mA
- Voltage - Supply:
- 60V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- 56-HVQFN (8x8)
MC33FS8410G6KS FAQ
1.How can I place an order for MC33FS8410G6KS through Aetrix?
Please submit a Request for Quotation (RFQ) for MC33FS8410G6KS on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MC33FS8410G6KS reliable?
The price and inventory of MC33FS8410G6KS are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MC33FS8410G6KS is usually 5 days.
3.What payment methods are accepted for MC33FS8410G6KS?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MC33FS8410G6KS transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MC33FS8410G6KS?
MC33FS8410G6KS orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MC33FS8410G6KS order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MC33FS8410G6KS?
For technical support, including MC33FS8410G6KS datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MC33FS8410G6KS requirements.
6.How does Aetrix verify that MC33FS8410G6KS is sourced from the original manufacturer or authorized distributors?
All MC33FS8410G6KS products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MC33FS8410G6KS meets industry standards.
7.What is the process for return or replacement of MC33FS8410G6KS?
All MC33FS8410G6KS units undergo pre-shipment inspection (PSI). If there is an issue with MC33FS8410G6KS, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MC33FS8410G6KS part is unused and in its original packaging.
Return procedure for MC33FS8410G6KS:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MC33FS8410G6KS Tags
-
TPS2511DGNR
Texas Instruments
-
UTC2000/MG
Microchip Technology
-
TUSB320HAIRWBR
Texas Instruments
-
TPS61252DSGR
Texas Instruments
-
PI5USB30216CXUAEX
Diodes Incorporated
-
SN6501DBVR
Texas Instruments
-
CYPD3177-24LQXQT
Infineon Technologies
-
SN6501QDBVRQ1
Texas Instruments
-
STUSB1600AQTR
STMicroelectronics
-
SN6505BDBVR
Texas Instruments
-
SN6501DBVT
Texas Instruments
-
TPS65150PWPR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
